Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MPU MPC85XX 1.0GHZ 783FCBGA
|
pacchetto: 783-BBGA, FCBGA |
Azione6.304 |
|
1 Core, 32-Bit | 1.0GHz | Signal Processing; SPE, Security; SEC | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
pacchetto: 561-FBGA |
Azione5.056 |
|
1 Core, 32-Bit | 667MHz | Communications; QUICC Engine | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | -40°C ~ 125°C (TA) | - | 561-FBGA | 561-TEPBGA1 (23x23) |
||
NXP |
IC MPU MPC85XX 1.25GHZ 783FCBGA
|
pacchetto: 783-BBGA, FCBGA |
Azione7.968 |
|
1 Core, 32-Bit | 1.25GHz | - | DDR2, DDR3 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (1) | USB 2.0 (2) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU M683XX 25MHZ 357BGA
|
pacchetto: 357-BBGA |
Azione3.792 |
|
1 Core, 32-Bit | 25MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | 5.0V | -40°C ~ 85°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC74XX 1.4GHZ 360FCCLGA
|
pacchetto: 360-CLGA, FCCLGA |
Azione2.496 |
|
1 Core, 32-Bit | 1.4GHz | Multimedia; SIMD | - | No | - | - | - | - | 1.5V, 1.8V, 2.5V | 0°C ~ 105°C (TA) | - | 360-CLGA, FCCLGA | 360-FCCLGA (25x25) |
||
NXP |
IC MPU MPC83XX 400MHZ 620BGA
|
pacchetto: 620-BBGA Exposed Pad |
Azione2.320 |
|
1 Core, 32-Bit | 400MHz | - | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU MPC82XX 200MHZ 408TBGA
|
pacchetto: 480-LBGA |
Azione7.136 |
|
1 Core, 32-Bit | 200MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | - | 3.3V | -40°C ~ 105°C (TA) | - | 480-LBGA | 408-TBGA (37.5x37.5) |
||
NXP |
IC MPU MPC85XX 667MHZ 783FCBGA
|
pacchetto: 783-BBGA, FCBGA |
Azione7.456 |
|
1 Core, 32-Bit | 667MHz | Security; SEC | DDR, SDRAM | No | - | 10/100/1000 Mbps (2) | - | - | 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC82XX 300MHZ 516BGA
|
pacchetto: 516-BBGA |
Azione3.072 |
|
1 Core, 32-Bit | 300MHz | Communications; RISC CPM, Security; SEC | DRAM, SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU E600 DUAL CORE 1023FCCBGA
|
pacchetto: 1023-BCBGA, FCCBGA |
Azione2.064 |
|
2 Core, 32-Bit | 1.0GHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 1023-BCBGA, FCCBGA | 1023-FCCBGA (33x33) |
||
NXP |
IC MPU MPC85XX 1.0GHZ 783FCBGA
|
pacchetto: 783-BBGA, FCBGA |
Azione4.784 |
|
1 Core, 32-Bit | 1.0GHz | Communications; CPM, Security; SEC | DDR, SDRAM | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 (1) | 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC85XX 667MHZ 783FCBGA
|
pacchetto: 783-BBGA, FCBGA |
Azione2.752 |
|
1 Core, 32-Bit | 667MHz | Communications; CPM | DDR, SDRAM | No | - | 10/100/1000 Mbps (2) | - | - | 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC SOC 4CORE 1400MHZ SW 780FCBGA
|
pacchetto: 780-FBGA, FCBGA |
Azione4.624 |
|
4 Core, 64-Bit | 1.4GHz | - | DDR3L/4 | No | - | 1 Gbps (12) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | 0°C ~ 105°C (TA) | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | 780-FBGA, FCBGA | 780-FCPBGA (23x23) |
||
NXP |
IC MPU MPC8XX 100MHZ 357BGA
|
pacchetto: 357-BBGA |
Azione2.944 |
|
1 Core, 32-Bit | 100MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1), 10/100 Mbps (1) | - | - | 3.3V | -40°C ~ 100°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU I.MX6S 800MHZ 624MAPBGA
|
pacchetto: 624-LFBGA |
Azione4.512 |
|
1 Core, 32-Bit | 800MHz | Multimedia; NEON? SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-LFBGA | 624-MAPBGA (21x21) |
||
NXP |
IC MPU MPC83XX 333MHZ 516BGA
|
pacchetto: 516-BBGA Exposed Pad |
Azione2.112 |
|
1 Core, 32-Bit | 333MHz | Security; SEC 2.2 | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) |
||
Intel |
IC MPU I960 33MHZ 132QFP
|
pacchetto: 132-BQFP Bumpered |
Azione4.640 |
|
1 Core, 32-Bit | 33MHz | - | - | No | - | - | - | - | 3.3V | 0°C ~ 100°C (TC) | - | 132-BQFP Bumpered | 132-QFP |
||
NXP |
QORIQ 4XCPU 64-BIT ARM ARCH 1.
|
pacchetto: - |
Azione7.376 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
I.MX 6QUADPLUS MPU 4X ARM CORTE
|
pacchetto: 624-FBGA, FCBGA |
Azione6.912 |
|
4 Core, 32-Bit | 1.2GHz | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | -20°C ~ 105°C (TJ) | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
NXP |
QORIQ 2XCPU 64-BIT ARM ARCH 1.
|
pacchetto: - |
Azione4.608 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
I.MX 6 SERIES 32-BIT MPU DUAL A
|
pacchetto: 569-LFBGA |
Azione5.040 |
|
4 Core, 32-Bit | 800MHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -20°C ~ 105°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 569-LFBGA | 569-MAPBGA (12x12) |
||
IBM |
IC MPU 166MHZ 278FCPBGA
|
pacchetto: - |
Request a Quote |
|
1 Core, 32-Bit | 166MHz | - | - | No | - | - | - | - | 2.5V, 3.3V | 0°C ~ 105°C (TJ) | - | 278-BBGA, FCBGA | 278-FCPBGA (21x21) |
||
Intel |
IC MPU 360 1.4GHZ 478PPGA
|
pacchetto: - |
Request a Quote |
|
1 Core, 64-Bit | 1.4GHz | - | - | - | - | - | - | - | 1.26V, 1.004V, 1.292V | 100°C (TJ) | - | 478-PGA | 478-PPGA (35x35) |
||
Harris Corporation |
HIGH PERFORMANCE MICROPROCESSOR,
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, 16-BIT
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Motorola |
RISC MICROPROCESSOR, 32 BIT, POW
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Intel |
DOTHAN
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Rochester Electronics, LLC |
DUAL MARKED (5962-8854702QA)
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |