Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC SLIC-DC W/DC-DC CONV TQFP-48
|
pacchetto: 48-TQFP |
Azione5.392 |
|
- | 1 | 4.75 V ~ 5.25 V | - | - | -40°C ~ 85°C | Surface Mount | 48-TQFP | P-TQFP-48 |
||
Infineon Technologies |
IC LIU E1/T1/J1 160LBGA
|
pacchetto: 160-LBGA |
Azione2.864 |
|
E1, J1, T1 | 4 | 1.8V, 3.3V | 230mA | 140mW | -40°C ~ 85°C | Surface Mount | 160-LBGA | P-LBGA-160 |
||
Infineon Technologies |
IC VOICE ACCESS CODEC MQFP64
|
pacchetto: 64-QFP |
Azione5.648 |
|
IOM-2, PCM | 2 | 3.3V | 105mA | - | 0°C ~ 70°C | Surface Mount | 64-QFP | P-64-MQFP |
||
Microsemi Corporation |
IC CODEC MFC 5V 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione5.600 |
|
SSI | 1 | 4.75 V ~ 5.25 V | 4µA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microsemi Corporation |
IC PCM/SPI-ZSI BUS XLATOR 16SOIC
|
pacchetto: - |
Azione4.752 |
|
SPI | 1 | 3.3V | 10mA | - | - | Surface Mount | - | 16-SOIC |
||
Microsemi Corporation |
IC LINE CARD LCAS 2CH 44TQFP
|
pacchetto: 44-TQFP |
Azione39.768 |
|
- | 2 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
||
Inphi Corporation |
IC OPT TRANSPORT PROC 868-TBGA
|
pacchetto: 868-BGA |
Azione2.912 |
|
4-Bit Nibble, SFI-4.1, XSBI | - | - | - | - | - | Surface Mount | 868-BGA | 868-BGA |
||
Exar Corporation |
IC LIU/FRAMER DS3/E3 1CH 208BGA
|
pacchetto: 208-LBGA |
Azione4.112 |
|
LIU | - | 3.15 V ~ 3.45 V | - | - | -40°C ~ 85°C | Surface Mount | 208-LBGA | 208-STBGA (17x17) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 SGL 52TQFP
|
pacchetto: 52-LQFP |
Azione11.856 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 52-LQFP | 52-TQFP (10x10) |
||
Maxim Integrated |
IC 12CH DS3/3 FRAMER 349BGA
|
pacchetto: 349-BGA Exposed Pad |
Azione4.704 |
|
LIU | - | 3.135 V ~ 3.465 V | 960mA | - | -40°C ~ 85°C | Surface Mount | 349-BGA Exposed Pad | 349-TE-PBGA-2 (27x27) |
||
STMicroelectronics |
IC CTRLR SYSTEM7 33MHZ 52-PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione4.848 |
|
HDLC, SS7 | 1 | - | - | 500mW | 0°C ~ 70°C | Surface Mount | 52-LCC (J-Lead) | 52-PLCC |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 28DFN
|
pacchetto: 28-VDFN Exposed Pad |
Azione6.736 |
|
- | 1 | 4.5 V ~ 5.5 V | 700µA | 10.5W | -40°C ~ 110°C | Surface Mount | 28-VDFN Exposed Pad | 28-DFN |
||
Maxim Integrated |
IC LIU QUAD E1/T1/J1 128-LQFP
|
pacchetto: 128-LQFP |
Azione6.444 |
|
- | 4 | 3.135 V ~ 3.465 V | 320mA | - | -40°C ~ 85°C | Surface Mount | 128-LQFP | 128-LQFP (14x20) |
||
Intersil |
IC XDSL LINE DVR DUAL-PORT 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione4.544 |
|
Serial | 2 | 10 V ~ 14.7 V | 19.5mA | - | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 150MA 8FLTPK
|
pacchetto: 8-SMD, Gull Wing |
Azione61.632 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-SMD, Gull Wing | 8-Flatpack |
||
Microsemi Corporation |
IC TXRX SGL T1/E1/J1 3.3V 80LQFP
|
pacchetto: 80-LQFP |
Azione36.000 |
|
- | 1 | 3 V ~ 3.6 V | 85mA | - | -40°C ~ 85°C | Surface Mount | 80-LQFP | 80-LQFP (14x14) |
||
Microsemi Corporation |
IC SUBSCRIBER NETWRK DNIC 28PLCC
|
pacchetto: - |
Azione17.244 |
|
- | 1 | 4.75 V ~ 5.25 V | 10mA | - | -40°C ~ 85°C | Surface Mount | - | 28-PLCC |
||
Microsemi Corporation |
IC RECEIVER DTMF 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione34.416 |
|
- | 1 | 2.7 V ~ 3.6 V | 2mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
STMicroelectronics |
IC OFDM PWR SOC IND/ASIC 48QFN
|
pacchetto: 100-TQFP Exposed Pad |
Azione25.824 |
|
I2C, SPI | 1 | 8 V ~ 18 V | - | - | -40°C ~ 80°C | Surface Mount | 100-TQFP Exposed Pad | 100-TQFP (14x14) |
||
NXP |
CABLE FST DEMOD
|
pacchetto: - |
Azione2.768 |
|
- | - | - | - | - | - | - | - | - |
||
Renesas Electronics America |
IC SLIC RINGING 3.3V VOB 32-QFN
|
pacchetto: 32-VQFN Exposed Pad |
Azione2.592 |
|
- | 1 | 3.3V | - | 305mW | 0°C ~ 75°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (7x7) |
||
Renesas Electronics America |
IC LINE DVR DIFF 300MHZ 16QFN
|
pacchetto: 16-VQFN Exposed Pad |
Azione6.464 |
|
- | 1 | 4.5 V ~ 13.2 V | 6mA | - | -40°C ~ 85°C | Surface Mount | 16-VQFN Exposed Pad | 16-QFN (4x4) |
||
Microchip Technology |
IC DIGITAL SWITCH 12K CH 272BGA
|
pacchetto: 272-BBGA |
Azione7.616 |
|
- | - | 1.71V ~ 1.89V | 240mA | - | -40°C ~ 85°C | Surface Mount | 272-BBGA | 272-PBGA (27x27) |
||
Broadcom Limited |
MULTI LAYER SWITCH--1588 DISABLE
|
pacchetto: - |
Azione4.016 |
|
- | - | - | - | - | - | - | - | - |
||
Silvertel |
HIGH PERFORMANCE PSTN INTERFACE.
|
pacchetto: - |
Request a Quote |
|
2-Wire | 1 | 3.13V ~ 3.47V, 4.75V ~ 5.25V | 30mA | - | 0°C ~ 70°C | Through Hole | 20-SIP Module | - |
||
Broadcom Limited |
BCM63167USA00
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
SINGLE-CHANNEL 10GBE SFI-TO-XAUI
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
NETWORK TERMINATION CONTROLLER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |