Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Toshiba Semiconductor and Storage |
IC EEPROM 2GBIT 25NS 67VFBGA
|
pacchetto: 67-VFBGA |
Azione7.808 |
|
EEPROM | EEPROM - NAND | 2Gb (256M x 8) | Parallel | - | 25ns | 25ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 67-VFBGA | 67-VFBGA (6.5x8) |
||
Micron Technology Inc. |
IC FLASH 4MBIT 55NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione5.040 |
|
FLASH | FLASH - NOR | 4Mb (512K x 8, 256K x 16) | Parallel | - | 55ns | 55ns | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
ISSI, Integrated Silicon Solution Inc |
IC FLASH 8MBIT 104MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione4.256 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8) | SPI | 104MHz | 700µs | - | 1.65 V ~ 1.95 V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 450MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione3.744 |
|
SRAM | SRAM - Synchronous, QDR II+ | 72Mb (2M x 36) | Parallel | 450MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
Cypress Semiconductor Corp |
IC SRAM 4.5MBIT 133MHZ 100LQFP
|
pacchetto: 100-LQFP |
Azione5.808 |
|
SRAM | SRAM - Synchronous | 4.5Mb (256K x 18) | Parallel | 133MHz | - | 4ns | 3.135 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 150MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione2.752 |
|
SRAM | SRAM - Synchronous | 9Mb (512K x 18) | Parallel | 150MHz | - | 3.8ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 1MBIT 12NS 32SOJ
|
pacchetto: 32-BSOJ (0.300", 7.62mm Width) |
Azione5.120 |
|
SRAM | SRAM - Asynchronous | 1Mb (128K x 8) | Parallel | - | 12ns | 12ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-BSOJ (0.300", 7.62mm Width) | 32-SOJ |
||
Micron Technology Inc. |
IC FLASH 4MBIT 33MHZ 32TSOP
|
pacchetto: 32-TFSOP (0.488", 12.40mm Width) |
Azione2.480 |
|
FLASH | FLASH - NOR | 4Mb (512K x 8) | Parallel | 33MHz | - | 250ns | 3 V ~ 3.6 V | -20°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-TSOP (8x14) |
||
Micron Technology Inc. |
IC SDRAM 128MBIT 125MHZ 90VFBGA
|
pacchetto: 90-VFBGA |
Azione5.552 |
|
DRAM | SDRAM - Mobile LPSDR | 128Mb (4M x 32) | Parallel | 125MHz | 15ns | 7ns | 2.3 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 90-VFBGA | 90-VFBGA (8x13) |
||
Microchip Technology |
IC FLASH 1MBIT 45NS 32VSOP
|
pacchetto: 32-TFSOP (0.488", 12.40mm Width) |
Azione6.656 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 50µs | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-VSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 200NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione3.024 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 1ms | 200ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 633MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione5.072 |
|
SRAM | SRAM - Synchronous, QDR II+ | 72Mb (2M x 36) | Parallel | 633MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 100MHZ 165CABGA
|
pacchetto: 165-TBGA |
Azione3.808 |
|
SRAM | SRAM - Synchronous ZBT | 9Mb (512K x 18) | Parallel | 100MHz | - | 5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 4.5MBIT 200MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione5.184 |
|
SRAM | SRAM - Synchronous | 4.5Mb (256K x 18) | Parallel | 200MHz | - | 3.1ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
Microchip Technology |
IC FLASH 16MBIT 70NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione2.656 |
|
FLASH | FLASH | 16Mb (1M x 16) | Parallel | - | 40µs | 70ns | 1.65 V ~ 1.95 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA |
||
Cypress Semiconductor Corp |
IC FLASH NOR 8SOIC
|
pacchetto: - |
Azione5.760 |
|
FLASH | FLASH - NOR | 16Mb (2M x 8) | SPI - Quad I/O | 108MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | - | - | - |
||
Microchip Technology |
IC EEPROM 32KBIT 10MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.280 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 32KBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.336 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Winbond Electronics |
IC FLASH 8MBIT 104MHZ 8USON
|
pacchetto: 8-UFDFN |
Azione3.600 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8) | SPI | 104MHz | 800µs | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN | 8-USON (2x3) |
||
Cypress Semiconductor Corp |
IC FLASH MEM 256MBIT 84BALL
|
pacchetto: - |
Azione7.616 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC FLASH 128M PARALLEL 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione3.296 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | Parallel | - | 90ns | 90ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP |
||
Micron Technology Inc. |
IC DRAM 16G PARALLEL 1067MHZ
|
pacchetto: - |
Azione4.640 |
|
DRAM | SDRAM - DDR4 | 16Gb (2G x 8) | Parallel | 1067MHz | - | - | 1.14 V ~ 1.26 V | 0°C ~ 95°C (TC) | - | - | - |
||
Micron Technology Inc. |
LPDDR4 0 WFBGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IC FLASH 32MBIT PARALLEL 48VFBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 32Mbit | Parallel | - | 60ns | 60 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFBGA | 48-VFBGA (8.15x6.15) |
||
Insignis Technology Corporation |
DDR4 8GB X16 FBGA 7.5X13 (X1.2)
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR4 | 8Gbit | POD | 1.333 GHz | 15ns | 18 ns | 1.14V ~ 1.26V | -40°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (7.5x13) |
||
ABLIC Inc. |
LINEAR IC
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 32Kbit | SPI | 6.5 MHz | 4ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP-J |
||
Winbond Electronics |
IC FLASH 8MBIT SPI/QUAD 8WSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 8Mbit | SPI - Quad I/O | 104 MHz | 50µs, 3ms | 6 ns | 2.5V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Cypress Semiconductor Corp |
IC EPROM 64KBIT PARALLEL
|
pacchetto: - |
Request a Quote |
|
EPROM | EPROM - OTP | 64Kbit | Parallel | - | - | 18 ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | - | - | - |