Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
|
pacchetto: 783-BBGA, FCBGA |
Azione5.088 |
|
1 Core, 32-Bit | 800MHz | Signal Processing; SPE | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (2) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU I.MX51 600MHZ 529BGA
|
pacchetto: 529-LFBGA |
Azione7.072 |
|
1 Core, 32-Bit | 600MHz | Multimedia; NEON? SIMD | LPDDR, DDR2 | No | Keypad, LCD | 10/100 Mbps (1) | - | USB 2.0 (3), USB 2.0 + PHY (1) | 1.2V, 1.875V, 2.775V, 3.0V | -40°C ~ 95°C (TC) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | 529-LFBGA | 529-BGA Case 2017 (19x19) |
||
NXP |
IC MPU MPC85XX 1.333GHZ 783BGA
|
pacchetto: 783-BBGA, FCBGA |
Azione4.192 |
|
1 Core, 32-Bit | 1.333GHz | Security; SEC | DDR2, DDR3 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 (3) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
IDT, Integrated Device Technology Inc |
IC MPU INTERPRISE 350MHZ 256BGA
|
pacchetto: 256-LBGA |
Azione4.032 |
|
1 Core, 32-Bit | 350MHz | - | DDR | No | - | 10/100 Mbps (1) | - | - | 3.3V | -40°C ~ 85°C (TA) | - | 256-LBGA | 256-CABGA (17x17) |
||
NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
|
pacchetto: 783-BBGA, FCBGA |
Azione7.328 |
|
1 Core, 32-Bit | 800MHz | Signal Processing; SPE, Security; SEC | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU M683XX 20MHZ 144LQFP
|
pacchetto: 144-LQFP |
Azione5.440 |
|
1 Core, 8/16-Bit | 20MHz | Communications; RISC CPM | DRAM | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
IC MPU MPC74XX 1.0GHZ 483FCCBGA
|
pacchetto: 483-BCBGA, FCCBGA |
Azione5.584 |
|
1 Core, 32-Bit | 1.0GHz | Multimedia; SIMD | - | No | - | - | - | - | 1.5V, 1.8V, 2.5V | 0°C ~ 105°C (TA) | - | 483-BCBGA, FCCBGA | 483-FCCBGA (29x29) |
||
Microchip Technology |
IC MPU 68000 25MHZ 196CQFP
|
pacchetto: 196-BCQFP |
Azione4.528 |
|
1 Core, 32-Bit | 25MHz | - | - | No | - | - | - | - | 5.0V | -55°C ~ 125°C (TC) | - | 196-BCQFP | 196-CQFP (34x34) |
||
Zilog |
IC MPU Z180 8MHZ 64DIP
|
pacchetto: 64-DIP (0.750", 19.05mm) |
Azione2.160 |
|
1 Core, 8-Bit | 8MHz | - | DRAM | No | - | - | - | - | 5.0V | -40°C ~ 100°C (TA) | - | 64-DIP (0.750", 19.05mm) | 64-DIP |
||
NXP |
IC MPU MPC7XX 400MHZ 360FCBGA
|
pacchetto: 360-BBGA, FCCBGA |
Azione27.016.356 |
|
1 Core, 32-Bit | 400MHz | - | - | No | - | - | - | - | 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 360-BBGA, FCCBGA | 360-FCPBGA (25x25) |
||
NXP |
IC MPU MPC8XX 66MHZ 357BGA
|
pacchetto: 357-BBGA |
Azione5.664 |
|
1 Core, 32-Bit | 66MHz | Communications; CPM | DRAM | No | - | 10 Mbps (2), 10/100 Mbps (1) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC82XX 266MHZ 516BGA
|
pacchetto: 516-BBGA |
Azione7.056 |
|
1 Core, 32-Bit | 266MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | 3.3V | -40°C ~ 105°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU MPC83XX 400MHZ 620BGA
|
pacchetto: 620-BBGA Exposed Pad |
Azione6.672 |
|
1 Core, 32-Bit | 400MHz | - | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
Texas Instruments |
AEGIS 1.3 .8G EXT TEMP
|
pacchetto: 491-LFBGA |
Azione6.800 |
|
1 Core, 32-Bit | 800MHz | Multimedia; NEON? SIMD | LPDDR2, DDR3, DDR3L | No | TSC, WXGA | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | -40°C ~ 105°C (TJ) | Crypto Accelerator | 491-LFBGA | 491-NFBGA (17x17) |
||
NXP |
IC MPU I.MC6UL 528MHZ 289BGA
|
pacchetto: 289-LFBGA |
Azione19.800 |
|
1 Core, 32-Bit | 528MHz | Multimedia; NEON? SIMD | LPDDR2, DDR3, DDR3L | No | LCD, LVDS | 10/100 Mbps (2) | - | USB 2.0 + PHY (2) | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | 289-LFBGA | 289-MAPBGA (14x14) |
||
Renesas Electronics America |
IC MPU 80C286 12.5MHZ 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione4.928 |
|
1 Core, 16-Bit | 12.5MHz | Math Engine; 80C287 | - | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 68-LCC (J-Lead) | 68-PLCC (24.23x24.23) |
||
NXP |
LS2044A XT WE 1800 R1.1
|
pacchetto: - |
Azione3.040 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
QORIQ 64B POWER ARCH 8X 1.5GHZ
|
pacchetto: - |
Azione5.392 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
QORIQ 4XCPU 64-BIT ARM ARCH 1.
|
pacchetto: - |
Azione4.432 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
I.MX6ULL ROM PERF ENHAN
|
pacchetto: 289-LFBGA |
Azione6.960 |
|
1 Core, 32-Bit | 900MHz | Multimedia; NEON™ MPE | LPDDR2, DDR3, DDR3L | No | Electrophoretic, LCD | 10/100 Mbps (2) | - | USB 2.0 OTG + PHY (2) | 1.8V, 2.8V, 3.3V | 0°C ~ 95°C (TJ) | A-HAB, ARM TZ, CSU, SJC, SNVS | 289-LFBGA | 289-MAPBGA (14x14) |
||
Advantech Corp |
XEON 2.1G 22M 3647P 16C 6130 87C
|
pacchetto: - |
Azione2.016 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
RZ/V2H CA55 QUAD GPU SECURE 19MM
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Texas Instruments |
IC MPU DRA72X CORTEX-A15 760BGA
|
pacchetto: - |
Request a Quote |
|
1 Core, 32-Bit | 750MHz | ARM® Cortex®-M4, BB2D, C66x, GPU, IVA | DDR3, DDR3L | Yes | HDMI, LCD | 10/100/1000Mbps (1), 1Gbps (2) | SATA | USB 2.0 (2), USB 3.0 (1) | 1.35V, 1.5V, 1.8V, 3.3V | -40°C ~ 125°C (TJ) | Cryptography, Debug Security, Device Identity, Isolation Firewalls, Secure Boot, Secure Storage, Software IP Protection | 760-BFBGA, FCBGA | 760-FCBGA (23x23) |
||
Intel |
MOBILE CELERON PROCESSOR
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Freescale Semiconductor |
IC MPU MPC82XX 300MHZ 480TBGA
|
pacchetto: - |
Request a Quote |
|
1 Core, 32-Bit | 300MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100Mbps (3) | - | USB 2.0 (1) | 3.3V | -40°C ~ 105°C (TJ) | - | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) |
||
IBM |
IC MPU IBM25PPC750 600MHZ 474BGA
|
pacchetto: - |
Request a Quote |
|
1 Core, 32-Bit | 600MHz | - | - | No | - | - | - | - | 2.5V | -40°C ~ 105°C (TJ) | - | 474-BCBGA Exposed Pad | 474-CBGA (25x32.5) |
||
Renesas Electronics Corporation |
IC MPU RZ/G 1GHZ 266BGA
|
pacchetto: - |
Azione4.224 |
|
1 Core, 16-Bit | 1GHz | - | DDR3L, DDR4 | No | - | GbE (1) | - | USB 2.0 (2) | - | -40°C ~ 85°C (TA) | AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG | 266-BGA | 266-BGA (11x11) |
||
NXP |
I.MX 8SOLOXLITE A1 PRODUCTION PN
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |