Pagina 20 - Embedded - Microcontroller, microprocessori, moduli FPGA | Circuiti integrati (CI)

Numero di parte	Produttore	Descrizione	pacchetto	Azione	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-MX-KD47-ZM-B	Digi International	CONNECTCORE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione5.568	-	-	-	-	-	-	-	-
DLP-2232H-SF	DLP Design Inc.	MOD USB-MCU/FPGA W/FT2232H Module/Board Type: MCU/FPGA, USB Core Core Processor: SmartFusion, A2F200M3F Co-Processor: FT2232H Speed: 100MHz Flash Size: 256KB RAM Size: 64KB (Internal), 4MB (External) Connector Type: USB - B, Pin Header Size / Dimension: 3" x 1.2" (76.2mm x 30.5mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione5.584	SmartFusion, A2F200M3F	FT2232H	100MHz	256KB	64KB (Internal), 4MB (External)	USB - B, Pin Header	3" x 1.2" (76.2mm x 30.5mm)	0°C ~ 70°C
20-101-1276	Digi International	RABBITCORE MOD RCM5400W JAPAN Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione3.184	-	-	-	-	-	-	-	-
20-101-1087	Digi International	BOARD PROTO RCM3365 RS232 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione3.600	-	-	-	-	-	-	-	-
101-1067	Digi International	MODULE RABBITCORE RCM3305 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB (Internal), 8MB (External) RAM Size: 1MB Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -40°C ~ 70°C	pacchetto: -	Azione5.904	Rabbit 3000	-	44.2MHz	512KB (Internal), 8MB (External)	1MB	2 IDC Headers 2x17, 1 IDC Header 2x5	1.85" x 2.73" (47mm x 69mm)	-40°C ~ 70°C
CENGLH7A404-11-504HCR	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A404 Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione5.696	ARM922T, LH7A404	-	200MHz	32MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
MOD5272-100	NetBurner Inc.	PROCESSOR MODULE FLASH Module/Board Type: MCU, Ethernet Core Core Processor: ColdFire 5272 Co-Processor: - Speed: 62MHz Flash Size: 2MB RAM Size: 8.004MB Connector Type: RJ-45, 2x50 Header Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione4.944	ColdFire 5272	-	62MHz	2MB	8.004MB	RJ-45, 2x50 Header	2.6" x 2" (66.04mm x 50.8mm)	0°C ~ 70°C
CC-MX-LD79-ZK	Digi International	MODULE I.MX53 800MHZ 512MB FLASH Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, i.MX53 Co-Processor: - Speed: 800MHz Flash Size: 512MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 360 Size / Dimension: 3.23" x 1.97" (82mm x 50mm Operating Temperature: -20°C ~ 85°C	pacchetto: -	Azione7.776	ARM? Cortex?-A8, i.MX53	-	800MHz	512MB	1GB	Board-to-Board (BTB) Socket - 360	3.23" x 1.97" (82mm x 50mm	-20°C ~ 85°C
CC-9P-V513-LX	Digi International	MODULE 9P 16MB SDRAM 8MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9215 Co-Processor: - Speed: 150MHz Flash Size: 8MB RAM Size: 16MB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 1.97" x 1.97" (50mm x 50mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione5.616	ARM926EJ-S, NS9215	-	150MHz	8MB	16MB	Board-to-Board (BTB) Socket - 160	1.97" x 1.97" (50mm x 50mm)	-40°C ~ 85°C
20-101-1247	Digi International	CORE MODULE RCM5450W Module/Board Type: MPU Core Core Processor: Rabbit 5000 Co-Processor: - Speed: 73.73MHz Flash Size: 3MB RAM Size: 1.5MB Connector Type: IDC Header 2x25, 2x5, 1xAntenna Size / Dimension: 1.84" x 2.85" (47mm x 72mm) Operating Temperature: -30°C ~ 75°C	pacchetto: -	Azione7.120	Rabbit 5000	-	73.73MHz	3MB	1.5MB	IDC Header 2x25, 2x5, 1xAntenna	1.84" x 2.85" (47mm x 72mm)	-30°C ~ 75°C
SOMOMAPL138-10-1603AHCR	Logic	OMAPL138 SOM-M1 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione4.592	-	-	-	-	-	-	-	-
AM0010-02-3BI21MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ ZU3EG-1I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 2.205" L x 1.575" W (56.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	Zynq™ UltraScale+™ ZU3EG-1I	-	-	128MB	4GB	Board-to-Board (BTB) Socket	2.205" L x 1.575" W (56.00mm x 40.00mm)	-40°C ~ 85°C
TE0820-05-4DE21MA	Trenz Electronic GmbH	MOD MPSOC ZU4EV-1E 2GB DDR4 IND Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0820-04-40121MA	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Request a Quote	-	-	-	-	-	-	-	-
TE0710-03-42C21-A	Trenz Electronic GmbH	IC MOD ARTIX-7 A35T 100MHZ 512MB Module/Board Type: FPGA Core Processor: Artix™ 7 XC7A35T-2CSG324C Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 512MB Connector Type: 2 x 100 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Request a Quote	Artix™ 7 XC7A35T-2CSG324C	-	-	32MB	512MB	2 x 100 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
CC-MX-L77C-Z1	Digi	CONNECTCORE 6 I-DL-4-1 Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A9, i.MX6 Co-Processor: - Speed: 800MHz Flash Size: 4GB RAM Size: 1GB Connector Type: - Size / Dimension: - Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM® Cortex®-A9, i.MX6	-	800MHz	4GB	1GB	-	-	-40°C ~ 85°C
TE0714-03-35-2I3	Trenz Electronic GmbH	IC MODULE ARTIX-7 Module/Board Type: FPGA Core Processor: Artix-7 A35T Co-Processor: Artix-7 Speed: - Flash Size: 16MB RAM Size: - Connector Type: - Size / Dimension: 1.570" L x 1.180" W (40.00mm x 30.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	Artix-7 A35T	Artix-7	-	16MB	-	-	1.570" L x 1.180" W (40.00mm x 30.00mm)	-40°C ~ 85°C
TE0820-05-2BE21MA	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: MPU Core Core Processor: ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Request a Quote	ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
20-109-0198	Digi	20-109-0198 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 22.1MHz Flash Size: 512KB RAM Size: 512KB Connector Type: Header Size / Dimension: 3.860" L x 2.010" W (98.00mm x 51.00mm) Operating Temperature: -40°C ~ 70°C	pacchetto: -	Request a Quote	Rabbit 2000	-	22.1MHz	512KB	512KB	Header	3.860" L x 2.010" W (98.00mm x 51.00mm)	-40°C ~ 70°C
TE0818-01-9BE21-A	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Request a Quote	Zynq UltraScale+ XCZU9EG-1FFVC900E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0820-05-2AI21MA	Trenz Electronic GmbH	MOD MPSOC ZU2CG-1I 2GB DDR4 IN Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione36	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
ATSAMA5D27-WLSOM1	Microchip Technology	SAMA5D2 WIRELESS SOM Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A5 Co-Processor: - Speed: 500MHz Flash Size: 8MB RAM Size: 256MB Connector Type: Edge Connector Size / Dimension: 1.610" L x 1.610" W (40.80mm x 40.80mm) Operating Temperature: -40°C ~ 85°C (TA)	pacchetto: -	Azione72	ARM® Cortex®-A5	-	500MHz	8MB	256MB	Edge Connector	1.610" L x 1.610" W (40.80mm x 40.80mm)	-40°C ~ 85°C (TA)
XP1001000-05R-AP	Lantronix, Inc.	XPORT 05R, BULK, ASIA PAC, ROHS Module/Board Type: Ethernet Core Core Processor: DSTni-EX Co-Processor: - Speed: 25MHz Flash Size: 512KB RAM Size: 256KB Connector Type: RJ-45 Size / Dimension: 1.330" L x 0.640" W (33.90mm x 16.25mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	DSTni-EX	-	25MHz	512KB	256KB	RJ-45	1.330" L x 0.640" W (33.90mm x 16.25mm)	-40°C ~ 85°C
TE0808-05-BBE21-AK	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Request a Quote	Zynq UltraScale+ XCZU15EG-1FFVC900E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 160	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0817-01-7DI21-A	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	Zynq UltraScale+ XCZU7EV-1FBVB900I	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C
ME-CA1-115-7I-D8-R6-1	Enclustra FPGA Solutions	ME-CA1-115-7I-D8-R6.1 Module/Board Type: MPU Core Core Processor: Intel Cyclone IV Co-Processor: EP4CE115F23I7N Speed: 260MHz Flash Size: 16MB RAM Size: 256MB Connector Type: 168 Pin Size / Dimension: 2.200" L x 2.130" W (56.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	Intel Cyclone IV	EP4CE115F23I7N	260MHz	16MB	256MB	168 Pin	2.200" L x 2.130" W (56.00mm x 54.00mm)	-40°C ~ 85°C
TE0813-01-4BE11-A	Trenz Electronic GmbH	MODULE MPSOC 4GB DDR4 Module/Board Type: FPGA Core Core Processor: Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Request a Quote	Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E	-	-	128MB	2GB	Board-to-Board (BTB) Socket	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
ME-XU8-7EV-1E-D11E-R2-2	Enclustra FPGA Solutions	SOM ZYNQ XU8 US+ ZU7EV Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	533MHz, 1.333GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	0°C ~ 85°C

CC-MX-KD47-ZM-B

Digi International

CONNECTCORE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione5.568

-

DLP-2232H-SF

DLP Design Inc.

MOD USB-MCU/FPGA W/FT2232H

Module/Board Type: MCU/FPGA, USB Core
Core Processor: SmartFusion, A2F200M3F
Co-Processor: FT2232H
Speed: 100MHz
Flash Size: 256KB
RAM Size: 64KB (Internal), 4MB (External)
Connector Type: USB - B, Pin Header
Size / Dimension: 3" x 1.2" (76.2mm x 30.5mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione5.584

SmartFusion, A2F200M3F

FT2232H

100MHz

256KB

64KB (Internal), 4MB (External)

USB - B, Pin Header

3" x 1.2" (76.2mm x 30.5mm)

0°C ~ 70°C

20-101-1276

Digi International

RABBITCORE MOD RCM5400W JAPAN

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione3.184

-

20-101-1087

Digi International

BOARD PROTO RCM3365 RS232

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione3.600

-

101-1067

Digi International

MODULE RABBITCORE RCM3305

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB (Internal), 8MB (External)
RAM Size: 1MB
Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: -40°C ~ 70°C

pacchetto: -

Azione5.904

Rabbit 3000

-

44.2MHz

512KB (Internal), 8MB (External)

1MB

2 IDC Headers 2x17, 1 IDC Header 2x5

1.85" x 2.73" (47mm x 69mm)

-40°C ~ 70°C

CENGLH7A404-11-504HCR

Logic

CARD ENGINE 64MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A404
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione5.696

ARM922T, LH7A404

-

200MHz

32MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

MOD5272-100

NetBurner Inc.

PROCESSOR MODULE FLASH

Module/Board Type: MCU, Ethernet Core
Core Processor: ColdFire 5272
Co-Processor: -
Speed: 62MHz
Flash Size: 2MB
RAM Size: 8.004MB
Connector Type: RJ-45, 2x50 Header
Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione4.944

ColdFire 5272

-

62MHz

2MB

8.004MB

RJ-45, 2x50 Header

2.6" x 2" (66.04mm x 50.8mm)

0°C ~ 70°C

CC-MX-LD79-ZK

Digi International

MODULE I.MX53 800MHZ 512MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, i.MX53
Co-Processor: -
Speed: 800MHz
Flash Size: 512MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 360
Size / Dimension: 3.23" x 1.97" (82mm x 50mm
Operating Temperature: -20°C ~ 85°C

pacchetto: -

Azione7.776

ARM? Cortex?-A8, i.MX53

-

800MHz

512MB

1GB

Board-to-Board (BTB) Socket - 360

3.23" x 1.97" (82mm x 50mm

-20°C ~ 85°C

CC-9P-V513-LX

Digi International

MODULE 9P 16MB SDRAM 8MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9215
Co-Processor: -
Speed: 150MHz
Flash Size: 8MB
RAM Size: 16MB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione5.616

ARM926EJ-S, NS9215

-

150MHz

8MB

16MB

Board-to-Board (BTB) Socket - 160

1.97" x 1.97" (50mm x 50mm)

-40°C ~ 85°C

20-101-1247

Digi International

CORE MODULE RCM5450W

Module/Board Type: MPU Core
Core Processor: Rabbit 5000
Co-Processor: -
Speed: 73.73MHz
Flash Size: 3MB
RAM Size: 1.5MB
Connector Type: IDC Header 2x25, 2x5, 1xAntenna
Size / Dimension: 1.84" x 2.85" (47mm x 72mm)
Operating Temperature: -30°C ~ 75°C

pacchetto: -

Azione7.120

Rabbit 5000

-

73.73MHz

3MB

1.5MB

IDC Header 2x25, 2x5, 1xAntenna

1.84" x 2.85" (47mm x 72mm)

-30°C ~ 75°C

SOMOMAPL138-10-1603AHCR

Logic

OMAPL138 SOM-M1

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione4.592

-

AM0010-02-3BI21MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ ZU3EG-1I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.205" L x 1.575" W (56.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Request a Quote

Zynq™ UltraScale+™ ZU3EG-1I

-

128MB

4GB

Board-to-Board (BTB) Socket

2.205" L x 1.575" W (56.00mm x 40.00mm)

-40°C ~ 85°C

TE0820-05-4DE21MA

Trenz Electronic GmbH

MOD MPSOC ZU4EV-1E 2GB DDR4 IND

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

Request a Quote

ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E

-

128MB

2GB

Pin(s)

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

TE0820-04-40121MA

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Request a Quote

-

TE0710-03-42C21-A

Trenz Electronic GmbH

IC MOD ARTIX-7 A35T 100MHZ 512MB

Module/Board Type: FPGA
Core Processor: Artix™ 7 XC7A35T-2CSG324C
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 512MB
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Request a Quote

Artix™ 7 XC7A35T-2CSG324C

-

32MB

512MB

2 x 100 Pin

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

CC-MX-L77C-Z1

Digi

CONNECTCORE 6 I-DL-4-1

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A9, i.MX6
Co-Processor: -
Speed: 800MHz
Flash Size: 4GB
RAM Size: 1GB
Connector Type: -
Size / Dimension: -
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Request a Quote

ARM® Cortex®-A9, i.MX6

-

800MHz

4GB

1GB

-

-40°C ~ 85°C

TE0714-03-35-2I3

Trenz Electronic GmbH

IC MODULE ARTIX-7

Module/Board Type: FPGA
Core Processor: Artix-7 A35T
Co-Processor: Artix-7
Speed: -
Flash Size: 16MB
RAM Size: -
Connector Type: -
Size / Dimension: 1.570" L x 1.180" W (40.00mm x 30.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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Artix-7 A35T

Artix-7

-

16MB

-

1.570" L x 1.180" W (40.00mm x 30.00mm)

-40°C ~ 85°C

TE0820-05-2BE21MA

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

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ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E

-

128MB

2GB

Pin(s)

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

20-109-0198

Digi

20-109-0198

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 512KB
RAM Size: 512KB
Connector Type: Header
Size / Dimension: 3.860" L x 2.010" W (98.00mm x 51.00mm)
Operating Temperature: -40°C ~ 70°C

pacchetto: -

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Rabbit 2000

-

22.1MHz

512KB

Header

3.860" L x 2.010" W (98.00mm x 51.00mm)

-40°C ~ 70°C

TE0818-01-9BE21-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

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Zynq UltraScale+ XCZU9EG-1FFVC900E

-

128MB

4GB

Board-to-Board (BTB) Socket - 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

TE0820-05-2AI21MA

Trenz Electronic GmbH

MOD MPSOC ZU2CG-1I 2GB DDR4 IN

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione36

ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I

-

128MB

2GB

Pin(s)

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

ATSAMA5D27-WLSOM1

Microchip Technology

SAMA5D2 WIRELESS SOM

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A5
Co-Processor: -
Speed: 500MHz
Flash Size: 8MB
RAM Size: 256MB
Connector Type: Edge Connector
Size / Dimension: 1.610" L x 1.610" W (40.80mm x 40.80mm)
Operating Temperature: -40°C ~ 85°C (TA)

pacchetto: -

Azione72

ARM® Cortex®-A5

-

500MHz

8MB

256MB

Edge Connector

1.610" L x 1.610" W (40.80mm x 40.80mm)

-40°C ~ 85°C (TA)

XP1001000-05R-AP

Lantronix, Inc.

XPORT 05R, BULK, ASIA PAC, ROHS

Module/Board Type: Ethernet Core
Core Processor: DSTni-EX
Co-Processor: -
Speed: 25MHz
Flash Size: 512KB
RAM Size: 256KB
Connector Type: RJ-45
Size / Dimension: 1.330" L x 0.640" W (33.90mm x 16.25mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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DSTni-EX

-

25MHz

512KB

256KB

RJ-45

1.330" L x 0.640" W (33.90mm x 16.25mm)

-40°C ~ 85°C

TE0808-05-BBE21-AK

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

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Zynq UltraScale+ XCZU15EG-1FFVC900E

-

128MB

4GB

Board-to-Board (BTB) Socket - 160

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

TE0817-01-7DI21-A

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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Zynq UltraScale+ XCZU7EV-1FBVB900I

-

128MB

4GB

Board-to-Board (BTB) Socket - 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

-40°C ~ 85°C

ME-CA1-115-7I-D8-R6-1

Enclustra FPGA Solutions

ME-CA1-115-7I-D8-R6.1

Module/Board Type: MPU Core
Core Processor: Intel Cyclone IV
Co-Processor: EP4CE115F23I7N
Speed: 260MHz
Flash Size: 16MB
RAM Size: 256MB
Connector Type: 168 Pin
Size / Dimension: 2.200" L x 2.130" W (56.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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Intel Cyclone IV

EP4CE115F23I7N

260MHz

16MB

256MB

168 Pin

2.200" L x 2.130" W (56.00mm x 54.00mm)

-40°C ~ 85°C

TE0813-01-4BE11-A

Trenz Electronic GmbH

MODULE MPSOC 4GB DDR4

Module/Board Type: FPGA Core
Core Processor: Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

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Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E

-

128MB

2GB

Board-to-Board (BTB) Socket

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

ME-XU8-7EV-1E-D11E-R2-2

Enclustra FPGA Solutions

SOM ZYNQ XU8 US+ ZU7EV

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 533MHz, 1.333GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

533MHz, 1.333GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

0°C ~ 85°C