Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC CODEC VOICE 4-CHAN LBGA-144-1
|
pacchetto: 144-LBGA |
Azione5.856 |
|
JTAG, PCM, SCI/SPI | 4 | - | - | - | -40°C ~ 85°C | Surface Mount | 144-LBGA | PG-LBGA-144 |
||
Infineon Technologies |
IC NETWORK CONTROLLER BGA-388-2
|
pacchetto: 388-BBGA |
Azione5.808 |
|
HDLC, PPP, SS7, TMA | - | 3 V ~ 3.6 V | 200mA | 3W | 0°C ~ 70°C | Surface Mount | 388-BBGA | 388-BGA (35x35) |
||
Microsemi Corporation |
IC DGTL TELEPHONE CIRCUIT 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione14.340 |
|
- | 1 | 4.75 V ~ 5.25 V | 400µA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Microsemi Corporation |
IC TDM SWITCH 2K-CH ENH 256BGA
|
pacchetto: 256-BGA |
Azione7.696 |
|
- | 1 | 1.71 V ~ 1.89 V | 165mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microsemi Corporation |
IC SLAC 1CH 70V MTRG 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.760 |
|
2-Wire | - | 3.3V | - | - | - | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
ams |
IC TELEPHONE CMOS MULTIFU 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione40.368 |
|
- | 1 | 3.8 V ~ 5 V | 4mA | - | -25°C ~ 70°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Exar Corporation |
IC LIU SH T1/E1/J1 8CH 225BGA
|
pacchetto: 225-BGA |
Azione7.136 |
|
LIU | 8 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 225-BGA | 225-BGA (19x19) |
||
Maxim Integrated |
IC TXRX T1 1-CHIP 5V 100-LQFP
|
pacchetto: 100-LQFP |
Azione2.416 |
|
E1, HDLC, J1, T1 | 1 | 4.75 V ~ 5.25 V | 75mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Maxim Integrated |
IC CONTROLLER E1 5V LP 40-DIP
|
pacchetto: 40-DIP (0.600", 15.24mm) |
Azione7.824 |
|
Parallel/Serial | - | 4.5 V ~ 5.5 V | 10mA | - | 0°C ~ 70°C | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
Maxim Integrated |
IC BUFFER RECEIVE T1 24-DIP
|
pacchetto: 24-DIP (0.300", 7.62mm) |
Azione6.704 |
|
TDM | 1 | - | 5mA | - | 0°C ~ 70°C | Through Hole | 24-DIP (0.300", 7.62mm) | 24-PDIP |
||
Microsemi Corporation |
IC TDM SWITCH 4K-CH ENH 256BGA
|
pacchetto: 256-BGA |
Azione5.616 |
|
- | 1 | 1.71 V ~ 1.89 V | 130mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microsemi Corporation |
IC TXRX DTMF 3V 24DIP
|
pacchetto: 24-DIP (0.300", 7.62mm) |
Azione4.496 |
|
- | 1 | 2.7 V ~ 3.6 V | 3.1mA | - | -40°C ~ 85°C | Through Hole | 24-DIP (0.300", 7.62mm) | 24-PDIP |
||
Maxim Integrated |
IC TXRX E1 QUAD 3.3V 100LQFP
|
pacchetto: 100-LQFP |
Azione10.188 |
|
E1 | 4 | 3.14 V ~ 3.47 V | 230mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Maxim Integrated |
IC LIU T1/J1 3.3V 28-PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione9.672 |
|
- | - | 3.135 V ~ 3.465 V | - | - | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Maxim Integrated |
IC LIU T1/E1/J1 3.3V 44-TQFP
|
pacchetto: 44-TQFP |
Azione43.068 |
|
- | 1 | 3.135 V ~ 3.465 V | 66mA | - | 0°C ~ 70°C | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
||
Renesas Electronics America |
IC SLIC UNIVERSAL LP 28-PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.416 |
|
- | 1 | 4.75 V ~ 5.25 V | 2.25mA | 1.5W | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC ETHERNET DUAL PORT 256BGA
|
pacchetto: - |
Azione4.208 |
|
- | 1 | 1V | - | - | - | Surface Mount | - | 256-BGA (17x17) |
||
Microchip Technology |
IC SYNCHRONIZER T1/E1 48SSOP
|
pacchetto: 48-SSOP (0.295", 7.50mm Width) |
Azione5.808 |
|
- | 1 | 3V ~ 3.6V | 50mA | - | -40°C ~ 85°C | Surface Mount | 48-SSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Microchip Technology |
2CH ADSL2+ LINE DRIVER 12V QFN16
|
pacchetto: - |
Azione52.392 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
EPON/GPON HGU WITH NEW SUBSTRATE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
INTEGRATED GIGABIT-ETHERNET CO
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
BCM11196SA01
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
SLIC, 2-4 CONVERSION, BIPOLAR
|
pacchetto: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | 4.75V ~ 5.25V | 9.5mA | 1.5 W | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Skyworks Solutions Inc. |
WIDEBAND DUAL FXS, ISI INTERFACE
|
pacchetto: - |
Request a Quote |
|
3-Wire, PCM, SPI | 2 | 3.13V ~ 3.47V | 51.71mA | - | -40°C ~ 85°C | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN (8x8) |
||
Renesas Electronics Corporation |
DIE SALE (PRICE IN GOOD DIE)-WAF
|
pacchetto: - |
Request a Quote |
|
- | 2 | - | - | - | - | Surface Mount | Die | Die |
||
Skyworks Solutions Inc. |
WIDEBAND DUAL FXS, PCM INTERFACE
|
pacchetto: - |
Request a Quote |
|
3-Wire, PCM, SPI | 2 | 3.13V ~ 3.47V | 51.71mA | - | 0°C ~ 70°C | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN (8x8) |
||
CML Microcircuits |
IC TELECOM INTERFACE 64LQFP
|
pacchetto: - |
Azione1.008 |
|
C-Bus | 1 | 3V ~ 3.6V | 670µA | 1.69 W | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-LQFP (10x10) |
||
Lantiq |
XWAY HIGH-END SINGLE-CHIP ADSL2/
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |