Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 1:1 200MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.584 |
|
1 | 1:1 | No/No | LVCMOS, Sine Wave | LVCMOS | 200MHz | 2.5 V ~ 3.3 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione7.808 |
|
1 | 1:10 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.016 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:16 500MHZ 48PTQFP
|
pacchetto: 48-TQFP Exposed Pad |
Azione6.304 |
|
1 | 1:16 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 500MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-TQFP Exposed Pad | 48-PTQFP-EP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 3GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.552 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 3GHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
pacchetto: 32-TQFP |
Azione4.992 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:2 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.232 |
|
1 | 1:2 | Yes/Yes | Clock | Clock | - | 3 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione183.360 |
|
1 | 1:2 | Yes/Yes | ECL, LVECL, LVPECL. PECL | ECL, LVECL, LVPECL. PECL | 3GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Texas Instruments |
IC CLK BUFFER 1:9 650MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione7.936 |
|
1 | 1:9 | Yes/Yes | LVPECL | LVPECL | 650MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Maxim Integrated |
IC CLK BUFFER 1:5 TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.664 |
|
1 | 1:5 | Yes/Yes | LVPECL | LVCMOS, LVPECL | 800MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Texas Instruments |
IC CLK BUFFER 3:10 200MHZ 32WQFN
|
pacchetto: 32-WFQFN Exposed Pad |
Azione4.144 |
|
1 | 3:10 | Yes/No | HCSL, LVCMOS, LVDS, LVPECL, LVTTL, SSTL, Crystal | LVCMOS, LVTTL | 200MHz | 2.375 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 32-WFQFN Exposed Pad | 32-WQFN (5x5) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 2:4 1.5GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione24.000 |
|
1 | 2:4 | Yes/Yes | LVPECL | LVPECL | 1.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:10 150MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione8.244 |
|
1 | 1:10 | No/No | CMOS, TTL | CMOS, TTL | 150MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.440 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 2:5 200MHZ 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione5.968 |
|
1 | 2:5 | Yes/No | HCSL, LVCMOS, LVDS, LVPECL, LVTTL, SSTL, Crystal | LVCMOS, LVTTL | 200MHz | 1.35 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Diodes Incorporated |
CLOCK BUFFER TSSOP-20
|
pacchetto: - |
Azione5.696 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Diodes Incorporated |
CLOCK BUFFER SSOP-20
|
pacchetto: - |
Azione4.720 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 133MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione4.704 |
|
2 | 1:5 | No/No | CMOS | CMOS | 133MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:24 1.5GHZ 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione6.160 |
|
1 | 1:24 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 1.5GHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 64-TQFP Exposed Pad | 64-TQFP-EP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 166MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione5.920 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 166MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC CLK BUFFER 2:4 1GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione174.420 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 1GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 200MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione85.632 |
|
1 | 1:4 | No/No | Clock | CMOS | 200MHz | 2.375 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.156 |
|
1 | 2:5 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
pacchetto: 12-WFDFN Exposed Pad |
Azione63.600 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:10 650MHZ 20SOIC
|
pacchetto: - |
Request a Quote |
|
1 | 1:10 | No/No | LVCMOS | AVCMOS | 650 MHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | 0°C ~ 70°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
SiTime |
-40C TO 85C, 32PIN, 5050, 1.8V-3
|
pacchetto: - |
Request a Quote |
|
3 | 3:10 | Yes/No | HCSL, LVCMOS, LVDS, LVPECL, SSTL, XTAL | LVCMOS | 250 MHz | 1.8V ~ 3.3V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 2:10 200MHZ 32TQFP
|
pacchetto: - |
Request a Quote |
|
1 | 2:10 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 200 MHz | 2.375V ~ 2.625V, 2.97V ~ 3.63V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Cypress Semiconductor Corp |
CLOCK FANOUT BUFFER 9-OUT 16PIN
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |