Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC FLASH 256GBIT 52VLGA
|
pacchetto: 52-VLGA |
Azione5.312 |
|
FLASH | FLASH - NAND | 256Gb (32G x 8) | Parallel | - | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 52-VLGA | 52-VLGA (18x14) |
||
Micron Technology Inc. |
IC FLASH 16GBIT 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione17.220 |
|
FLASH | FLASH - NAND | 16Gb (2G x 8) | Parallel | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
Cypress Semiconductor Corp |
IC NVSRAM 256KBIT 25NS 32SOIC
|
pacchetto: 32-SOIC (0.295", 7.50mm Width) |
Azione6.720 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-SOIC (0.295", 7.50mm Width) | 32-SOIC |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 8NS 119BGA
|
pacchetto: 119-BGA |
Azione5.632 |
|
SRAM | SRAM - Synchronous | 4.5Mb (128K x 36) | Parallel | - | - | 8ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 119-BGA | 119-PBGA (14x22) |
||
Micron Technology Inc. |
IC FLASH 128MBIT 50NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione6.336 |
|
FLASH | FLASH - NAND | 128Mb (16M x 8) | Parallel | - | 50ns | 50ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione5.952 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC OTP 1MBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione309.480 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
IDT, Integrated Device Technology Inc |
IC SRAM 128KBIT 65NS 100FBGA
|
pacchetto: 100-TFBGA |
Azione2.816 |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kb (8K x 16) | Parallel | - | 65ns | 65ns | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 100-TFBGA | 100-CABGA (6x6) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 512MBIT 133MHZ 90BGA
|
pacchetto: 90-TFBGA |
Azione4.224 |
|
DRAM | SDRAM - Mobile | 512Mb (16M x 32) | Parallel | 133MHz | - | 6ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 90-TFBGA | 90-TFBGA (8x13) |
||
Cypress Semiconductor Corp |
MICROPOWER SRAMS
|
pacchetto: - |
Azione6.496 |
|
SRAM | SRAM - Asynchronous | 8Mb (1M x 8) | Parallel | - | 45ns | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 16KBIT 45NS 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione7.264 |
|
SRAM | SRAM - Dual Port, Asynchronous | 16Kb (2K x 8) | Parallel | - | 45ns | 45ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
Alliance Memory, Inc. |
IC SRAM 2MBIT 12NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione5.952 |
|
SRAM | SRAM - Asynchronous | 2Mb (128K x 16) | Parallel | - | 12ns | 12ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Alliance Memory, Inc. |
IC SRAM 1MBIT 15NS 32SOJ
|
pacchetto: 32-BSOJ (0.400", 10.16mm Width) |
Azione4.336 |
|
SRAM | SRAM - Asynchronous | 1Mb (128K x 8) | Parallel | - | 15ns | 15ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-BSOJ (0.400", 10.16mm Width) | 32-SOJ |
||
Microchip Technology |
IC EEPROM 4KBIT 4MHZ M2P
|
pacchetto: M2 P, Smart Card Module (TWI) |
Azione5.904 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 4MHz | 5ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | M2 P, Smart Card Module (TWI) | M2 - P Module (TWI) |
||
STMicroelectronics |
IC EEPROM 1KBIT 5MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione135.828 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Macronix |
IC FLASH 1GBIT
|
pacchetto: - |
Azione2.416 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC FLASH 256M PARALLEL 64BGA
|
pacchetto: 64-LBGA |
Azione3.968 |
|
FLASH | FLASH - NOR | 256Mb (16M x 16) | Parallel | - | 60ns | 100ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (13x11) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 18M PARALLEL 165TFBGA
|
pacchetto: 165-TBGA |
Azione6.512 |
|
SRAM | SRAM - Synchronous | 18Mb (512K x 36) | Parallel | 133MHz | - | 6.5ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 165-TBGA | 165-TFBGA (13x15) |
||
Winbond Electronics |
IC DRAM 1G PARALLEL 96WBGA
|
pacchetto: 96-TFBGA |
Azione3.216 |
|
DRAM | SDRAM - DDR3 | 1Gb (64M x 16) | Parallel | 933MHz | - | 20ns | 1.425V ~ 1.575V | 0°C ~ 85°C (TC) | Surface Mount | 96-TFBGA | 96-WBGA (9x13) |
||
Renesas Electronics Corporation |
QDR SRAM, 1MX36, 0.45NS
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Alliance Memory, Inc. |
IC DRAM 4GBIT POD 96FBGA
|
pacchetto: - |
Azione2.880 |
|
DRAM | SDRAM - DDR4 | 4Gbit | POD | 1.333 GHz | 15ns | 18 ns | 1.14V ~ 1.26V | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (7.5x13) |
||
Micron Technology Inc. |
LPDDR4 16GBIT 16 200/264 TFBGA 1
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 16Gbit | Parallel | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V | -40°C ~ 105°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |
||
Infineon Technologies |
IC FLSH RAM 128MBIT PAR 56VFRBGA
|
pacchetto: - |
Request a Quote |
|
FLASH, RAM | FLASH, PSRAM | 128Mbit (FLASH), 32Mbit (RAM) | Parallel | 108 MHz | - | - | 1.7V ~ 1.95V | -25°C ~ 85°C (TA) | Surface Mount | 56-VFBGA | 56-VFRBGA (7.7x6.2) |
||
Flexxon Pte Ltd |
IC FLASH 64GBIT EMMC 153FBGA
|
pacchetto: - |
Azione231 |
|
FLASH | FLASH - NAND (pSLC) | 64Gbit | eMMC | 200 MHz | - | - | 2.7V ~ 3.6V | -25°C ~ 85°C | Surface Mount | 153-VFBGA | 153-FBGA (11.5x13) |
||
Micron Technology Inc. |
LPDDR5 64GBIT 64 561/570 TFBGA 4
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Etron Technology, Inc. |
IC DRAM 512MBIT PAR 54TSOP II
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM | 512Mbit | Parallel | 200 MHz | 10ns | 4.5 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Micron Technology Inc. |
LPDDR4 64G 1GX64 FBGA QDP
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Winbond Electronics |
IC DRAM 4GBIT LVSTL 11 200WFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 4Gbit | LVSTL_11 | 1.866 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) |