Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC SDRAM 12GBIT 533MHZ 168VFBGA
|
pacchetto: 168-VFBGA |
Azione6.448 |
|
DRAM | SDRAM - Mobile LPDDR2 | 12Gb (384M x 32) | Parallel | 533MHz | - | - | 1.14 V ~ 1.95 V | -30°C ~ 85°C (TC) | Surface Mount | 168-VFBGA | 168-FBGA (12x12) |
||
Micron Technology Inc. |
IC SDRAM 4GBIT 800MHZ 96FBGA
|
pacchetto: 96-TFBGA |
Azione3.872 |
|
DRAM | SDRAM - DDR3L | 4Gb (256M x 16) | Parallel | 800MHz | - | 13.75ns | 1.283 V ~ 1.45 V | -40°C ~ 105°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (9x14) |
||
Micron Technology Inc. |
IC FLASH PSRAM 96M
|
pacchetto: - |
Azione2.704 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Macronix |
IC FLASH 64MBIT 104MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione17.040 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI | 104MHz | 300µs, 5ms | - | 1.65 V ~ 2 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Cypress Semiconductor Corp |
IC SRAM 9MBIT 200MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione6.272 |
|
SRAM | SRAM - Synchronous | 9Mb (256K x 36) | Parallel | 200MHz | - | 3.2ns | 2.375 V ~ 2.625 V | -40°C ~ 85°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
STMicroelectronics |
IC EEPROM 512KBIT 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione7.872 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 1MHz | 10ms | 500ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Cypress Semiconductor Corp |
IC SRAM 36MBIT 250MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione7.408 |
|
SRAM | SRAM - Synchronous, QDR II | 36Mb (1M x 36) | Parallel | 250MHz | - | - | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (15x17) |
||
Cypress Semiconductor Corp |
IC SRAM 2MBIT 70NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione2.784 |
|
SRAM | SRAM - Asynchronous | 2Mb (128K x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Micron Technology Inc. |
IC SDRAM 128MBIT 125MHZ 54VFBGA
|
pacchetto: 54-VFBGA |
Azione7.760 |
|
DRAM | SDRAM - Mobile LPSDR | 128Mb (8M x 16) | Parallel | 125MHz | 15ns | 7ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-VFBGA | 54-VFBGA (8x8) |
||
Maxim Integrated |
IC NVSRAM 1MBIT 100NS 34LPM
|
pacchetto: 34-LPM |
Azione5.984 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 1Mb (128K x 8) | Parallel | - | 100ns | 100ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 34-LPM | 34-LPM |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 4MBIT 200MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione6.640 |
|
SRAM | SRAM - Synchronous | 4Mb (128K x 32) | Parallel | 200MHz | - | 3.1ns | 3.135 V ~ 3.465 V | -40°C ~ 125°C (TA) | Surface Mount | 100-LQFP | 100-LQFP (14x20) |
||
Microchip Technology |
IC EEPROM 32KBIT 400KHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione6.208 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 2KBIT 2MHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione4.416 |
|
EEPROM | EEPROM | 2Kb (128 x 16) | SPI | 2MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC EEPROM 4KBIT 3MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione8.136 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 512KBIT 400KHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione51.540 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione5.392 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP
|
pacchetto: 28-CDIP (0.600", 15.24mm) |
Azione2.928 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
||
Cypress Semiconductor Corp |
IC FLASH 512M PARALLEL 64FBGA
|
pacchetto: 64-LBGA |
Azione4.752 |
|
FLASH | FLASH - NOR | 512Mb (32M x 16) | Parallel | - | 60ns | 110ns | 2.7 V ~ 3.6 V | 0°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (9x9) |
||
Winbond Electronics |
IC SDRAM DDR3L 2G 78WBGA
|
pacchetto: 78-VFBGA |
Azione7.312 |
|
DRAM | SDRAM - DDR3L | 2Gb (256M x 8) | Parallel | 1.067GHz | 15ns | 20ns | 1.283V ~ 1.45V | 0°C ~ 95°C (TC) | Surface Mount | 78-VFBGA | 78-VFBGA (8x10.5) |
||
Micron Technology Inc. |
LPDDR5 64G 1GX64 FBGA Y42M
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC SRAM 4MBIT PARALLEL 44TSOP II
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 4Mbit | Parallel | - | 70ns | 70 ns | 2.2V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
GSI Technology Inc. |
IC SRAM 72MBIT PARALLEL 165FPBGA
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Quad Port, Synchronous | 72Mbit | Parallel | 500 MHz | - | - | 1.7V ~ 1.9V | -40°C ~ 100°C (TJ) | Surface Mount | 165-LBGA | 165-FPBGA (15x13) |
||
GigaDevice Semiconductor (HK) Limited |
LINEAR IC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 2Gbit | ONFI | - | 20ns | 18 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
Winbond Electronics |
IC DRAM 256MBIT HSUL 12 134VFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR2-S4B | 256Mbit | HSUL_12 | 533 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | Surface Mount | 134-VFBGA | 134-VFBGA (10x11.5) |
||
Infineon Technologies |
IC SRAM ASYNC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Intelligent Memory Ltd. |
LPDDR4X 16GB 512MX32 2133MHZ FBG
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 16Gbit | Parallel | 2.133 GHz | 18ns | - | 1.17V ~ 1.06V, 1.95V ~ 1.7V | -25°C ~ 85°C (TC) | Surface Mount | 200-VFBGA | 200-FBGA (10x15) |
||
Micron Technology Inc. |
SPECIAL/CUSTOM MCP PLASTIC MISC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
TLC 16T 2TX8 FBGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |