Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLOCK BUFFER 1:1 200MHZ DIE
|
pacchetto: Die |
Azione4.800 |
|
1 | 1:1 | No/Yes | Crystal | LVPECL | 200MHz | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | Die | Die |
||
Microchip Technology |
IC CLK BUFFER 2:4 1GHZ 16QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione3.872 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 1GHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 150MHZ 16QFN
|
pacchetto: - |
Azione4.896 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:9 350MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione5.648 |
|
1 | 2:9 | No/No | LVCMOS | LVCMOS | 350MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:10 250MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione12.624 |
|
1 | 2:10 | No/No | LVCMOS | LVCMOS | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 166MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione5.472 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | 166MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
ON Semiconductor |
IC CLK BUFFER 2:6 700MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.448 |
|
1 | 2:6 | Yes/Yes | ECL, PECL | ECL, PECL | 700MHz | 4.2 V ~ 5.7 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
ON Semiconductor |
IC CLK BUFFER 1:9 750MHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione25.656 |
|
2 | 1:9 | Yes/Yes | HSTL, LVDS, LVPECL | HSTL | 750MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Texas Instruments |
IC CLK BUFFER 2:10 1.1GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione21.012 |
|
1 | 2:10 | Yes/Yes | LVDS | LVDS | 1.1GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Texas Instruments |
IC CLK BUFFER 1:4 60MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione3.760 |
|
2 | 1:4 | No/No | TTL | CMOS | 60MHz | 4.5 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microsemi Corporation |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione6.976 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 2:4 1GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione2.496 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 1GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Diodes Incorporated |
CLOCK BUFFER SSOP-20
|
pacchetto: - |
Azione5.424 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Diodes Incorporated |
CLOCK SAW OSCILLATOR SEAM7050
|
pacchetto: - |
Azione7.792 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Maxim Integrated |
IC CLK BUFFER
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.576 |
|
- | - | - | - | - | - | - | - | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Silicon Labs |
IC CLK BUFFER 1:8 CMOS 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione6.736 |
|
1 | 1:8 | No/No | CMOS, HSTL, LVTTL, SSTL | CMOS | 200MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:12 180MHZ 28SSOP
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione108.144 |
|
1 | 1:12 | No/No | Clock | Clock | 180MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Silicon Labs |
IC BUFFER/LEVEL XLATOR 1:3 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione6.992 |
|
2 | 1:3 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | CML, HCSL, LVCMOS, LVDS, LVPECL | 725MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 2:20 2GHZ 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione6.384 |
|
1 | 2:20 | Yes/Yes | CML, LVDS, PECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 1:2 2.5GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione18.348 |
|
1 | 1:2 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVPECL | 2.5GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
IDT, Integrated Device Technology Inc |
IC TIMING
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione7.696 |
|
1 | 4:2 | Yes/Yes | HCSL, LVDS, LVPECL | HCSL | 700MHz | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
Microchip Technology |
IC CLK BUFF MUX 2:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.616 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
6 OUTPUT PROGRAMMABLE FANOUT BUF
|
pacchetto: 56-VFQFN Exposed Pad |
Azione6.336 |
|
1 | 4:6 | Yes/Yes | CMOS, Crystal | CML, CMOS, HCSL, HSTL, LVDS, LVPECL, SSTL | 1.035GHz | 1.71V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
Microchip Technology |
IC CLK BUFFER 1:4 250MHZ 16VQFN
|
pacchetto: - |
Azione38.526 |
|
1 | 1:4 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 2:1 2.5GHZ 16TSSOP
|
pacchetto: - |
Azione7.500 |
|
1 | 2:1 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2.5 GHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:10 200MHZ 20QFN
|
pacchetto: - |
Request a Quote |
|
1 | 1:10 | No/No | LVCMOS | LVCMOS | 200 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 20-VFQFN Exposed Pad | 20-QFN (3x3) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 2:15 200MHZ 52TQFP
|
pacchetto: - |
Request a Quote |
|
1 | 2:15 | Yes/Yes | LVCMOS, LVPECL, LVTTL | LVCMOS, LVTTL | 200 MHz | 2.375V ~ 2.625V, 2.97V ~ 3.63V | -40°C ~ 85°C | Surface Mount | 52-TQFP | 52-TQFP (10x10) |
||
onsemi |
IC CLK BUFFER 1:2 1.5GHZ 8-SOIC
|
pacchetto: - |
Request a Quote |
|
- | 1:2 | - | - | - | - | - | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |