Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC CODEC PROGRAMMABLE MQFP-64
|
pacchetto: 64-QFP |
Azione2.096 |
|
PCM, SPI | 4 | 5V | 26mA | 130mW | -40°C ~ 85°C | Surface Mount | 64-QFP | P-64-MQFP |
||
Exar Corporation |
IC FRAMER DS3/E3 4CH 272BGA
|
pacchetto: 272-BBGA |
Azione7.344 |
|
- | - | 3.3V | 190mA | - | -40°C ~ 85°C | Surface Mount | 272-BBGA | 272-PBGA (27x27) |
||
Cypress Semiconductor Corp |
IC RECEIVER HOTLINK 256LBGA
|
pacchetto: 256-LBGA Exposed Pad |
Azione4.352 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 640mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Silicon Labs |
IC ISOMODEM LINE-SIDE DAA 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione19.596 |
|
Parallel, SPI, UART | 1 | 3 V ~ 3.6 V | 8.5mA | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
IXYS Integrated Circuits Division |
IC RECEIVER DTMF CMOS LP 18-SOIC
|
pacchetto: 18-SOIC (0.295", 7.50mm Width) |
Azione3.776 |
|
- | 1 | 4.75 V ~ 5.25 V | 3mA | 35mW | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 6CH 217BGA
|
pacchetto: 217-BBGA |
Azione2.000 |
|
LIU | 6 | 3.135 V ~ 3.465 V | 725mA | - | -40°C ~ 85°C | Surface Mount | 217-BBGA | 217-BGA (23x23) |
||
Silicon Labs |
IC ISOMODEM LINE-SIDE DAA 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione526.740 |
|
Parallel, SPI, UART | 1 | 3 V ~ 3.6 V | 15mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Silicon Labs |
IC PROSLIC FXS PCM -106V 40QFN
|
pacchetto: - |
Azione6.960 |
|
3-Wire | 1 | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
Intersil |
IC XDSL LINE DVR DUAL-PORT 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione5.664 |
|
Serial | 2 | 10 V ~ 14.7 V | 19.5mA | - | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Maxim Integrated |
IC MICRODAA PCM HWY 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione22.908 |
|
PCM, SPI | 1 | 3 V ~ 3.6 V | - | - | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
LYNX-1, 12X1G+4X10G CARRIER ETHE
|
pacchetto: - |
Azione4.080 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC DGTL TELEPHONE CIRCUIT 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.144 |
|
- | 1 | 4.75V ~ 5.25V | 400µA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Broadcom Limited |
GIGABIT ETH SWITCH 24GE 4XHG
|
pacchetto: - |
Azione7.984 |
|
PCI Express | - | - | - | - | - | - | - | - |
||
Microchip Technology |
COMBINED T1/E1 FRAMER/TRANSCEIVE
|
pacchetto: 81-LFBGA |
Azione4.176 |
|
E1, J1, T1 | - | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 81-LFBGA | 81-CABGA (9x9) |
||
Microchip Technology |
IC LINE DRIVER 2CH ADSL2+ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione7.728 |
|
- | 2 | 10V ~ 24V, ±5V ~ 12V | 4mA | - | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (4x4) |
||
Microchip Technology |
IC SLIC 1CH UNIV 150V 48QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione6.528 |
|
4-Wire | 1 | 3.135V ~ 3.465V | 25mA | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Microchip Technology |
25PRT UNMAN L2 SW W/12 INT CU PH
|
pacchetto: 672-BGA |
Azione8.064 |
|
Serial | 1 | 1V | - | - | 0°C ~ 125°C | Surface Mount | 672-BGA | 672-HSBGA (27x27) |
||
Microchip Technology |
IC VOICE PROCESSOR 100LQFP
|
pacchetto: 100-LQFP |
Azione16.284 |
|
I²S, SPI, UART | 2 | - | - | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Infineon Technologies |
OCTAT-P OCTAL TRANSCEICER
|
pacchetto: - |
Request a Quote |
|
IOM-2, PCM | - | 4.75V ~ 5.25V | 20mA | - | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | PG-LCC-28-R |
||
MaxLinear, Inc. |
VOICECODEC PEF39000HLV11 LQFP100
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
48GE+4X10GE+2XHG[42]
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Analog Devices Inc./Maxim Integrated |
16-PORT TRANSMISSION CONVERGENCE
|
pacchetto: - |
Request a Quote |
|
E1, T1, TDM, UTOPIA II | 1 | 3.135V ~ 3.465V | 85mA | - | -40°C ~ 85°C | Surface Mount | 256-LBGA, CSPBGA | 256-CSBGA (17x17) |
||
Broadcom Limited |
HIGH PERFORMANCE VDSL GATEWAY/RO
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
212, BONDED 106, V/ADSL GW, NO V
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
ITU LOW COST, PABX SLIC
|
pacchetto: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | ±4.75V ~ 5.25V | 5.5mA | 150 mW | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Broadcom Limited |
63168V+53124S+4360
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
OCTAL T1/E1 SHORT HAUL LIU
|
pacchetto: - |
Request a Quote |
|
E1, T1 | 8 | 3.13V ~ 3.47V | 65mA | - | -40°C ~ 85°C | Surface Mount | 144-LQFP Exposed Pad | 144-TQFP (20x20) |
||
Skyworks Solutions Inc. |
WIDEBAND DUAL FXS, PCM INTERFACE
|
pacchetto: - |
Request a Quote |
|
3-Wire, PCM, SPI | 2 | 3.13V ~ 3.47V | 51.71mA | - | -40°C ~ 85°C | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN (8x8) |