Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC TDM/TSI SWITCH 256X256 48SSOP
|
pacchetto: 48-BSSOP (0.295", 7.50mm Width) |
Azione6.512 |
|
- | 1 | 3 V ~ 3.6 V | 4mA | - | -40°C ~ 85°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CH 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione98.976 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Silicon Labs |
IC PROSLIC FXS DUAL -140V 50QFN
|
pacchetto: - |
Azione4.720 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 12CH 420TBGA
|
pacchetto: 420-LBGA Exposed Pad |
Azione3.072 |
|
LIU | 12 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 420-LBGA Exposed Pad | 420-TBGA (35x35) |
||
Silicon Labs |
IC LINEFEED INTRFC SI321X 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) Exposed Pad |
Azione231.132 |
|
PCM, Serial, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 800mW | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) Exposed Pad | 16-SOIC |
||
Maxim Integrated |
IC ELASTIC STORE T1/CEPT 16-SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione2.288 |
|
PCM | 1 | 4.5 V ~ 5.5 V | 9mA | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Maxim Integrated |
IC LIU QUAD E1/T1/J1 128-LQFP
|
pacchetto: 128-LQFP |
Azione11.820 |
|
- | 4 | 3.135 V ~ 3.465 V | 320mA | - | 0°C ~ 70°C | Surface Mount | 128-LQFP | 128-LQFP (14x20) |
||
Maxim Integrated |
IC ELASTIC STORE T1/CEPT 16-SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione7.472 |
|
PCM | 1 | 4.5 V ~ 5.5 V | 9mA | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Maxim Integrated |
IC TXRX E1 1-CHIP 3.3V 100-LQFP
|
pacchetto: 100-LQFP |
Azione5.216 |
|
E1, HDLC | 1 | 3.14 V ~ 3.47 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Exar Corporation |
IC LIU SH T1/E1/J1 14CH 304TBGA
|
pacchetto: 304-BBGA |
Azione3.504 |
|
LIU | 14 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 304-BBGA | 304-PBGA (31x31) |
||
Maxim Integrated |
IC LIU LN T1/E1/J1 3.3V 49-BGA
|
pacchetto: 49-LFBGA, CSPBGA |
Azione5.280 |
|
Serial | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 49-LFBGA, CSPBGA | 49-CSBGA (7x7) |
||
Microsemi Corporation |
IC VOICE LINE VCP2 64CH 128TQFP
|
pacchetto: 128-TQFP |
Azione177.564 |
|
PCM | 1 | 3.3V | - | - | - | Surface Mount | 128-TQFP | 128-TQFP |
||
Microsemi Corporation |
IC SLIC 2CH 50DB 44TQFP
|
pacchetto: 44-TQFP Exposed Pad |
Azione2.080 |
|
- | 2 | 4.75 V ~ 5.25 V | 9mA | - | -40°C ~ 85°C | Surface Mount | 44-TQFP Exposed Pad | 44-TQFP-EP (10x10) |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 28-SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione7.952 |
|
TTL | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
SONET/SDH INTERFACE FOR 622 & 15
|
pacchetto: 196-LBGA |
Azione5.664 |
|
Serial | - | - | - | - | - | Surface Mount | 196-LBGA | 196-CABGA (15x15) |
||
Microchip Technology |
IC SLIC 1CH SWREG 63DB 32QFN
|
pacchetto: 32-VQFN Exposed Pad |
Azione7.232 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | -40°C ~ 85°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (8x8) |
||
Microchip Technology |
32CHANNEL T1/E1 FRAMER DEVICE WI
|
pacchetto: - |
Azione6.224 |
|
- | - | - | - | - | - | - | - | - |
||
Silicon Labs |
IC PROSLIC FXS
|
pacchetto: - |
Azione6.576 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC RECEIVER DTMF 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione7.584 |
|
- | 1 | 2.7V ~ 3.6V | 2mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Harris Corporation |
SLIC, 2-4 CONVERSION, BIPOLAR
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
MaxLinear, Inc. |
CODEC/SLIC 2CH 64LQFP
|
pacchetto: - |
Request a Quote |
|
- | 2 | - | - | - | - | Surface Mount | 64-QFP | 64-LQFP (12x12) |
||
Lantiq |
SOLUTION FOR VDSL2 / ADSL2/2+ WI
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
24P MGIG-LITE/48P GE SWITCH W/O
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
MaxLinear, Inc. |
TRANSVR IC GPY211C0VC VQFN56 SLN
|
pacchetto: - |
Azione7.575 |
|
PHY, Serial, SGMII, SPI | 1 | 0.97V ~ 1.03V, 3.13V ~ 3.46V | 705mA | - | 0°C ~ 70°C | Surface Mount | 56-VFQFN Exposed Pad | 56-VQFN (7x7) |
||
Broadcom Limited |
4X2.5G+4X10G+4X2.5G SWITCH, I-TE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | -40°C ~ 85°C | - | - | - |
||
Cirrus Logic Inc. |
OCTAL E1 ANALOG FRONT END
|
pacchetto: - |
Request a Quote |
|
E1 | 8 | 3.135V ~ 3.465V | - | 112 mW | -40°C ~ 85°C | Surface Mount | 144-LQFP | 144-LQFP (20x20) |
||
Broadcom Limited |
8X2.5GE+2X2.5GE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IEC-Q TEISDN ECHO CANCELLATION
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |