Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 2:10 700MHZ 32LQFP
|
pacchetto: 32-LQFP Exposed Pad |
Azione4.896 |
|
1 | 2:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 700MHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 32-LQFP Exposed Pad | 32-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 3GHZ 32VFQFPN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.808 |
|
2 | 1:5 | Yes/Yes | ECL, PECL | ECL, PECL | 3GHz | 2.375 V ~ 3.465 V | 0°C ~ 110°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 100MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.984 |
|
2 | 1:5 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 166MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione6.336 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 166MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione2.704 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
STMicroelectronics |
IC CLK BUFFER 1:4 52MHZ 12TDFN
|
pacchetto: 12-WFDFN |
Azione2.464 |
|
1 | 1:4 | No/No | Clock | Clock | 52MHz | 2.5 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN | 12-TDFN (2x3) |
||
Microchip Technology |
IC CLK BUFFER 2:8 160MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione6.496 |
|
1 | 2:8 | Yes/Yes | ECL | TTL | 160MHz | ±4.2 V ~ 5.5 V, 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
ON Semiconductor |
IC CLK BUFFER 2:20 1GHZ 52LQFP
|
pacchetto: 52-LQFP Exposed Pad |
Azione7.840 |
|
1 | 2:20 | Yes/Yes | ECL, HSTL, LVPECL | ECL, PECL | 1GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 52-LQFP Exposed Pad | 52-LQFP (10x10) |
||
Microchip Technology |
IC CLK BUFFER 1:3 2GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione2.128 |
|
1 | 1:3 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
ON Semiconductor |
IC CLK MULTIPLEXR 2:1 7GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione2.464 |
|
1 | 2:1 | Yes/Yes | CML, LVDS, LVPECL | CML | 7GHz | 1.71 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Texas Instruments |
IC CLK BUFFER 3:7 3.1GHZ 36WQFN
|
pacchetto: 36-WFQFN Exposed Pad |
Azione2.832 |
|
1 | 3:7 | Yes/Yes | CML, HCSL, HSTL, LVDS, LVPECL, SSTL, Crystal | HCSL, LVCMOS, LVDS, LVPECL | 3.1GHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 36-WFQFN Exposed Pad | 36-WQFN (6x6) |
||
Diodes Incorporated |
CLOCK BUFFER SSOP-20
|
pacchetto: - |
Azione5.984 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.752 |
|
1 | 1:2 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
IC CLOCK BUFFER MUX 3:11 48TQFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione7.068 |
|
1 | 3:11 | Yes/No | LVCMOS, LVTTL, Crystal | HCSL, LVCMOS, LVDS, LVPECL | 1.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-TQFN (7x7) |
||
Microsemi Corporation |
LOW SKEW, LOW ADDITIVE JITTER 2
|
pacchetto: - |
Azione3.280 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Maxim Integrated |
IC CLK BUFFER 1:2 3GHZ 8UMAX
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione6.000 |
|
1 | 1:2 | Yes/Yes | ECL, PECL, LVECL, LVPECL | ECL, PECL, LVECL, LVPECL | 3GHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-uMAX |
||
Maxim Integrated |
IC CLK BUFFER 2:10 3GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione24.048 |
|
1 | 2:10 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.25 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP/32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:5 134MHZ 8SOP
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.544 |
|
1 | 1:5 | No/No | CMOS | CMOS | 134MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Silicon Labs |
IC CLK BUFFER 1:4 LVPECL 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione7.184 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVDS, LVPECL | LVPECL | 710MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Texas Instruments |
IC CLK BUFFER 1:10 100MHZ 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione6.624 |
|
1 | 1:10 | No/No | LVTTL | LVTTL, TRI-State | 100MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:12 1.2GHZ 40VQFN
|
pacchetto: 40-VFQFN Exposed Pad |
Azione9.348 |
|
1 | 2:12 | Yes/Yes | CML, LVDS | LVDS | 1.2GHz | 1.71 V ~ 1.89 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-VFQFPN (6x6) |
||
Texas Instruments |
IC CLK BUFFER 2:4 2GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione15.648 |
|
1 | 2:4 | Yes/Yes | LVCMOS, LVDS, LVPECL, LVTTL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 16VFQFPN
|
pacchetto: - |
Azione5.328 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 32-VFQFN Exposed Pad |
Azione2.416 |
|
1 | 2:8 | Yes/Yes | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL | LVCMOS, LVDS, LVPECL | 700MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
1:8 UNIVERSAL DIFFERENTIAL FANOU
|
pacchetto: 40-VFQFN Exposed Pad |
Azione11.520 |
|
1 | 1:8 | Yes/Yes | LVDS, LVPECL | LVDS, LVPECL | 3GHz | 2.375 V ~ 3.465 V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-VFQFN (6x6) |
||
Silicon Labs |
IC CLOCK BUFFER QFN
|
pacchetto: - |
Azione5.424 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 8:8 32PLCC
|
pacchetto: - |
Request a Quote |
|
- | 8:8 | - | - | - | - | - | - | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC CLK BUFFER 1:2 250MHZ 16VQFN
|
pacchetto: - |
Request a Quote |
|
1 | 1:2 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |