Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC SRAM 18MBIT 250MHZ 165CABGA
|
pacchetto: 165-TBGA |
Azione7.984 |
|
SRAM | SRAM - Synchronous, DDR II | 18Mb (1M x 18) | Parallel | 250MHz | - | 6.3ns | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
Cypress Semiconductor Corp |
IC SRAM 8MBIT 10NS 36FBGA
|
pacchetto: 36-FBGA |
Azione5.856 |
|
SRAM | SRAM - Asynchronous | 8Mb (1M x 8) | Parallel | - | 10ns | 10ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 36-FBGA | 36-FBGA (7x8.5) |
||
Micron Technology Inc. |
IC SDRAM 64MBIT 133MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione7.216 |
|
DRAM | SDRAM | 64Mb (16M x 4) | Parallel | 133MHz | 15ns | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Micron Technology Inc. |
IC SDRAM 512MBIT 200MHZ 60FBGA
|
pacchetto: 60-TFBGA |
Azione5.856 |
|
DRAM | SDRAM - DDR | 512Mb (32M x 16) | Parallel | 200MHz | 15ns | 700ps | 2.5 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 60-TFBGA | 60-FBGA (10x12.5) |
||
Micron Technology Inc. |
IC SDRAM 256MBIT 133MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione7.344 |
|
DRAM | SDRAM | 256Mb (32M x 8) | Parallel | 133MHz | 15ns | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Microchip Technology |
IC FLASH 256KBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione2.560 |
|
FLASH | FLASH | 256Kb (32K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 300NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione3.824 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 133MHZ 208CABGA
|
pacchetto: 208-LFBGA |
Azione2.064 |
|
SRAM | SRAM - Dual Port, Synchronous | 4.5Mb (256K x 18) | Parallel | 133MHz | - | 4.2ns | 2.4 V ~ 2.6 V | -40°C ~ 85°C (TA) | Surface Mount | 208-LFBGA | 208-CABGA (15x15) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 64KBIT 20NS 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione6.720 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (8K x 8) | Parallel | - | 20ns | 20ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
Microchip Technology |
IC FLASH 8MBIT 50MHZ 8TDFN
|
pacchetto: 8-WDFN Exposed Pad |
Azione2.016 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI | 50MHz | 10µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 16MBIT 143MHZ 50TSOP
|
pacchetto: 50-TSOP (0.400", 10.16mm Width) |
Azione5.472 |
|
DRAM | SDRAM | 16Mb (1M x 16) | Parallel | 143MHz | - | 5.5ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 50-TSOP (0.400", 10.16mm Width) | 50-TSOP II |
||
Microchip Technology |
IC EERAM 4KBIT 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.528 |
|
EERAM | EEPROM, SRAM | 4Kb (512 x 8) | I2C | 1MHz | 1ms | 400ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Cypress Semiconductor Corp |
IC SRAM 36MBIT 250MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione6.504 |
|
SRAM | SRAM - Synchronous, DDR II | 36Mb (2M x 18) | Parallel | 250MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
Cypress Semiconductor Corp |
IC SRAM 4MBIT 55NS 48VFBGA
|
pacchetto: 48-VFBGA |
Azione9.192 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 55ns | 55ns | 1.65 V ~ 2.2 V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFBGA | 48-VFBGA (6x8) |
||
Micron Technology Inc. |
IC DRAM 4G PARALLEL 1.2GHZ
|
pacchetto: 96-TFBGA |
Azione5.744 |
|
DRAM | SDRAM - DDR4 | 4Gb (256M x 16) | Parallel | 1.2GHz | - | - | 1.14 V ~ 1.26 V | -40°C ~ 125°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (14x9) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 18M PARALLEL 165TFBGA
|
pacchetto: 165-TBGA |
Azione6.704 |
|
SRAM | SRAM - Synchronous | 18Mb (512K x 36) | Parallel | 200MHz | - | 3.1ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 165-TBGA | 165-TFBGA (13x15) |
||
Micron Technology Inc. |
IC SDRAM DDR4 8G 96FBGA
|
pacchetto: 96-TFBGA |
Azione4.160 |
|
DRAM | SDRAM - DDR4 | 8Gb (512M x 16) | Parallel | 1.6GHz | 15ns | 19ns | 1.14V ~ 1.26V | -40°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (7.5x13.5) |
||
Micron Technology Inc. |
IC SDRAM DDR 512M 60FBGA
|
pacchetto: 60-TFBGA |
Azione4.512 |
|
DRAM | SDRAM - DDR | 512M (32M x 16) | Parallel | 200MHz | 15ns | 700ps | 2.5V ~ 2.7V | -40°C ~ 85°C (TA) | Surface Mount | 60-TFBGA | 60-FBGA (8x12.5) |
||
Winbond Electronics |
SPIFLASH, 512M-BIT, 4KB UNIFORM
|
pacchetto: 8-WDFN Exposed Pad |
Azione5.856 |
|
FLASH | FLASH - NOR | 512Mb (64M x 8) | SPI - Quad I/O | 133MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
||
Fairchild Semiconductor |
IC EEPROM 2KBIT MICROWIRE 8SOIC
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 2Kbit | Microwire | 1 MHz | 10ms | - | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Infineon Technologies |
IC GATE NOR
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
STD SPI
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 256Mbit | SPI - Quad I/O | 133 MHz | 750µs | 6.5 ns | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Micron Technology Inc. |
DDR5 16G 1GX16 FBGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Silicon Motion, Inc. |
IC 153BGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Winbond Electronics |
IC DRAM 4GBIT LVSTL 11 200WFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 4Gbit | LVSTL_11 | 1.6 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) |
||
Renesas Electronics Corporation |
IC RAM DUAL PORT
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Dual Port, Asynchronous | 512Kbit | LVTTL | - | 12ns | 12 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Alliance Memory, Inc. |
32G EMMC BGA 153 (-45-85C)
|
pacchetto: - |
Azione372 |
|
FLASH | FLASH - NAND (TLC) | 256Gbit | eMMC_5.1 | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 153-TFBGA | 153-FBGA (11.5x13) |
||
Insignis Technology Corporation |
SDR 64MB X16 TSOPII 54L 10X22(X1
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM | 64Mbit | LVTTL | 200 MHz | - | 4.5 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |