Pagina 14 - Embedded - Microcontroller, microprocessori, moduli FPGA | Circuiti integrati (CI)

Numero di parte	Produttore	Descrizione	pacchetto	Azione	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-9P-V524-CC	Digi International	CONNECTCORE 9P Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9215 Co-Processor: - Speed: 150MHz Flash Size: 16MB RAM Size: 32MB Connector Type: - Size / Dimension: - Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione6.608	ARM926EJ-S, NS9215	-	150MHz	16MB	32MB	-	-	-40°C ~ 85°C
TE0741-02-160-2CF	Trenz Electronic GmbH	SOM KINTEX-7 160T 32MB FLASH AES Module/Board Type: FPGA Core Processor: Kintex-7 160T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione5.040	Kintex-7 160T	-	200MHz	32MB	-	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
TE0725-02-100-2C	Trenz Electronic GmbH	SOM ARTIX-7 100T FLASH 2C Module/Board Type: FPGA Core Processor: Artix-7 A100T Co-Processor: - Speed: 100MHz Flash Size: 32MB RAM Size: - Connector Type: 50 Pin Size / Dimension: 2.87" x 1.38" (73mm x 35mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione5.424	Artix-7 A100T	-	100MHz	32MB	-	50 Pin	2.87" x 1.38" (73mm x 35mm)	0°C ~ 70°C
DLP-2232H-PSOC5	DLP Design Inc.	MODULE PSOC5 USB ADAPTER FT2232H Module/Board Type: MCU, USB Core Core Processor: CY8C5588 Co-Processor: FT2232H Speed: 67MHz Flash Size: 256KB RAM Size: 64KB Connector Type: USB - B, Pin Header Size / Dimension: 3" x 1.2" (76.2mm x 30.5mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione6.272	CY8C5588	FT2232H	67MHz	256KB	64KB	USB - B, Pin Header	3" x 1.2" (76.2mm x 30.5mm)	0°C ~ 70°C
20-101-0698	Digi International	MODULE RABBITCORE RCM3310 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB (Internal), 4MB (External) RAM Size: 1MB Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -40°C ~ 70°C	pacchetto: -	Azione7.712	Rabbit 3000	-	44.2MHz	512KB (Internal), 4MB (External)	1MB	2 IDC Headers 2x17, 1 IDC Header 2x5	1.85" x 2.73" (47mm x 69mm)	-40°C ~ 70°C
CENGLH7A404-11-504HCR-A	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A404 Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione2.176	ARM922T, LH7A404	-	200MHz	32MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
101-0561	Digi International	MODULE RABBITCORE RCM3400 W/AD Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 29.4MHz Flash Size: 512KB RAM Size: 512KB Connector Type: 2 IDC Headers 2x17 Size / Dimension: 1.16" x 1.38" (29.5mm x 34.9mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione5.760	Rabbit 3000	-	29.4MHz	512KB	512KB	2 IDC Headers 2x17	1.16" x 1.38" (29.5mm x 34.9mm)	-40°C ~ 85°C
BS2E-IC	Parallax Inc.	BASIC STAMP 2E MODULE Module/Board Type: MCU Core Core Processor: SX28AC Co-Processor: - Speed: 20MHz Flash Size: 16KB EEPROM RAM Size: 32B Connector Type: - Size / Dimension: 1.2" x 0.6" (30mm x 15mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione2.368	SX28AC	-	20MHz	16KB EEPROM	32B	-	1.2" x 0.6" (30mm x 15mm)	0°C ~ 70°C
TE0600-03IVFN	Trenz Electronic GmbH	FPGA MICROMOD SPARTAN-6 LX Module/Board Type: FPGA Core Processor: Spartan-6 LX-150 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 256MB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione5.216	Spartan-6 LX-150	-	125MHz	16MB	256MB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
L138-FI-225-RC	Critical Link LLC	MITYDSP-L138F SOM OMAP-L138 Module/Board Type: MPU, DSP, FPGA Core Core Processor: ARM926EJ-S, OMAP-L138 Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA) Speed: 456MHz Flash Size: 256MB (NAND), 8MB (NOR) RAM Size: 8KB (Internal MPU), 256KB (Internal DSP), 128MB (External) Connector Type: SO-DIMM-200 Size / Dimension: 2.66" x 2" (67.6mm x 50.8mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione6.800	ARM926EJ-S, OMAP-L138	TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)	456MHz	256MB (NAND), 8MB (NOR)	8KB (Internal MPU), 256KB (Internal DSP), 128MB (External)	SO-DIMM-200	2.66" x 2" (67.6mm x 50.8mm)	0°C ~ 70°C
20-101-1246	Digi International	CORE MODULE RCM5400W Module/Board Type: MPU Core Core Processor: Rabbit 5000 Co-Processor: - Speed: 73.73MHz Flash Size: 1.5MB RAM Size: 1MB Connector Type: IDC Header 2x25, 2x5, 1xAntenna Size / Dimension: 1.84" x 2.85" (47mm x 72mm) Operating Temperature: -30°C ~ 75°C	pacchetto: -	Azione4.368	Rabbit 5000	-	73.73MHz	1.5MB	1MB	IDC Header 2x25, 2x5, 1xAntenna	1.84" x 2.85" (47mm x 72mm)	-30°C ~ 75°C
DC-EM-02T-C	Digi International	EM 8MB SDRAM 4MB FLASH SINGLE Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.94" x 1.58" (49.2mm x 40.0mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione6.048	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	1.94" x 1.58" (49.2mm x 40.0mm)	-40°C ~ 85°C
MOD5282-100IR	NetBurner Inc.	PROCESSOR MODULE 512KB FLASH Module/Board Type: MCU, Ethernet Core Core Processor: ColdFire 5282 Co-Processor: - Speed: 66MHz Flash Size: 512KB RAM Size: 8.064MB Connector Type: RJ-45, 2x50 Header Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione7.152	ColdFire 5282	-	66MHz	512KB	8.064MB	RJ-45, 2x50 Header	2.6" x 2" (66.04mm x 50.8mm)	-40°C ~ 85°C
20-101-0561	Digi International	MODULE RABBITCORE RCM3400 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 29.4MHz Flash Size: 512KB RAM Size: 512KB Connector Type: 2 IDC Headers 2x17 Size / Dimension: 1.16" x 1.38" (29.5mm x 34.9mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione15.492	Rabbit 3000	-	29.4MHz	512KB	512KB	2 IDC Headers 2x17	1.16" x 1.38" (29.5mm x 34.9mm)	-40°C ~ 85°C
TE0720-03-1CFA	Trenz Electronic GmbH	SOC MODULE 1GB DDR3 Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione6.576	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
XP1001000M-05R	Lantronix, Inc.	XPORT XE ROHS EXTENDED TEMP MODB Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione9.168	-	-	-	-	-	-	-	-
TEC0850-03-15EG1EA	Trenz Electronic GmbH	IC MODULE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione2.656	-	-	-	-	-	-	-	-
TE0712-03-81I36-L	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: Artix-7 XC7A200T-1I Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	Artix-7 XC7A200T-1I	-	-	32MB	1GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0808-05-9GI81-A	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Request a Quote	-	-	-	-	-	-	-	-
ME-XU1-9EG-2I-D12E-G1-R4-2	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU9EG Module/Board Type: FPGA Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TE0808-05-9BE21-LZ	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH AMD Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 4 x 160 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Request a Quote	Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 4 x 160	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0741-04-A2I-1-A	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: FPGA Core Core Processor: Xilinx Kintex-7 FPGA XC7K70T-2FBG676I Co-Processor: - Speed: - Flash Size: 32MB RAM Size: - Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	Xilinx Kintex-7 FPGA XC7K70T-2FBG676I	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0807-03-4BE21-AK	Trenz Electronic GmbH	MPSOC MODULE TE0807 WITH ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU4EG-1FBVB900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Request a Quote	Zynq™ UltraScale+™ XCZU4EG-1FBVB900E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 160	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
DC-VA-MEPG2-8B-60-1080-OPVXC-0000	System-On-Chip (SOC) Technologies Inc.	DECODER MEPG2 HD VID/AUD 8BIT Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Request a Quote	-	-	-	-	-	-	-	-
ME-XU7-15EG-2I-D12E-R4	Enclustra FPGA Solutions	SOM ZYNQ US+ ZU15EG 4GB+2GB PL Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Request a Quote	-	-	-	-	-	-	-	-
TE0712-02-71I01-M	Trenz Electronic GmbH	IC MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: - Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	-	-	200MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0818-02-9GI81-A	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 4 x 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 4 x 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C
MYC-C7Z015-4E1D-766-I	MYIR Tech Limited	System-On-Module, Zynq-7015 Module/Board Type: MPU, FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: Zynq-7000 (Z-7015) Speed: 766MHz Flash Size: 4GB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 2.950" L x 2.170" W (75.00mm x 55.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM® Cortex®-A9	Zynq-7000 (Z-7015)	766MHz	4GB	1GB	Board-to-Board (BTB) Socket	2.950" L x 2.170" W (75.00mm x 55.00mm)	-40°C ~ 85°C

CC-9P-V524-CC

Digi International

CONNECTCORE 9P

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9215
Co-Processor: -
Speed: 150MHz
Flash Size: 16MB
RAM Size: 32MB
Connector Type: -
Size / Dimension: -
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione6.608

ARM926EJ-S, NS9215

-

150MHz

16MB

32MB

-

-40°C ~ 85°C

TE0741-02-160-2CF

Trenz Electronic GmbH

SOM KINTEX-7 160T 32MB FLASH AES

Module/Board Type: FPGA
Core Processor: Kintex-7 160T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione5.040

Kintex-7 160T

-

200MHz

32MB

-

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

TE0725-02-100-2C

Trenz Electronic GmbH

SOM ARTIX-7 100T FLASH 2C

Module/Board Type: FPGA
Core Processor: Artix-7 A100T
Co-Processor: -
Speed: 100MHz
Flash Size: 32MB
RAM Size: -
Connector Type: 50 Pin
Size / Dimension: 2.87" x 1.38" (73mm x 35mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione5.424

Artix-7 A100T

-

100MHz

32MB

-

50 Pin

2.87" x 1.38" (73mm x 35mm)

0°C ~ 70°C

DLP-2232H-PSOC5

DLP Design Inc.

MODULE PSOC5 USB ADAPTER FT2232H

Module/Board Type: MCU, USB Core
Core Processor: CY8C5588
Co-Processor: FT2232H
Speed: 67MHz
Flash Size: 256KB
RAM Size: 64KB
Connector Type: USB - B, Pin Header
Size / Dimension: 3" x 1.2" (76.2mm x 30.5mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione6.272

CY8C5588

FT2232H

67MHz

256KB

64KB

USB - B, Pin Header

3" x 1.2" (76.2mm x 30.5mm)

0°C ~ 70°C

20-101-0698

Digi International

MODULE RABBITCORE RCM3310

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB (Internal), 4MB (External)
RAM Size: 1MB
Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: -40°C ~ 70°C

pacchetto: -

Azione7.712

Rabbit 3000

-

44.2MHz

512KB (Internal), 4MB (External)

1MB

2 IDC Headers 2x17, 1 IDC Header 2x5

1.85" x 2.73" (47mm x 69mm)

-40°C ~ 70°C

CENGLH7A404-11-504HCR-A

Logic

CARD ENGINE 64MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A404
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione2.176

ARM922T, LH7A404

-

200MHz

32MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

101-0561

Digi International

MODULE RABBITCORE RCM3400 W/AD

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 29.4MHz
Flash Size: 512KB
RAM Size: 512KB
Connector Type: 2 IDC Headers 2x17
Size / Dimension: 1.16" x 1.38" (29.5mm x 34.9mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione5.760

Rabbit 3000

-

29.4MHz

512KB

2 IDC Headers 2x17

1.16" x 1.38" (29.5mm x 34.9mm)

-40°C ~ 85°C

BS2E-IC

Parallax Inc.

BASIC STAMP 2E MODULE

Module/Board Type: MCU Core
Core Processor: SX28AC
Co-Processor: -
Speed: 20MHz
Flash Size: 16KB EEPROM
RAM Size: 32B
Connector Type: -
Size / Dimension: 1.2" x 0.6" (30mm x 15mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione2.368

SX28AC

-

20MHz

16KB EEPROM

32B

-

1.2" x 0.6" (30mm x 15mm)

0°C ~ 70°C

TE0600-03IVFN

Trenz Electronic GmbH

FPGA MICROMOD SPARTAN-6 LX

Module/Board Type: FPGA
Core Processor: Spartan-6 LX-150
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 256MB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione5.216

Spartan-6 LX-150

-

125MHz

16MB

256MB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

L138-FI-225-RC

Critical Link LLC

MITYDSP-L138F SOM OMAP-L138

Module/Board Type: MPU, DSP, FPGA Core
Core Processor: ARM926EJ-S, OMAP-L138
Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)
Speed: 456MHz
Flash Size: 256MB (NAND), 8MB (NOR)
RAM Size: 8KB (Internal MPU), 256KB (Internal DSP), 128MB (External)
Connector Type: SO-DIMM-200
Size / Dimension: 2.66" x 2" (67.6mm x 50.8mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione6.800

ARM926EJ-S, OMAP-L138

TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)

456MHz

256MB (NAND), 8MB (NOR)

8KB (Internal MPU), 256KB (Internal DSP), 128MB (External)

SO-DIMM-200

2.66" x 2" (67.6mm x 50.8mm)

0°C ~ 70°C

20-101-1246

Digi International

CORE MODULE RCM5400W

Module/Board Type: MPU Core
Core Processor: Rabbit 5000
Co-Processor: -
Speed: 73.73MHz
Flash Size: 1.5MB
RAM Size: 1MB
Connector Type: IDC Header 2x25, 2x5, 1xAntenna
Size / Dimension: 1.84" x 2.85" (47mm x 72mm)
Operating Temperature: -30°C ~ 75°C

pacchetto: -

Azione4.368

Rabbit 5000

-

73.73MHz

1.5MB

1MB

IDC Header 2x25, 2x5, 1xAntenna

1.84" x 2.85" (47mm x 72mm)

-30°C ~ 75°C

DC-EM-02T-C

Digi International

EM 8MB SDRAM 4MB FLASH SINGLE

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.94" x 1.58" (49.2mm x 40.0mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione6.048

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

RJ45

1.94" x 1.58" (49.2mm x 40.0mm)

-40°C ~ 85°C

MOD5282-100IR

NetBurner Inc.

PROCESSOR MODULE 512KB FLASH

Module/Board Type: MCU, Ethernet Core
Core Processor: ColdFire 5282
Co-Processor: -
Speed: 66MHz
Flash Size: 512KB
RAM Size: 8.064MB
Connector Type: RJ-45, 2x50 Header
Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione7.152

ColdFire 5282

-

66MHz

512KB

8.064MB

RJ-45, 2x50 Header

2.6" x 2" (66.04mm x 50.8mm)

-40°C ~ 85°C

20-101-0561

Digi International

MODULE RABBITCORE RCM3400

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 29.4MHz
Flash Size: 512KB
RAM Size: 512KB
Connector Type: 2 IDC Headers 2x17
Size / Dimension: 1.16" x 1.38" (29.5mm x 34.9mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione15.492

Rabbit 3000

-

29.4MHz

512KB

2 IDC Headers 2x17

1.16" x 1.38" (29.5mm x 34.9mm)

-40°C ~ 85°C

TE0720-03-1CFA

Trenz Electronic GmbH

SOC MODULE 1GB DDR3

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione6.576

ARM Cortex-A9

Zynq-7000 (Z-7020)

-

32MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

XP1001000M-05R

Lantronix, Inc.

XPORT XE ROHS EXTENDED TEMP MODB

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione9.168

-

TEC0850-03-15EG1EA

Trenz Electronic GmbH

IC MODULE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione2.656

-

TE0712-03-81I36-L

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: Artix-7 XC7A200T-1I
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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Artix-7 XC7A200T-1I

-

32MB

1GB

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0808-05-9GI81-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Request a Quote

-

ME-XU1-9EG-2I-D12E-G1-R4-2

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU9EG

Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

600MHz, 1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

TE0808-05-9BE21-LZ

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH AMD

Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 4 x 160
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

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Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E

-

128MB

4GB

Board-to-Board (BTB) Socket - 4 x 160

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

TE0741-04-A2I-1-A

Trenz Electronic GmbH

MODULE FPGA KINTEX

Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K70T-2FBG676I
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: -
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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Xilinx Kintex-7 FPGA XC7K70T-2FBG676I

-

32MB

-

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0807-03-4BE21-AK

Trenz Electronic GmbH

MPSOC MODULE TE0807 WITH ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU4EG-1FBVB900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

Request a Quote

Zynq™ UltraScale+™ XCZU4EG-1FBVB900E

-

128MB

4GB

Board-to-Board (BTB) Socket - 160

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

DC-VA-MEPG2-8B-60-1080-OPVXC-0000

System-On-Chip (SOC) Technologies Inc.

DECODER MEPG2 HD VID/AUD 8BIT

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Request a Quote

-

ME-XU7-15EG-2I-D12E-R4

Enclustra FPGA Solutions

SOM ZYNQ US+ ZU15EG 4GB+2GB PL

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Request a Quote

-

TE0712-02-71I01-M

Trenz Electronic GmbH

IC MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: -
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Request a Quote

-

200MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0818-02-9GI81-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Request a Quote

Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I

-

128MB

4GB

Board-to-Board (BTB) Socket - 4 x 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

-40°C ~ 85°C

MYC-C7Z015-4E1D-766-I

MYIR Tech Limited

System-On-Module, Zynq-7015

Module/Board Type: MPU, FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq-7000 (Z-7015)
Speed: 766MHz
Flash Size: 4GB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.950" L x 2.170" W (75.00mm x 55.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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ARM® Cortex®-A9

Zynq-7000 (Z-7015)

766MHz

4GB

1GB

Board-to-Board (BTB) Socket

2.950" L x 2.170" W (75.00mm x 55.00mm)

-40°C ~ 85°C