Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC CONFIG DEVICE
|
pacchetto: 88-LFBGA |
Azione4.048 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 88-LFBGA | 88-UBGA (11x8) |
||
Microchip Technology |
IC FPGA 2M CONFIG MEM 44TQFP
|
pacchetto: 44-TQFP |
Azione6.208 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
IC EEPROM FLASH 32MBIT 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione6.880 |
|
32Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC 3V SER CFG PROM 65K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.328 |
|
65kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Microchip Technology |
IC EEPROM SRL CONFG 2M LV 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.352 |
|
2Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC FLASH CONFIG 16M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione5.536 |
|
16Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione2.512 |
|
2Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 512K 8LAP
|
pacchetto: 8-TDFN |
Azione4.320 |
|
512kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 44-VQFP
|
pacchetto: 44-TQFP |
Azione18.000 |
|
16Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM SER 4MBIT 3.3V 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione3.664 |
|
4Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC PROM SER 200K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.392 |
|
200kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Microchip Technology |
IC EEPROM FPGA 64KB 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.856 |
|
64kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SER CONFIG PROM 512K 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione12.492 |
|
512kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione16.020 |
|
440kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC MEM PROM 16MB 3.3V 44CCC
|
pacchetto: 44-CCC (J-Lead) |
Azione7.072 |
|
16Mb | 3 V ~ 3.6 V | -55°C ~ 125°C (TC) | 44-CCC (J-Lead) | 44-CCCP (16.51x16.51) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 64K 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.920 |
|
64kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Altera |
IC CONFIG DEVICE 400KBIT 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione19.848 |
|
440kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH CONFIG 16M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione7.788 |
|
16Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Intel |
IC CONFIG DEVICE 64MBIT 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione5.552 |
|
64Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Intel |
IC CONFIG DEVICE 1MBIT 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione71.904 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Intel |
IC CONFIG DEVICE 64MBIT 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione15.348 |
|
64Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Intel |
IC CONFIG DEVICE 16MBIT 88UBGA
|
pacchetto: 88-LFBGA |
Azione6.672 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 88-LFBGA | 88-UBGA (11x8) |
||
Xilinx Inc. |
IC PROM SRL 128M GATE 64-FTBGA
|
pacchetto: 64-TBGA |
Azione4.032 |
|
128Mb | 1.7 V ~ 2 V | -40°C ~ 85°C | 64-TBGA | 64-FTBGA (10x13) |
||
Xilinx Inc. |
IC PROM IN SYST PRG 3.3V 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.080 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Intel |
IC CONFIG DEVICE 16MBIT 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione9.576 |
|
16Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
AMD |
IC PROM ISP 4MB 3.3V 20TSSOP
|
pacchetto: - |
Request a Quote |
|
4Mb | 3V ~ 3.6V | -40°C ~ 85°C (TA) | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
AMD |
CONFIG MEMORY, 8MX1, SERIAL
|
pacchetto: - |
Request a Quote |
|
8MB | 1.65V ~ 2V | -40°C ~ 85°C (TA) | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Altera |
CONFIG MEMORY, 64KX1, SERIAL
|
pacchetto: - |
Request a Quote |
|
65kb | 4.75V ~ 5.25V | 0°C ~ 70°C (TA) | 32-TQFP | 32-TQFP (7x7) |