Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Diodes Incorporated |
IC CLK BUFF 1:10 250MHZ
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione5.856 |
|
1 | 1:10 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 1.1 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 140MHZ 16QSOP
|
pacchetto: 16-SSOP (0.154", 3.90mm Width) |
Azione4.288 |
|
1 | 1:5 | No/No | TTL | TTL | 140MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 16-SSOP (0.154", 3.90mm Width) | 16-QSOP |
||
Microchip Technology |
IC CLK BUFFER 2:9 750MHZ 32TQFP
|
pacchetto: 32-TQFP |
Azione5.104 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 750MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:10 650MHZ 40VFQFPN
|
pacchetto: 40-VFQFN Exposed Pad |
Azione4.576 |
|
1 | 2:10 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVPECL, LVTTL | LVDS | 650MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-VFQFPN (6x6) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.416 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:2 2GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione5.072 |
|
1 | 1:2 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Texas Instruments |
IC CLK BUFFER 1:4 100MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione19.152 |
|
1 | 1:4 | No/No | CMOS, TTL | CMOS, TTL | 100MHz | 4.5 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:24 100MHZ 48TQFP
|
pacchetto: 48-LQFP |
Azione6.160 |
|
1 | 2:24 | Yes/No | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVCMOS, LVTTL | 100MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Microsemi Corporation |
IC CLK BUFFER 1:8 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione7.552 |
|
1 | 1:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
ON Semiconductor |
IC CLK BUFFER 1:2 3GHZ 8DFN
|
pacchetto: 8-VFDFN Exposed Pad |
Azione4.992 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 3GHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x2) |
||
ON Semiconductor |
IC CLK BUFFER 2:4 1.25GHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione7.232 |
|
1 | 2:4 | Yes/Yes | ECL, PECL | ECL, PECL | 1.25GHz | 4.2 V ~ 5.7 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Texas Instruments |
IC CLK BUFFER 1:2 3.8GHZ 8VSSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione6.960 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 3.8GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-VSSOP |
||
Silicon Labs |
IC CLK BUFFER 1:4 220MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.000 |
|
1 | 1:4 | No/No | Clock | LVCMOS | 220MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Silicon Labs |
IC CLK BUFFER 1:4 220MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.032 |
|
1 | 1:4 | No/No | Clock | LVCMOS | 220MHz | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Diodes Incorporated |
CLOCK BUFFER TSSOP-16
|
pacchetto: - |
Azione3.488 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione6.588 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 200MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.760 |
|
1 | 1:4 | No/No | CMOS | CMOS | 200MHz | 2.375 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microsemi Corporation |
LOW SKEW, LOW ADDITIVE JITTER 3
|
pacchetto: 48-VFQFN Exposed Pad |
Azione7.212 |
|
- | - | - | - | - | - | - | - | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 200MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione28.404 |
|
1 | 1:4 | No/No | CMOS | CMOS | 200MHz | 2.375 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 156MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione37.818 |
|
1 | 1:2 | No/No | CMOS | 3-State, CMOS | 156MHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
AKM Semiconductor Inc. |
INTEGRATED CIRCUIT
|
pacchetto: 32-LQFP |
Azione6.608 |
|
1 | 1:18 | No/No | LVCMOS, LVTTL | LVCMOS | 200MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Nexperia USA Inc. |
74AVC1T1004GU33/SOT1430/X2QFN1
|
pacchetto: 10-XFQFN |
Azione2.912 |
|
1 | 1:4 | No/No | Clock | Clock | - | 0.8 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 10-XFQFN | 10-X2QFN (1.6x1.3) |
||
IDT, Integrated Device Technology Inc |
IC TIMING CLOCK
|
pacchetto: - |
Azione7.376 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione2.528 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
LOW SKEW, LOW ADDITIVE JITTER 3
|
pacchetto: 32-VFQFN Exposed Pad |
Azione6.720 |
|
1 | 3:5 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | HCSL, LVCMOS, LVDS, LVPECL | 1.6GHz | 1.35V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
CITRINE ZL40260 ES4 ENGCBA ETQFP
|
pacchetto: 32-TQFP Exposed Pad |
Azione8.964 |
|
1 | 2:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | LVPECL | 1.6GHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 32-TQFP Exposed Pad | 32-eTQFP (7x7) |
||
Texas Instruments |
IC CLK BUFFER 2:6 2GHZ 40VQFN
|
pacchetto: - |
Request a Quote |
|
2 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | Clock, LVDS | 2 GHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 40-VFQFN Exposed Pad | 40-VQFN (6x6) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 56TSSOP
|
pacchetto: - |
Request a Quote |
|
4 | 2:4 | No/No | Clock | 3-State | - | 2.3V ~ 3.6V | -40°C ~ 85°C | Surface Mount | 56-TFSOP (0.240", 6.10mm Width) | 56-TSSOP |