Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
IC MPU SITARA 298NFBGA
|
pacchetto: 298-LFBGA |
Azione3.376 |
|
1 Core, 32-Bit | - | Multimedia; NEON? SIMD | LPDDR, DDR2, DDR3, DDR3L | Yes | LCD, Touchscreen | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | 0°C ~ 90°C (TJ) | Cryptography, Random Number Generator | 298-LFBGA | 298-NFBGA (13x13) |
||
IDT, Integrated Device Technology Inc |
IC MPU MIPS-I 25MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione6.016 |
|
1 Core, 32-Bit | 25MHz | System Control; CP0 | DRAM | No | - | - | - | - | 5.0V | 0°C ~ 85°C (TC) | - | 100-LQFP | 100-TQFP (14x14) |
||
NXP |
IC MPU MPC86XX 1.0GHZ 1023FCCBGA
|
pacchetto: 1023-BCBGA, FCCBGA |
Azione7.840 |
|
2 Core, 32-Bit | 1.0GHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 1023-BCBGA, FCCBGA | 1023-FCCBGA (33x33) |
||
NXP |
IC MPU MPC8XX 66MHZ 256BGA
|
pacchetto: 256-BBGA |
Azione6.720 |
|
1 Core, 32-Bit | 66MHz | Communications; RISC CPM | DRAM | No | LCD, Video | 10 Mbps (1) | - | USB 1.x (1) | 3.3V | -40°C ~ 95°C (TA) | - | 256-BBGA | 256-PBGA (23x23) |
||
NXP |
IC MPU MPC85XX 1.333GHZ 783BGA
|
pacchetto: 783-BBGA, FCBGA |
Azione5.312 |
|
1 Core, 32-Bit | 1.333GHz | Signal Processing; SPE, Security; SEC | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC85XX 1.2GHZ 783FCBGA
|
pacchetto: 783-BBGA, FCBGA |
Azione5.568 |
|
1 Core, 32-Bit | 1.2GHz | Signal Processing; SPE | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC83XX 266MHZ 620BGA
|
pacchetto: 620-BBGA Exposed Pad |
Azione3.472 |
|
1 Core, 32-Bit | 266MHz | Security; SEC | DDR, DDR2 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU MPC8XX 133MHZ 256BGA
|
pacchetto: 256-BBGA |
Azione7.744 |
|
1 Core, 32-Bit | 133MHz | Communications; CPM, Security; SEC | DRAM | No | - | 10 Mbps (1), 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | 0°C ~ 95°C (TA) | Cryptography | 256-BBGA | 256-PBGA (23x23) |
||
NXP |
IC MPU MPC8XX 66MHZ 256BGA
|
pacchetto: 256-BBGA |
Azione3.552 |
|
1 Core, 32-Bit | 66MHz | Communications; CPM | DRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | 0°C ~ 95°C (TA) | - | 256-BBGA | 256-PBGA (23x23) |
||
Advantech Corp |
CPU UNITS CORE 3.2G 6M 65W
|
pacchetto: - |
Azione2.624 |
|
4 Core, 64-Bit | 3.2GHz | - | - | Yes | - | - | - | - | - | - | - | - | - |
||
NXP |
IC MPU MPC74XX 400MHZ 360FCCBGA
|
pacchetto: 360-BCBGA, FCCBGA |
Azione6.096 |
|
1 Core, 32-Bit | 400MHz | - | - | No | - | - | - | - | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 360-BCBGA, FCCBGA | 360-FCCBGA (25x25) |
||
NXP |
IC MPU MPC8XX 50MHZ 256BGA
|
pacchetto: 256-BBGA |
Azione5.488 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | USB 1.x (1) | 3.3V | 0°C ~ 95°C (TA) | - | 256-BBGA | 256-PBGA (23x23) |
||
NXP |
IC MPU MPC83XX 400MHZ 620BGA
|
pacchetto: 620-BBGA Exposed Pad |
Azione26.268 |
|
1 Core, 32-Bit | 400MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU MPC83XX 266MHZ 516BGA
|
pacchetto: 516-BBGA |
Azione6.112 |
|
1 Core, 32-Bit | 266MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
Intel |
IC MPU I960 80MHZ 208QFP
|
pacchetto: 208-QFP |
Azione5.472 |
|
1 Core, 32-Bit | 80MHz | - | DRAM | No | - | - | - | - | 3.3V | 0°C ~ 85°C (TC) | - | 208-QFP | 208-PQFP |
||
Digi International |
IC MPU RABBIT 55MHZ 128LQFP
|
pacchetto: 128-LQFP |
Azione20.124 |
|
1 Core, 8-Bit | 55MHz | - | - | No | - | - | - | - | 3.3V | -55°C ~ 85°C (TA) | - | 128-LQFP | 128-LQFP (14x14) |
||
NXP |
QORIQ 2X E5500 1500MHZ DDR3L/
|
pacchetto: - |
Azione2.016 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
I.MX 6DL ROM PERF ENHAN
|
pacchetto: 624-LFBGA |
Azione5.392 |
|
2 Core, 32-Bit | 1GHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-LFBGA | 624-MAPBGA (21x21) |
||
STMicroelectronics |
MPU WITH ARM DUAL CORTEX-A7 650
|
pacchetto: - |
Azione3.648 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
IC MCU 32BIT ARM 1022FPBGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
IC MPU QORLQ LX2 2GHZ 1517FCPBGA
|
pacchetto: - |
Request a Quote |
|
8 Core, 64-Bit | 2GHz | - | DDR4 | Yes | - | 100Gbps (2) | SATA 3.0 (4) | USB 3.0 (2) + PHY (2) | 1.2V, 1.8V, 3.3V | -40°C ~ 105°C (TJ) | Secure Boot, TrustZone® | 1517-BBGA, FCBGA | 1517-FCPBGA (40x40) |
||
Intel |
IC MPU INTEL 1.1GHZ 479FCBGA
|
pacchetto: - |
Request a Quote |
|
1 Core, 32-Bit | 1.1GHz | - | - | No | - | - | - | - | 956mV, 1.18V | 0°C ~ 100°C (TJ) | - | 479-BBGA, FCBGA | 479-FCBGA (35x35) |
||
Freescale Semiconductor |
IC MPU QORIQ P5 2GHZ 1295FCPBGA
|
pacchetto: - |
Request a Quote |
|
4 Core, 64-Bit | 2GHz | - | DDR3, DDR3L | No | - | 1Gbps (10), 10Gbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1V, 1.1V | 0°C ~ 105°C (TA) | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | 1295-BBGA, FCBGA | 1295-FCPBGA (37.5x37.5) |
||
IBM |
IBM25PPC750 - POWERPC 750GL RISC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Rochester Electronics, LLC |
MATH COPROCESSOR, CMOS
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
QUAD CORE WI-FI COMMUNICATIONS P
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
STMicroelectronics |
IC MPU AEC-Q100 600MHZ 361LFBGA
|
pacchetto: - |
Request a Quote |
|
2 Core, 32-Bit | 600MHz | ARM® Cortex®-M3, Multimedia; NEON | DDR3L, LPDDR2, SRAM | No | - | GBE (2) | - | USB 2.0 + PHY (2) | 3.3V | -40°C ~ 150°C (TJ) | AES, MD5, SHA-1/2, TRNG | 361-LFBGA | 361-LFBGA (16x16) |
||
STMicroelectronics |
Linear IC's
|
pacchetto: - |
Request a Quote |
|
1 Core, 32-Bit | 1GHz | Multimedia; NEON™ SIMD | DDR3, DDR3L, LPDDR2, LPDDR3 | Yes | LCD | 10/100/1000Mbps (2) | - | USB 2.0 (2) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TJ) | AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage | 289-LFBGA | 289-LFBGA (14x14) |