Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 800MHZ 20TSSOP
|
pacchetto: - |
Azione5.808 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 2:4 235MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione2.496 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 235MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 2:1 3.3V 32LQFP
|
pacchetto: 32-LQFP |
Azione2.528 |
|
1 | 2:12 | Yes/No | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL | LVCMOS | 350MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
ON Semiconductor |
IC CLK BUFFER 1:2 3GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.520 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 3GHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 8:8 80MHZ 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.480 |
|
1 | 8:8 | Yes/Yes | 3-State, TTL | TTL | 80MHz | 4.5 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione3.360 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 2:1 3GHZ 16VFQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione7.232 |
|
1 | 2:1 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 3GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 2.5GHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.368 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 2.5GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Texas Instruments |
IC CLK BUFFER 1:6 100MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione4.784 |
|
1 | 1:6 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:18 200MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione2.160 |
|
1 | 1:18 | Yes/No | LVCMOS, LVPECL, LVTTL | LVCMOS, LVTTL | 200MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione3.312 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
NXP |
IC CLK BUFFER 1:5 3GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione3.056 |
|
2 | 1:5 | Yes/Yes | ECL, PECL | ECL, PECL | 3GHz | 2.375 V ~ 3.465 V | 0°C ~ 110°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 3:6 266MHZ 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione7.360 |
|
1 | 3:6 | No/Yes | LVCMOS, LVTTL, Crystal | LVPECL | 266MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:4 3GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione7.744 |
|
1 | 1:4 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL, LVTTL | LVCMOS, LVPECL | 3GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Diodes Incorporated |
IC CLOCK BUFFER MUX 2:10 32TQFP
|
pacchetto: 32-TQFP Exposed Pad |
Azione2.816 |
|
1 | 2:10 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVPECL | 1.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-TQFP Exposed Pad | 32-TQFP (7x7) |
||
Silicon Labs |
IC BUFFER1:5 LVPECL 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.232 |
|
1 | 2:5 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 725MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 133MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione16.308 |
|
1 | 1:10 | No/No | Clock | TTL | 133MHz | 1.425 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:16 LVDS 52VFQFPN
|
pacchetto: 52-VFQFN Exposed Pad |
Azione7.504 |
|
1 | 2:16 | Yes/Yes | HCSL, HSTL, LVPECL, LVTTL | LVDS | 1GHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 52-VFQFN Exposed Pad | 52-VFQFPN (8x8) |
||
ON Semiconductor |
1:4 HCSL FANOUT BUFFER
|
pacchetto: 24-VFQFN Exposed Pad |
Azione7.312 |
|
1 | 1:4 | Yes/Yes | HCSL, LVCMOS, LVDS, LVPECL, LVTTL | HCSL | 350MHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
ON Semiconductor |
IC CLK BUFFER 1:2 1GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione498.180 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 1GHz | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Analog Devices Inc. |
IC CLOCK BUFFER 1:4 24SMT
|
pacchetto: 24-TFCQFN Exposed Pad |
Azione3.984 |
|
1 | 1:4 | Yes/Yes | CML | CML | 13GHz | -3 V ~ -3.6 V | -40°C ~ 85°C | Surface Mount | 24-TFCQFN Exposed Pad | 24-CSMT (4x4) |
||
Linear Technology |
IC POWER MANAGEMENT
|
pacchetto: 36-WFQFN Exposed Pad |
Azione5.952 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVPECL | 1.8GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: - |
Azione4.352 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 140MHz | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: - |
Azione5.664 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 140MHz | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:2 750MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione6.960 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Texas Instruments |
IC CLK BUFFER 1:4 350MHZ 16VQFN
|
pacchetto: - |
Azione3.504 |
|
1 | 1:4 | Yes/No | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL | LVCMOS, LVTTL | 350 MHz | 1.425V ~ 3.465V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |
||
Diodes Incorporated |
IC CLK TRANSLTR 1:1 360MHZ 8SOIC
|
pacchetto: - |
Azione30.111 |
|
1 | 1:1 | Yes/No | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVCMOS, LVTTL | 360 MHz | 2.375V ~ 2.625V, 3V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:6 200MHZ 14TSSOP
|
pacchetto: - |
Request a Quote |
|
1 | 1:6 | No/No | LVCMOS | LVCMOS | 200 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |