Pagina 13 - Embedded - Microcontroller, microprocessori, moduli FPGA | Circuiti integrati (CI)

Numero di parte	Produttore	Descrizione	pacchetto	Azione	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-MX-MB6B-SLB-1	Digi International	CONNECTCORE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione7.808	-	-	-	-	-	-	-	-
DC-ME-Y402-MF-VS	Digi International	MODULE ME 8MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 80°C	pacchetto: -	Azione5.360	ARM926EJ-S, NS9210	-	75MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 80°C
CC-MX-LC47-Z1-B	Digi International	MODULE I.MX51 I.MX512 800MHZ Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione3.184	-	-	-	-	-	-	-	-
DC-EM-02T-NS	Digi International	EM 8MB SDRAM 4MB FLASH SINGLE Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: Pin Header Size / Dimension: 1.94" x 1.58" (49.2mm x 40.0mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione2.640	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	Pin Header	1.94" x 1.58" (49.2mm x 40.0mm)	-40°C ~ 85°C
MOD5282-100	NetBurner Inc.	PROCESSOR MODULE 512KB FLASH Module/Board Type: MCU, Ethernet Core Core Processor: ColdFire 5282 Co-Processor: - Speed: 66MHz Flash Size: 512KB RAM Size: 8.064MB Connector Type: RJ-45, 2x50 Header Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione5.232	ColdFire 5282	-	66MHz	512KB	8.064MB	RJ-45, 2x50 Header	2.6" x 2" (66.04mm x 50.8mm)	0°C ~ 70°C
CC-MX-LD79-ZK-B	Digi International	MODULE I.MX53 512MB FLASH 25PK Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, i.MX53 Co-Processor: - Speed: 800MHz Flash Size: 512MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 360 Size / Dimension: 3.23" x 1.97" (82mm x 50mm Operating Temperature: -20°C ~ 85°C	pacchetto: -	Azione4.176	ARM? Cortex?-A8, i.MX53	-	800MHz	512MB	1GB	Board-to-Board (BTB) Socket - 360	3.23" x 1.97" (82mm x 50mm	-20°C ~ 85°C
TE0841-01-040-1C	Trenz Electronic GmbH	SOM USCALE XCKU040-1C 1GB DDR4 Module/Board Type: FPGA Core Processor: Kintex UltraScale KU40 Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 4GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione4.800	Kintex UltraScale KU40	-	-	32MB	4GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
TE0729-02-2IF-K	Trenz Electronic GmbH	SOM ZYNQ XC7Z020-2I 512MB RTC Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 32MB RAM Size: 512MB Connector Type: Samtec BTE Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione5.600	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	32MB	512MB	Samtec BTE	2.05" x 2.99" (52mm x 76mm)	-40°C ~ 85°C
CC-MX-LB69-ZK	Digi International	MODULE I.MX51 800MHZ 512MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione2.944	-	-	-	-	-	-	-	-
EZ80F920020MOD	Zilog	MODULE EZ80F92 512K 20MHZ Module/Board Type: MCU Core Core Processor: eZ80F92 Co-Processor: - Speed: 20MHz Flash Size: 128KB RAM Size: 8KB (Internal), 128KB (External) Connector Type: Header 2x25 Size / Dimension: 2.5" x 2.5" (64mm x 64mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione4.880	eZ80F92	-	20MHz	128KB	8KB (Internal), 128KB (External)	Header 2x25	2.5" x 2.5" (64mm x 64mm)	0°C ~ 70°C
SOMOMAP3530-11-1782IFXR	Logic	SOM OMAP3530 SOM-LV TY Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, OMAP3530 Co-Processor: TMS320C64x (DSP) Speed: 600MHz Flash Size: 512MB (NAND), 8MB (NOR) RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm) Operating Temperature: -20°C ~ 70°C	pacchetto: -	Azione7.824	ARM? Cortex?-A8, OMAP3530	TMS320C64x (DSP)	600MHz	512MB (NAND), 8MB (NOR)	256MB	Board-to-Board (BTB) Socket - 240	1.23" x 3.01" (31.2mm x 76.5mm)	-20°C ~ 70°C
DC-SP-01R-JT	Digi International	MOD ADAPTER CUSTOMIZABLE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione6.768	-	-	-	-	-	-	-	-
TE0630-02I	Trenz Electronic GmbH	IC MOD SPARTAN-6 100MHZ 128MB Module/Board Type: FPGA, USB Core Core Processor: Spartan-6 LX-45 Co-Processor: Cypress EZ-USB FX2LP Speed: 100MHz Flash Size: 8MB RAM Size: 128MB Connector Type: B2B Size / Dimension: 1.6" x 1.9" (40.5mm x 47.5mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione2.256	Spartan-6 LX-45	Cypress EZ-USB FX2LP	100MHz	8MB	128MB	B2B	1.6" x 1.9" (40.5mm x 47.5mm)	-40°C ~ 85°C
TE0803-03-4DE11-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Azione2.304	Zynq UltraScale+ XCZU4EV-1SFVC784E	-	-	128MB	2GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
UC5550-67HFN	GHI Electronics, LLC	IC MOD CORTEX-M7 216MHZ 512KB Module/Board Type: MPU Core Core Processor: ARM® Cortex®-M7 Co-Processor: - Speed: 216MHz Flash Size: 2MB (Internal), 4MB (External) RAM Size: 512KB (Internal), 32MB (External) Connector Type: - Size / Dimension: 2.67" x 1.25" (67.7mm x 31.7mm) Operating Temperature: -	pacchetto: -	Azione7.536	ARM® Cortex®-M7	-	216MHz	2MB (Internal), 4MB (External)	512KB (Internal), 32MB (External)	-	2.67" x 1.25" (67.7mm x 31.7mm)	-
TE0712-02-81I36-A	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	Artix-7 A200T	-	200MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TEM0007-01-CHE11-A	Trenz Electronic GmbH	MICROCHIP POLARFIRE SOC FPGA 250 Module/Board Type: FPGA Core Processor: - Co-Processor: - Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -	pacchetto: -	Request a Quote	-	-	-	64MB	1GB	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	-
TE0729-02-62I63FA	Trenz Electronic GmbH	IC SOC MODULE ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 32MB RAM Size: 512MB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	32MB	512MB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0820-04-2BE21FA	Trenz Electronic GmbH	MOD MPSOC ZU2EG-1E 2GB DDR4 IND Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Request a Quote	Zynq UltraScale+ XCZU2EG-1SFVC784E	-	-	128MB	2GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0713-02-72C46-A	Trenz Electronic GmbH	IC SOM ARTIX-7 FPGA DDR3 Module/Board Type: FPGA Core Core Processor: Artix-7 XC7A100T-2FGG484C Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Request a Quote	Artix-7 XC7A100T-2FGG484C	-	200MHz	32MB	1GB	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
DC-VA-H264-10B-60-1080-OPVXC-0000	System-On-Chip (SOC) Technologies Inc.	DECODER H264 HD VID/AUD 10BIT Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Request a Quote	-	-	-	-	-	-	-	-
AM0010-02-2AE21MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ ZU2CG Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 2.205" L x 1.575" W (56.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Request a Quote	Zynq™ UltraScale+™ ZU2CG	-	-	128MB	4GB	Board-to-Board (BTB) Socket	2.205" L x 1.575" W (56.00mm x 40.00mm)	0°C ~ 85°C
TE0741-05-A2I-1-A	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: FPGA Core Processor: Xilinx Kintex-7 FPGA XC7K70T-2FBG676I Co-Processor: - Speed: - Flash Size: 32MB RAM Size: - Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	Xilinx Kintex-7 FPGA XC7K70T-2FBG676I	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
L138-FI-336-RL	Critical Link LLC	MITYDSP-L138F SOM W/ OMAP-L138 Module/Board Type: MPU, DSP, FPGA Core Core Processor: ARM926EJ-S, OMAP-L138 Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA) Speed: 456MHz Flash Size: 512MB (NAND), 16MB (NOR) RAM Size: 256MB Connector Type: SO-DIMM-200 Size / Dimension: 2.660" L x 2.000" W (67.60mm x 50.80mm) Operating Temperature: -40°C ~ 70°C	pacchetto: -	Request a Quote	ARM926EJ-S, OMAP-L138	TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)	456MHz	512MB (NAND), 16MB (NOR)	256MB	SO-DIMM-200	2.660" L x 2.000" W (67.60mm x 50.80mm)	-40°C ~ 70°C
IW-G24M-CU2F-4E001G-S008G-LIG	iWave Systems	Arria 10 SX270 (-3 speed)SoC SOM Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A9, Arria 10 SX Co-Processor: - Speed: 1.5GHz Flash Size: 8GB RAM Size: 4GB Connector Type: 2 x 240 Pin Size / Dimension: 3.740" L x 2.950" W (95.00mm x 75.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM® Cortex®-A9, Arria 10 SX	-	1.5GHz	8GB	4GB	2 x 240 Pin	3.740" L x 2.950" W (95.00mm x 75.00mm)	-40°C ~ 85°C
TE0745-02-92I11-A	Trenz Electronic GmbH	SOM 1GB DDR3 XC7Z045-2FBG676I Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Request a Quote	-	-	-	-	-	-	-	-
2EC-VA-H265-10B-30-4K-MD00C-SX660	System-On-Chip (SOC) Technologies Inc.	MOD H265 EN 30FPS 4K SX660 SODIM Module/Board Type: FPGA Core Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Co-Processor: - Speed: 1.5GHz Flash Size: 128KB RAM Size: 512MB Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Request a Quote	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	1.5GHz	128KB	512MB	-	-	-
IW-G30M-C5EV-4E004G-E008G-BIA	iWave Systems	ZU5EV (-1 Speed) MPSoC SOM Module/Board Type: MPU, FPGA Core Processor: ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2) Co-Processor: ARM® Mali 400 MP2 Speed: 1.5GHz, 600MHz Flash Size: 8GB eMMC RAM Size: 4GB, 1GB Connector Type: 2 x 240 Pin Size / Dimension: 4.330" L x 2.950" W (110.00mm x 75.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2)	ARM® Mali 400 MP2	1.5GHz, 600MHz	8GB eMMC	4GB, 1GB	2 x 240 Pin	4.330" L x 2.950" W (110.00mm x 75.00mm)	-40°C ~ 85°C

CC-MX-MB6B-SLB-1

Digi International

CONNECTCORE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione7.808

-

DC-ME-Y402-MF-VS

Digi International

MODULE ME 8MB SDRAM 4MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9210
Co-Processor: -
Speed: 75MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 80°C

pacchetto: -

Azione5.360

ARM926EJ-S, NS9210

-

75MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 80°C

CC-MX-LC47-Z1-B

Digi International

MODULE I.MX51 I.MX512 800MHZ

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione3.184

-

DC-EM-02T-NS

Digi International

EM 8MB SDRAM 4MB FLASH SINGLE

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: Pin Header
Size / Dimension: 1.94" x 1.58" (49.2mm x 40.0mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione2.640

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

Pin Header

1.94" x 1.58" (49.2mm x 40.0mm)

-40°C ~ 85°C

MOD5282-100

NetBurner Inc.

PROCESSOR MODULE 512KB FLASH

Module/Board Type: MCU, Ethernet Core
Core Processor: ColdFire 5282
Co-Processor: -
Speed: 66MHz
Flash Size: 512KB
RAM Size: 8.064MB
Connector Type: RJ-45, 2x50 Header
Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione5.232

ColdFire 5282

-

66MHz

512KB

8.064MB

RJ-45, 2x50 Header

2.6" x 2" (66.04mm x 50.8mm)

0°C ~ 70°C

CC-MX-LD79-ZK-B

Digi International

MODULE I.MX53 512MB FLASH 25PK

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, i.MX53
Co-Processor: -
Speed: 800MHz
Flash Size: 512MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 360
Size / Dimension: 3.23" x 1.97" (82mm x 50mm
Operating Temperature: -20°C ~ 85°C

pacchetto: -

Azione4.176

ARM? Cortex?-A8, i.MX53

-

800MHz

512MB

1GB

Board-to-Board (BTB) Socket - 360

3.23" x 1.97" (82mm x 50mm

-20°C ~ 85°C

TE0841-01-040-1C

Trenz Electronic GmbH

SOM USCALE XCKU040-1C 1GB DDR4

Module/Board Type: FPGA
Core Processor: Kintex UltraScale KU40
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 4GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione4.800

Kintex UltraScale KU40

-

32MB

4GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

TE0729-02-2IF-K

Trenz Electronic GmbH

SOM ZYNQ XC7Z020-2I 512MB RTC

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 32MB
RAM Size: 512MB
Connector Type: Samtec BTE
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione5.600

ARM Cortex-A9

Zynq-7000 (Z-7020)

-

32MB

512MB

Samtec BTE

2.05" x 2.99" (52mm x 76mm)

-40°C ~ 85°C

CC-MX-LB69-ZK

Digi International

MODULE I.MX51 800MHZ 512MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione2.944

-

EZ80F920020MOD

Zilog

MODULE EZ80F92 512K 20MHZ

Module/Board Type: MCU Core
Core Processor: eZ80F92
Co-Processor: -
Speed: 20MHz
Flash Size: 128KB
RAM Size: 8KB (Internal), 128KB (External)
Connector Type: Header 2x25
Size / Dimension: 2.5" x 2.5" (64mm x 64mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione4.880

eZ80F92

-

20MHz

128KB

8KB (Internal), 128KB (External)

Header 2x25

2.5" x 2.5" (64mm x 64mm)

0°C ~ 70°C

SOMOMAP3530-11-1782IFXR

Logic

SOM OMAP3530 SOM-LV TY

Module/Board Type: MPU, DSP Core
Core Processor: ARM? Cortex?-A8, OMAP3530
Co-Processor: TMS320C64x (DSP)
Speed: 600MHz
Flash Size: 512MB (NAND), 8MB (NOR)
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
Operating Temperature: -20°C ~ 70°C

pacchetto: -

Azione7.824

ARM? Cortex?-A8, OMAP3530

TMS320C64x (DSP)

600MHz

512MB (NAND), 8MB (NOR)

256MB

Board-to-Board (BTB) Socket - 240

1.23" x 3.01" (31.2mm x 76.5mm)

-20°C ~ 70°C

DC-SP-01R-JT

Digi International

MOD ADAPTER CUSTOMIZABLE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione6.768

-

TE0630-02I

Trenz Electronic GmbH

IC MOD SPARTAN-6 100MHZ 128MB

Module/Board Type: FPGA, USB Core
Core Processor: Spartan-6 LX-45
Co-Processor: Cypress EZ-USB FX2LP
Speed: 100MHz
Flash Size: 8MB
RAM Size: 128MB
Connector Type: B2B
Size / Dimension: 1.6" x 1.9" (40.5mm x 47.5mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione2.256

Spartan-6 LX-45

Cypress EZ-USB FX2LP

100MHz

8MB

128MB

B2B

1.6" x 1.9" (40.5mm x 47.5mm)

-40°C ~ 85°C

TE0803-03-4DE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

Azione2.304

Zynq UltraScale+ XCZU4EV-1SFVC784E

-

128MB

2GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

UC5550-67HFN

GHI Electronics, LLC

IC MOD CORTEX-M7 216MHZ 512KB

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-M7
Co-Processor: -
Speed: 216MHz
Flash Size: 2MB (Internal), 4MB (External)
RAM Size: 512KB (Internal), 32MB (External)
Connector Type: -
Size / Dimension: 2.67" x 1.25" (67.7mm x 31.7mm)
Operating Temperature: -

pacchetto: -

Azione7.536

ARM® Cortex®-M7

-

216MHz

2MB (Internal), 4MB (External)

512KB (Internal), 32MB (External)

-

2.67" x 1.25" (67.7mm x 31.7mm)

-

TE0712-02-81I36-A

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Request a Quote

Artix-7 A200T

-

200MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TEM0007-01-CHE11-A

Trenz Electronic GmbH

MICROCHIP POLARFIRE SOC FPGA 250

Module/Board Type: FPGA
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -

pacchetto: -

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-

64MB

1GB

B2B

1.970" L x 1.570" W (50.00mm x 40.00mm)

-

TE0729-02-62I63FA

Trenz Electronic GmbH

IC SOC MODULE ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 32MB
RAM Size: 512MB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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ARM Cortex-A9

Zynq-7000 (Z-7020)

-

32MB

512MB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

TE0820-04-2BE21FA

Trenz Electronic GmbH

MOD MPSOC ZU2EG-1E 2GB DDR4 IND

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

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Zynq UltraScale+ XCZU2EG-1SFVC784E

-

128MB

2GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

TE0713-02-72C46-A

Trenz Electronic GmbH

IC SOM ARTIX-7 FPGA DDR3

Module/Board Type: FPGA Core
Core Processor: Artix-7 XC7A100T-2FGG484C
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

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Artix-7 XC7A100T-2FGG484C

-

200MHz

32MB

1GB

B2B

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

DC-VA-H264-10B-60-1080-OPVXC-0000

System-On-Chip (SOC) Technologies Inc.

DECODER H264 HD VID/AUD 10BIT

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

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-

AM0010-02-2AE21MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ ZU2CG
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.205" L x 1.575" W (56.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

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Zynq™ UltraScale+™ ZU2CG

-

128MB

4GB

Board-to-Board (BTB) Socket

2.205" L x 1.575" W (56.00mm x 40.00mm)

0°C ~ 85°C

TE0741-05-A2I-1-A

Trenz Electronic GmbH

MODULE FPGA KINTEX

Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K70T-2FBG676I
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: -
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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Xilinx Kintex-7 FPGA XC7K70T-2FBG676I

-

32MB

-

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

L138-FI-336-RL

Critical Link LLC

MITYDSP-L138F SOM W/ OMAP-L138

Module/Board Type: MPU, DSP, FPGA Core
Core Processor: ARM926EJ-S, OMAP-L138
Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)
Speed: 456MHz
Flash Size: 512MB (NAND), 16MB (NOR)
RAM Size: 256MB
Connector Type: SO-DIMM-200
Size / Dimension: 2.660" L x 2.000" W (67.60mm x 50.80mm)
Operating Temperature: -40°C ~ 70°C

pacchetto: -

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ARM926EJ-S, OMAP-L138

TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)

456MHz

512MB (NAND), 16MB (NOR)

256MB

SO-DIMM-200

2.660" L x 2.000" W (67.60mm x 50.80mm)

-40°C ~ 70°C

IW-G24M-CU2F-4E001G-S008G-LIG

iWave Systems

Arria 10 SX270 (-3 speed)SoC SOM

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A9, Arria 10 SX
Co-Processor: -
Speed: 1.5GHz
Flash Size: 8GB
RAM Size: 4GB
Connector Type: 2 x 240 Pin
Size / Dimension: 3.740" L x 2.950" W (95.00mm x 75.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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ARM® Cortex®-A9, Arria 10 SX

-

1.5GHz

8GB

4GB

2 x 240 Pin

3.740" L x 2.950" W (95.00mm x 75.00mm)

-40°C ~ 85°C

TE0745-02-92I11-A

Trenz Electronic GmbH

SOM 1GB DDR3 XC7Z045-2FBG676I

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

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-

2EC-VA-H265-10B-30-4K-MD00C-SX660

System-On-Chip (SOC) Technologies Inc.

MOD H265 EN 30FPS 4K SX660 SODIM

Module/Board Type: FPGA Core
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Co-Processor: -
Speed: 1.5GHz
Flash Size: 128KB
RAM Size: 512MB
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

1.5GHz

128KB

512MB

-

IW-G30M-C5EV-4E004G-E008G-BIA

iWave Systems

ZU5EV (-1 Speed) MPSoC SOM

Module/Board Type: MPU, FPGA
Core Processor: ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2)
Co-Processor: ARM® Mali 400 MP2
Speed: 1.5GHz, 600MHz
Flash Size: 8GB eMMC
RAM Size: 4GB, 1GB
Connector Type: 2 x 240 Pin
Size / Dimension: 4.330" L x 2.950" W (110.00mm x 75.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2)

ARM® Mali 400 MP2

1.5GHz, 600MHz

8GB eMMC

4GB, 1GB

2 x 240 Pin

4.330" L x 2.950" W (110.00mm x 75.00mm)

-40°C ~ 85°C