Pagina 17 - Embedded - Microcontroller, microprocessori, moduli FPGA | Circuiti integrati (CI)

Numero di parte	Produttore	Descrizione	pacchetto	Azione	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-WMX-LD79-QTC	Digi International	CONNECTCORE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione2.848	-	-	-	-	-	-	-	-
CC-9P-V225-Z1	Digi International	CONNECTCORE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione5.008	-	-	-	-	-	-	-	-
MOD5270BXX	NXP	MOD NETBURNER MOD5270 10 UNITS Module/Board Type: MCU, Ethernet Core Core Processor: ColdFire 5270 Co-Processor: - Speed: 95MHz Flash Size: 512KB RAM Size: 2.064MB Connector Type: RJ-45, 2x50 Header Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione4.048	ColdFire 5270	-	95MHz	512KB	2.064MB	RJ-45, 2x50 Header	2.6" x 2" (66.04mm x 50.8mm)	0°C ~ 70°C
FS-3006	Digi International	MODULE 64MB SDRAM 64MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione7.472	-	-	-	-	-	-	-	-
20-101-0675	Digi International	MODULE RABBITCORE RCM3710 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 22.1MHz Flash Size: 256KB (Internal), 1MB (External) RAM Size: 128KB Connector Type: IDC Header 2x20 Size / Dimension: 1.2" x 2.95" (30mm x 75mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione4.192	Rabbit 3000	-	22.1MHz	256KB (Internal), 1MB (External)	128KB	IDC Header 2x20	1.2" x 2.95" (30mm x 75mm)	0°C ~ 70°C
20-101-0674	Digi International	MODULE RABBITCORE RCM3700 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 22.1MHz Flash Size: 512KB (Internal), 1MB (External) RAM Size: 512KB Connector Type: IDC Header 2x20 Size / Dimension: 1.2" x 2.95" (30mm x 75mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione2.368	Rabbit 3000	-	22.1MHz	512KB (Internal), 1MB (External)	512KB	IDC Header 2x20	1.2" x 2.95" (30mm x 75mm)	0°C ~ 70°C
EZ80L925048MOD	Zilog	IC WEBSERVER 48MHZ 1MB MOD Module/Board Type: MCU Core Core Processor: eZ80L92 Co-Processor: - Speed: 48MHz Flash Size: 1MB RAM Size: 512KB Connector Type: Header 2x25 Size / Dimension: 2.5" x 2.5" (64mm x 64mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione5.904	eZ80L92	-	48MHz	1MB	512KB	Header 2x25	2.5" x 2.5" (64mm x 64mm)	0°C ~ 70°C
CC-9C-V212-ZA-B	Digi International	MODULE 9C 16MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9360 Co-Processor: - Speed: 155MHz Flash Size: 4MB RAM Size: 16MB Connector Type: SO-DIMM-144 Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione6.752	ARM926EJ-S, NS9360	-	155MHz	4MB	16MB	SO-DIMM-144	3.59" x 2.06" (91.2mm x 52.2mm)	-40°C ~ 85°C
TE0600-03BM	Trenz Electronic GmbH	FPGA MICROMOD SPARTAN-6 LX Module/Board Type: FPGA Core Processor: Spartan-6 LX-100 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione5.424	Spartan-6 LX-100	-	125MHz	16MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
TE0722-02	Trenz Electronic GmbH	SOM ZYNQ SOFT PROPELLER 40DIP Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7010) Speed: 33MHz Flash Size: 16MB RAM Size: - Connector Type: 40 Pin Size / Dimension: 0.71" x 2.01" (18mm x 51mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione7.776	ARM Cortex-A9	Zynq-7000 (Z-7010)	33MHz	16MB	-	40 Pin	0.71" x 2.01" (18mm x 51mm)	0°C ~ 70°C
TE0741-03-410-2CF	Trenz Electronic GmbH	SOM KINTEX-7 410T 32MB FLASH AES Module/Board Type: FPGA Core Processor: Kintex-7 410T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione3.536	Kintex-7 410T	-	200MHz	32MB	-	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
TE0715-04-15-1I	Trenz Electronic GmbH	SOM ZYNQ XC7Z015-1I 1GB DDR3 Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7015) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione6.204	ARM Cortex-A9	Zynq-7000 (Z-7015)	125MHz	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
DC-ME4-01T-DYN-1	Digi International	MODULE DIGI CONNECT ME Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione4.544	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
TE0818-01-6BE21-A	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Request a Quote	Zynq UltraScale+ XCZU6EG-1FFVC900E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0820-04-4DE21FA	Trenz Electronic GmbH	MOD MPSOC ZU4EV-1E 2GB DDR4 IND Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Request a Quote	Zynq UltraScale+ XCZU4EV-1SFVC784E	-	-	128MB	2GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
ME-ZX5-15-2I-D10-R3-2	Enclustra FPGA Solutions	SOM ZYNQ 7Z015 1GB Module/Board Type: FPGA Core Core Processor: ARM® Dual-Core Cortex-A9 Co-Processor: Artix-7, Kintex-7 Speed: 1GHz Flash Size: 512MB RAM Size: 512MB, 1GB Connector Type: 168 Pin Size / Dimension: 2.200" L x 2.130" W (56.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione291	ARM® Dual-Core Cortex-A9	Artix-7, Kintex-7	1GHz	512MB	512MB, 1GB	168 Pin	2.200" L x 2.130" W (56.00mm x 54.00mm)	-40°C ~ 85°C
TE0865-02-FBE23MA	Trenz Electronic GmbH	MPSOC MODULE WITH ZYNQ ULTRASCAL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E Co-Processor: - Speed: - Flash Size: 256MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Request a Quote	Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E	-	-	256MB	4GB	Board-to-Board (BTB) Socket	3.937" L x 2.953" W (100.00mm x 75.00mm)	0°C ~ 85°C
TE0714-04-42I-7-B	Trenz Electronic GmbH	IC MODULE ARTIX-7 Module/Board Type: FPGA Core Processor: Artix-7 A35T Co-Processor: Artix-7 Speed: - Flash Size: 16MB RAM Size: - Connector Type: - Size / Dimension: 1.570" L x 1.180" W (40.00mm x 30.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	Artix-7 A35T	Artix-7	-	16MB	-	-	1.570" L x 1.180" W (40.00mm x 30.00mm)	-40°C ~ 85°C
ME-XU8-7EV-2I-D12E-R2-1	Enclustra FPGA Solutions	SOM ZYNQ US+ ZU7EV 4GB+2GB PL Module/Board Type: MPU, FPGA Core Core Processor: ARM® Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 2GB, 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM® Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU	-	533MHz, 1.333GHz	16GB	2GB, 4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TE0720-03-61Q33FA	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: 125MHz Flash Size: 4GB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	125MHz	4GB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0720-04-61Q33MA	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: Ethernet Core Core Processor: ARM® Cortex®-A9 Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM® Cortex®-A9	-	-	32MB	1GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
ME-XU1-9EG-3E-D12E-R4-2	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU9EG Module/Board Type: FPGA Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	0°C ~ 85°C
TE0726-03-11C64-A	Trenz Electronic GmbH	IC MODULE ZYNQBERRY Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7007S) Speed: - Flash Size: 16MB RAM Size: 512MB Connector Type: CSI, DSI Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7007S)	-	16MB	512MB	CSI, DSI	1.180" L x 1.570" W (30.00mm x 40.00mm)	0°C ~ 70°C
ME-XU9-5EV-1I-D12E-L11-R2-1	Enclustra FPGA Solutions	SOM XU9 ZYNQ 5EV REV2.1 Module/Board Type: FPGA Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	533MHz, 1.333GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
CC-WMX-FS7D-NN	Digi	CONNECTCORE 8M NANO, QUAD CORE, Module/Board Type: MCU Core Core Processor: ARM® Cortex®-A53 Co-Processor: ARM® Cortex®-M7 Speed: 600MHz, 1.4GHz Flash Size: - RAM Size: 1GB Connector Type: USB Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM® Cortex®-A53	ARM® Cortex®-M7	600MHz, 1.4GHz	-	1GB	USB	1.770" L x 1.570" W (45.00mm x 40.00mm)	-40°C ~ 85°C
ME-XU7-9EG-2I-D12E-R4-1	Enclustra FPGA Solutions	SOM ZYNQ XU7 US+ ZU9EG Module/Board Type: FPGA Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	533MHz, 1.333GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
DC-ME4-01T-CLI	Digi	MODULE ME Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Request a Quote	-	-	-	-	-	-	-	-
TE0741-04-B2C-1-AF	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: FPGA Core Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FFG676C Co-Processor: - Speed: - Flash Size: 32MB RAM Size: - Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Request a Quote	Xilinx Kintex-7 FPGA XC7K160T-2FFG676C	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C

CC-WMX-LD79-QTC

Digi International

CONNECTCORE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione2.848

-

CC-9P-V225-Z1

Digi International

CONNECTCORE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione5.008

-

MOD5270BXX

NXP

MOD NETBURNER MOD5270 10 UNITS

Module/Board Type: MCU, Ethernet Core
Core Processor: ColdFire 5270
Co-Processor: -
Speed: 95MHz
Flash Size: 512KB
RAM Size: 2.064MB
Connector Type: RJ-45, 2x50 Header
Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione4.048

ColdFire 5270

-

95MHz

512KB

2.064MB

RJ-45, 2x50 Header

2.6" x 2" (66.04mm x 50.8mm)

0°C ~ 70°C

FS-3006

Digi International

MODULE 64MB SDRAM 64MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione7.472

-

20-101-0675

Digi International

MODULE RABBITCORE RCM3710

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 256KB (Internal), 1MB (External)
RAM Size: 128KB
Connector Type: IDC Header 2x20
Size / Dimension: 1.2" x 2.95" (30mm x 75mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione4.192

Rabbit 3000

-

22.1MHz

256KB (Internal), 1MB (External)

128KB

IDC Header 2x20

1.2" x 2.95" (30mm x 75mm)

0°C ~ 70°C

20-101-0674

Digi International

MODULE RABBITCORE RCM3700

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 512KB (Internal), 1MB (External)
RAM Size: 512KB
Connector Type: IDC Header 2x20
Size / Dimension: 1.2" x 2.95" (30mm x 75mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione2.368

Rabbit 3000

-

22.1MHz

512KB (Internal), 1MB (External)

512KB

IDC Header 2x20

1.2" x 2.95" (30mm x 75mm)

0°C ~ 70°C

EZ80L925048MOD

Zilog

IC WEBSERVER 48MHZ 1MB MOD

Module/Board Type: MCU Core
Core Processor: eZ80L92
Co-Processor: -
Speed: 48MHz
Flash Size: 1MB
RAM Size: 512KB
Connector Type: Header 2x25
Size / Dimension: 2.5" x 2.5" (64mm x 64mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione5.904

eZ80L92

-

48MHz

1MB

512KB

Header 2x25

2.5" x 2.5" (64mm x 64mm)

0°C ~ 70°C

CC-9C-V212-ZA-B

Digi International

MODULE 9C 16MB SDRAM 4MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9360
Co-Processor: -
Speed: 155MHz
Flash Size: 4MB
RAM Size: 16MB
Connector Type: SO-DIMM-144
Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione6.752

ARM926EJ-S, NS9360

-

155MHz

4MB

16MB

SO-DIMM-144

3.59" x 2.06" (91.2mm x 52.2mm)

-40°C ~ 85°C

TE0600-03BM

Trenz Electronic GmbH

FPGA MICROMOD SPARTAN-6 LX

Module/Board Type: FPGA
Core Processor: Spartan-6 LX-100
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione5.424

Spartan-6 LX-100

-

125MHz

16MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

TE0722-02

Trenz Electronic GmbH

SOM ZYNQ SOFT PROPELLER 40DIP

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7010)
Speed: 33MHz
Flash Size: 16MB
RAM Size: -
Connector Type: 40 Pin
Size / Dimension: 0.71" x 2.01" (18mm x 51mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione7.776

ARM Cortex-A9

Zynq-7000 (Z-7010)

33MHz

16MB

-

40 Pin

0.71" x 2.01" (18mm x 51mm)

0°C ~ 70°C

TE0741-03-410-2CF

Trenz Electronic GmbH

SOM KINTEX-7 410T 32MB FLASH AES

Module/Board Type: FPGA
Core Processor: Kintex-7 410T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione3.536

Kintex-7 410T

-

200MHz

32MB

-

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

TE0715-04-15-1I

Trenz Electronic GmbH

SOM ZYNQ XC7Z015-1I 1GB DDR3

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7015)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione6.204

ARM Cortex-A9

Zynq-7000 (Z-7015)

125MHz

32MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

DC-ME4-01T-DYN-1

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione4.544

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

TE0818-01-6BE21-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

Request a Quote

Zynq UltraScale+ XCZU6EG-1FFVC900E

-

128MB

4GB

Board-to-Board (BTB) Socket - 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

TE0820-04-4DE21FA

Trenz Electronic GmbH

MOD MPSOC ZU4EV-1E 2GB DDR4 IND

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

Request a Quote

Zynq UltraScale+ XCZU4EV-1SFVC784E

-

128MB

2GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

ME-ZX5-15-2I-D10-R3-2

Enclustra FPGA Solutions

SOM ZYNQ 7Z015 1GB

Module/Board Type: FPGA Core
Core Processor: ARM® Dual-Core Cortex-A9
Co-Processor: Artix-7, Kintex-7
Speed: 1GHz
Flash Size: 512MB
RAM Size: 512MB, 1GB
Connector Type: 168 Pin
Size / Dimension: 2.200" L x 2.130" W (56.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione291

ARM® Dual-Core Cortex-A9

Artix-7, Kintex-7

1GHz

512MB

512MB, 1GB

168 Pin

2.200" L x 2.130" W (56.00mm x 54.00mm)

-40°C ~ 85°C

TE0865-02-FBE23MA

Trenz Electronic GmbH

MPSOC MODULE WITH ZYNQ ULTRASCAL

Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E
Co-Processor: -
Speed: -
Flash Size: 256MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

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Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E

-

256MB

4GB

Board-to-Board (BTB) Socket

3.937" L x 2.953" W (100.00mm x 75.00mm)

0°C ~ 85°C

TE0714-04-42I-7-B

Trenz Electronic GmbH

IC MODULE ARTIX-7

Module/Board Type: FPGA
Core Processor: Artix-7 A35T
Co-Processor: Artix-7
Speed: -
Flash Size: 16MB
RAM Size: -
Connector Type: -
Size / Dimension: 1.570" L x 1.180" W (40.00mm x 30.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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Artix-7 A35T

Artix-7

-

16MB

-

1.570" L x 1.180" W (40.00mm x 30.00mm)

-40°C ~ 85°C

ME-XU8-7EV-2I-D12E-R2-1

Enclustra FPGA Solutions

SOM ZYNQ US+ ZU7EV 4GB+2GB PL

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU
Co-Processor: -
Speed: 533MHz, 1.333GHz
Flash Size: 16GB
RAM Size: 2GB, 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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ARM® Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU

-

533MHz, 1.333GHz

16GB

2GB, 4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

TE0720-03-61Q33FA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: 125MHz
Flash Size: 4GB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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ARM Cortex-A9

Zynq-7000 (Z-7020)

125MHz

4GB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0720-04-61Q33MA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: Ethernet Core
Core Processor: ARM® Cortex®-A9
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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ARM® Cortex®-A9

-

32MB

1GB

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

ME-XU1-9EG-3E-D12E-R4-2

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU9EG

Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

600MHz, 1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

0°C ~ 85°C

TE0726-03-11C64-A

Trenz Electronic GmbH

IC MODULE ZYNQBERRY

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7007S)
Speed: -
Flash Size: 16MB
RAM Size: 512MB
Connector Type: CSI, DSI
Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

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ARM Cortex-A9

Zynq-7000 (Z-7007S)

-

16MB

512MB

CSI, DSI

1.180" L x 1.570" W (30.00mm x 40.00mm)

0°C ~ 70°C

ME-XU9-5EV-1I-D12E-L11-R2-1

Enclustra FPGA Solutions

SOM XU9 ZYNQ 5EV REV2.1

Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 533MHz, 1.333GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

533MHz, 1.333GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

CC-WMX-FS7D-NN

Digi

CONNECTCORE 8M NANO, QUAD CORE,

Module/Board Type: MCU Core
Core Processor: ARM® Cortex®-A53
Co-Processor: ARM® Cortex®-M7
Speed: 600MHz, 1.4GHz
Flash Size: -
RAM Size: 1GB
Connector Type: USB
Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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ARM® Cortex®-A53

ARM® Cortex®-M7

600MHz, 1.4GHz

-

1GB

USB

1.770" L x 1.570" W (45.00mm x 40.00mm)

-40°C ~ 85°C

ME-XU7-9EG-2I-D12E-R4-1

Enclustra FPGA Solutions

SOM ZYNQ XU7 US+ ZU9EG

Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 533MHz, 1.333GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

533MHz, 1.333GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

DC-ME4-01T-CLI

Digi

MODULE ME

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Request a Quote

-

TE0741-04-B2C-1-AF

Trenz Electronic GmbH

MODULE FPGA KINTEX

Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FFG676C
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: -
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

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Xilinx Kintex-7 FPGA XC7K160T-2FFG676C

-

32MB

-

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C