Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC NETWORK TERMINATOR MQFP-64
|
pacchetto: 64-QFP |
Azione4.096 |
|
IOM-2, ISDN | 4 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 64-QFP | P-64-MQFP |
||
Infineon Technologies |
IC LIU E1/T1/J1 256LBGA
|
pacchetto: 256-LBGA |
Azione6.768 |
|
E1, J1, T1 | 8 | 1.8V, 3.3V | 370mA | 140mW | -40°C ~ 85°C | Surface Mount | 256-LBGA | PG-LBGA-256 |
||
Infineon Technologies |
IC SLIC VOICE ACCESS VQFN-48
|
pacchetto: 48-VFQFN Exposed Pad |
Azione5.520 |
|
IOM-2, PCM | 2 | 5V | 60mA, 90mA | - | 0°C ~ 70°C | Surface Mount | 48-VFQFN Exposed Pad | P-VQFN-48-4 |
||
Microsemi Corporation |
IC SLAC 1FXS 1CH HV 48LQFP
|
pacchetto: - |
Azione3.808 |
|
- | 1 | - | - | - | - | - | - | - |
||
Texas Instruments |
IC INTERFACE ISDN DEVICE 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione5.808 |
|
ISDN | 1 | 4.75 ~ 5.25 V | - | - | - | Surface Mount | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 16-SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione6.960 |
|
- | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 6CH 217BGA
|
pacchetto: 217-BBGA |
Azione6.080 |
|
LIU | 6 | 3.135 V ~ 3.465 V | 725mA | - | -40°C ~ 85°C | Surface Mount | 217-BBGA | 217-BGA (23x23) |
||
Exar Corporation |
IC PCM LINE INTERFACE 18SOIC
|
pacchetto: 18-SOIC (0.295", 7.50mm Width) |
Azione2.736 |
|
PCM | 1 | 4.75 V ~ 5.25 V | 40mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
Exar Corporation |
IC LIU T1/E1/J1 QUAD 128TQFP
|
pacchetto: 128-LQFP |
Azione2.000 |
|
LIU | 4 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 128-LQFP | 128-TQFP (14x20) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/J1/E1 2CH 80-TQFP
|
pacchetto: 80-LQFP |
Azione2.864 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
Silicon Labs |
IC FCC+ EMBEDDED DAA 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) Exposed Pad |
Azione30.000 |
|
- | 1 | - | 9mA | - | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) Exposed Pad | 8-SOIC-EP |
||
Silicon Labs |
IC PROSLIC FXS DUAL -140V 50QFN
|
pacchetto: - |
Azione7.232 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Silicon Labs |
IC PROSLIC FXS ISI -106V 48QFN
|
pacchetto: - |
Azione5.744 |
|
3-Wire, PCM | 2 | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
Rohm Semiconductor |
IC DTMF RCVR FOR PHONE SOP18 TR
|
pacchetto: 18-SOIC (0.213", 5.40mm Width) |
Azione6.992 |
|
- | 1 | 4.75 V ~ 5.25 V | 2.2mA | 550mW | -10°C ~ 70°C | Surface Mount | 18-SOIC (0.213", 5.40mm Width) | 18-SOP |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.712 |
|
TTL | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microsemi Corporation |
IC SLIC 2CH UNIV 150V 48TQFP
|
pacchetto: - |
Azione256.488 |
|
Parallel | 2 | 3.3V | 40mA | - | - | Surface Mount | - | 48-eTQFP |
||
Microsemi Corporation |
IC CNIC2 CLIP CID CIDCW 24SOIC
|
pacchetto: 24-SOIC (0.295", 7.50mm Width) |
Azione14.076 |
|
3-Wire | 1 | 2.7 V ~ 5.5 V | 4.7mA | - | -40°C ~ 85°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Maxim Integrated |
IC LIU QUAD T1/E1/J1 256-BGA
|
pacchetto: 256-BGA |
Azione6.288 |
|
LIU | 4 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
Rohm Semiconductor |
IC DTMF RCVR FOR PHN SSOP-A16 TR
|
pacchetto: 16-LSOP (0.173", 4.40mm Width) |
Azione31.404 |
|
- | 1 | 4.5 V ~ 5.5 V | 3.4mA | 650mW | -40°C ~ 85°C | Surface Mount | 16-LSOP (0.173", 4.40mm Width) | 16-SSOPA |
||
NXP |
CABLE FST DEMOD
|
pacchetto: - |
Azione6.336 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC ETHERNET SWITCH 672BGA
|
pacchetto: - |
Azione7.212 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | - | 672-BGA |
||
Microchip Technology |
IC VOICE ECHO CANCEL 535MCMBGA
|
pacchetto: 535-BGA |
Azione4.816 |
|
- | 1 | 1.6V ~ 2V | 10mA | - | -40°C ~ 85°C | Surface Mount | 535-BGA | 535-PBGA (31x31) |
||
Microchip Technology |
IC FRAMER OCT T1/E1/J1 220BGA
|
pacchetto: 220-LBGA |
Azione7.248 |
|
- | 1 | 3V ~ 3.6V | 30mA | - | -40°C ~ 85°C | Surface Mount | 220-LBGA | 220-LBGA (17x17) |
||
Microchip Technology |
IC TDM/TSI SWITCH 128X128 40DIP
|
pacchetto: 40-DIP (0.600", 15.24mm) |
Azione2.736 |
|
- | 1 | 4.75V ~ 5.25V | 6mA | - | -40°C ~ 85°C | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
Harris Corporation |
RINGING SLIC FAMILY
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
MaxLinear, Inc. |
DATA COMM PEF42078VTV11 VQFN68 S
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
IP PHONE CHIP
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
100GE-3X 40GE SWITCH
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |