Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC MODULAR ISDN NT INTELL MQFP64
|
pacchetto: 64-QFP |
Azione7.952 |
|
HDLC, ISDN, SCI | 1 | 3.3V | 30mA | - | 0°C ~ 70°C | Surface Mount | 64-QFP | P-64-MQFP |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK II SNGL 100LBGA
|
pacchetto: 100-LBGA |
Azione6.448 |
|
LVTTL | - | 3.135 V ~ 3.465 V | 390mA | - | -40°C ~ 85°C | Surface Mount | 100-LBGA | 100-TBGA (11x11) |
||
STMicroelectronics |
IC SLIC 44TQFP
|
pacchetto: 44-LQFP |
Azione3.680 |
|
- | 1 | 4.75 V ~ 5.25 V | 5.5mA | 1.1W | -40°C ~ 85°C | Surface Mount | 44-LQFP | 44-TQFP |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.560 |
|
- | 1 | 4.5 V ~ 5.5 V | 700µA | 10.5W | -40°C ~ 110°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Maxim Integrated |
IC CTRLR HDLC 256-CHANNEL 256BGA
|
pacchetto: 256-BGA |
Azione12.744 |
|
Serial | - | 3 V ~ 3.6 V | 500mA | - | 0°C ~ 70°C | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
Microsemi Corporation |
IC TDM SWITCH 4K-CH ENH 256LQFP
|
pacchetto: 256-LQFP |
Azione3.200 |
|
- | 1 | 1.71 V ~ 1.89 V | 1.75mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
||
NXP |
IC C2K 900MHZ 8CH VOIP 625FCBGA
|
pacchetto: - |
Azione4.016 |
|
- | - | - | - | - | - | - | - | - |
||
IXYS Integrated Circuits Division |
IC MOD PH-LINE AUSTRAL 1.07" PCB
|
pacchetto: 18-DIP Module (0.850", 21.59mm), 9 Leads |
Azione6.960 |
|
- | 1 | 5V | 8mA | - | 0°C ~ 70°C | Through Hole | 18-DIP Module (0.850", 21.59mm), 9 Leads | 18-DIP |
||
IDT, Integrated Device Technology Inc |
IC LIU E1 4CH SHORT HAUL 160-BGA
|
pacchetto: 160-BGA |
Azione3.488 |
|
LIU | - | 3.13 V ~ 3.47 V | 40mA | - | -40°C ~ 85°C | Surface Mount | 160-BGA | 160-PBGA (15x15) |
||
IXYS Integrated Circuits Division |
IC MOD DAA HALF-WAVE DETECT PCB
|
pacchetto: 18-DIP Module (0.850", 21.59mm), 11 Leads |
Azione6.208 |
|
- | 1 | 5V | 8mA | - | 0°C ~ 70°C | Through Hole | 18-DIP Module (0.850", 21.59mm), 11 Leads | 18-DIP |
||
Silicon Labs |
IC PROSLIC FXS PCM DTMF 56QFN
|
pacchetto: - |
Azione6.816 |
|
3-Wire, PCM | 2 | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
Maxim Integrated |
IC TXRX MAC/PHY 64-LQFP
|
pacchetto: 64-LQFP |
Azione16.338 |
|
SPI, UART | 1 | - | - | - | -40°C ~ 105°C | Surface Mount | 64-LQFP | 64-LQFP (10x10) |
||
Microchip Technology |
STACKABLE MANAGED SWITCH 24 PORT
|
pacchetto: - |
Azione3.200 |
|
- | - | - | - | - | - | - | - | - |
||
Renesas Electronics America |
IC RSLIC FAMILY 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione7.920 |
|
2-Wire | 1 | 5V | - | - | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Renesas Electronics America |
IC VDSL2 LINE DVR AMP 10HMSOP
|
pacchetto: 10-VFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad |
Azione13.164 |
|
- | 2 | 4.5 V ~ 12 V | 6mA | - | -40°C ~ 85°C | Surface Mount | 10-VFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad | 10-HMSOP |
||
Microchip Technology |
IC TXRX DTMF 3V 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione4.016 |
|
- | 1 | 2.7V ~ 3.6V | 3.1mA | - | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Microchip Technology |
IC CODEC U-LAW CCITT PCM 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.528 |
|
PCM | 1 | 4.75V ~ 5.25V | 3mA | - | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC DGTL SWITCH F12KDX 272BGA
|
pacchetto: 272-BGA |
Azione3.376 |
|
- | 1 | 3V ~ 3.6V | 160mA | - | -40°C ~ 85°C | Surface Mount | 272-BGA | 272-PBGA (27x27) |
||
Broadcom Limited |
MULTI LAYER SWITCH--1588 DISABLE
|
pacchetto: - |
Azione7.600 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
FOUR CHANNEL COMBINED T1/E1/J1 T
|
pacchetto: - |
Azione4.416 |
|
E1, J1, SPI, T1 | 4 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | - | 256-CABGA (17x17) |
||
Microchip Technology |
TEMUX 336NG, PB FREE BUMP
|
pacchetto: - |
Azione6.960 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC VOICE ECHO CANCEL 100LQFP
|
pacchetto: 100-LQFP |
Azione7.504 |
|
- | 1 | 1.6V ~ 2V | 10mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP |
||
Lantiq |
PEB24902 - 4-CHANNEL ISDN ANALOG
|
pacchetto: - |
Request a Quote |
|
IOM-2, SCI | 4 | 4.75V ~ 5.25V | 2mA | - | 0°C ~ 70°C | Surface Mount | 64-QFP | P-MQFP-64-9 HS |
||
Infineon Technologies |
TELEPHONY INTERFACE CIRCUIT
|
pacchetto: - |
Request a Quote |
|
JTAG, PCM, SCI/SPI | 4 | - | - | - | -40°C ~ 85°C | Surface Mount | 16-LQFN Exposed Pad | 16-QFN (6x6) |
||
Broadcom Limited |
HIGH PERFORMANCE VDSL GATEWAY/RO
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
MULTI LAYER SWITCH 1588 ENABLED
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
CML Microcircuits |
IC TELECOM INTERFACE 64LQFP
|
pacchetto: - |
Request a Quote |
|
C-Bus | 1 | 3V ~ 3.6V | 670µA | 3.5 W | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-LQFP (10x10) |
||
Broadcom Limited |
HIGH PERFORMANCE VDSL2/ADSL2 ROU
|
pacchetto: - |
Request a Quote |
|
ADSL, DSL | 1 | - | - | - | - | - | - | - |