Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics |
IC SDRAM 64MBIT 200MHZ 66TSOP
|
pacchetto: 66-TSSOP (0.400", 10.16mm Width) |
Azione5.440 |
|
DRAM | SDRAM - DDR | 64Mb (4M x 16) | Parallel | 200MHz | 15ns | 55ns | 2.3 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP II |
||
Cypress Semiconductor Corp |
IC SRAM 36MBIT 600MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione7.568 |
|
SRAM | SRAM - Synchronous, QDR II | 36Mb (1M x 36) | Parallel | 600MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
Microchip Technology |
IC EEPROM 8KBIT 20MHZ 8MINIMAP
|
pacchetto: 8-UFDFN Exposed Pad |
Azione5.472 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-Mini Map (2x3) |
||
Micron Technology Inc. |
IC SDRAM 128MBIT 143MHZ 86TSOP
|
pacchetto: 86-TFSOP (0.400", 10.16mm Width) |
Azione84.384 |
|
DRAM | SDRAM | 128Mb (4M x 32) | Parallel | 143MHz | 14ns | 5.5ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 86-TFSOP (0.400", 10.16mm Width) | 86-TSOP II |
||
Cypress Semiconductor Corp |
SYNC SRAMS
|
pacchetto: - |
Azione5.776 |
|
SRAM | SRAM - Synchronous, QDR IV | 72Mb (4M x 18) | Parallel | 1066MHz | - | - | 1.26 V ~ 1.34 V | 0°C ~ 70°C (TA) | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 18MBIT 166MHZ 119BGA
|
pacchetto: 119-BGA |
Azione2.272 |
|
SRAM | SRAM - Synchronous ZBT | 18Mb (1M x 18) | Parallel | 166MHz | - | 3.5ns | 2.375 V ~ 2.625 V | 0°C ~ 70°C (TA) | Surface Mount | 119-BGA | 119-PBGA (14x22) |
||
Micron Technology Inc. |
IC SDRAM 512MBIT 533MHZ 134VFBGA
|
pacchetto: 134-VFBGA |
Azione6.272 |
|
DRAM | SDRAM - Mobile LPDDR2 | 512Mb (16M x 32) | Parallel | 533MHz | - | - | 1.14 V ~ 1.95 V | -40°C ~ 105°C (TC) | Surface Mount | 134-VFBGA | 134-VFBGA (10x11.5) |
||
Microchip Technology |
IC EEPROM 16KBIT 400KHZ 8DFN
|
pacchetto: 8-VFDFN Exposed Pad |
Azione7.872 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x3) |
||
Alliance Memory, Inc. |
IC SDRAM 2GBIT 400MHZ 60BGA
|
pacchetto: 60-TFBGA |
Azione4.672 |
|
DRAM | SDRAM - DDR2 | 2Gb (256M x 8) | Parallel | 400MHz | 15ns | 57.5ns | 1.7 V ~ 1.9 V | -40°C ~ 95°C (TC) | Surface Mount | 60-TFBGA | 60-FBGA (8x10) |
||
Microchip Technology |
IC EEPROM 64KBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione16.044 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 6.0 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 128KBIT 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione30.000 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 1MHz | 5ms | 400ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 1KBIT 3MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione38.724 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Alliance Memory, Inc. |
IC SRAM 64KBIT 70NS 28SOP
|
pacchetto: 28-SOIC (0.330", 8.38mm Width) |
Azione46.560 |
|
SRAM | SRAM - Asynchronous | 64Kb (8K x 8) | Parallel | - | 70ns | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.330", 8.38mm Width) | 28-SOP |
||
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione6.864 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Cypress Semiconductor Corp |
IC FLASH 256M SPI 133MHZ 24BGA
|
pacchetto: 24-TBGA |
Azione7.680 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI - Quad I/O | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-BGA (8x6) |
||
Winbond Electronics |
IC FLASH 16M SPI 104MHZ 8SWSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione5.760 |
|
FLASH | FLASH - NOR | 16Mb (2M x 8) | SPI | 104MHz | 3ms | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 256MBIT SPI/QUAD 16SOP
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 256Mbit | SPI - Quad I/O | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOP |
||
Kingston Technology |
IC DRAM 4GBIT PAR 96FBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 4Gbit | Parallel | 933 MHz | - | 20 ns | 1.283V ~ 1.45V | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (7.5x13.5) |
||
Infineon Technologies |
IC FLASH 1GBIT SPI/QUAD 16SOIC
|
pacchetto: - |
Azione675 |
|
FLASH | FLASH - NOR | 1Gbit | SPI - Quad I/O, QPI | 166 MHz | - | - | 1.7V ~ 2V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
ISSI, Integrated Silicon Solution Inc |
Automotive (Tc: -40 to +95C), 2G
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 2Gbit | LVSTL | 1.6 GHz | - | - | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 95°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |
||
Infineon Technologies |
IC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
IC EEPROM 256KBIT PAR 28TSOP I
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 256Kbit | Parallel | - | 10ms | 85 ns | 2.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP I |
||
Winbond Electronics |
IC FLASH 512MBIT SPI 24TFBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 512Mbit | SPI - Quad I/O | 166 MHz | 700µs | 7 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
onsemi |
IC EEPROM 1KBIT MICROWIRE 8UDFN
|
pacchetto: - |
Azione9.000 |
|
EEPROM | EEPROM | 1Kbit | Microwire | 2 MHz | - | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Swissbit |
IC FLASH 512GBIT EMMC 153BGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (TLC) | 512Gbit | eMMC | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C | Surface Mount | 153-TFBGA | 153-BGA (11.5x13) |
||
Cypress Semiconductor Corp |
IC SRAM 4MBIT PARALLEL 44TSOP II
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 4Mbit | Parallel | - | 15ns | 15 ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Renesas Electronics Corporation |
72801L15PFG
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
Automotive (Tc: -40 to +95C), 4G
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 4Gbit | Parallel | 800 MHz | - | - | - | -40°C ~ 85°C | Surface Mount | 96-TFBGA | 96-TWBGA (9x13) |