Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CTS-Frequency Controls |
IC CLOCK BUFFER 1:1 800MHZ
|
pacchetto: 8-UFQFN |
Azione3.648 |
|
1 | 1:1 | No/Yes | LVCMOS, Sine Wave | LVPECL | 800MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-UFQFN | 8-QFN (1.5x1.5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 2GHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione3.904 |
|
1 | 2:4 | Yes/Yes | HSTL, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:17 500MHZ 52TQFP
|
pacchetto: 52-LQFP |
Azione4.992 |
|
1 | 2:17 | Yes/Yes | CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 500MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 52-LQFP | 52-TQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione3.824 |
|
1 | 2:9 | Yes/Yes | CML, HCSL, HSTL, LVDS, LVPECL, SSTL | HSTL | 500MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 27MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.160 |
|
1 | 1:4 | No/No | Clock, Crystal | Clock | 27MHz | 2.375 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 200MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione51.372 |
|
1 | 1:4 | No/No | CMOS | CMOS | 200MHz | 2.375 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUF 4:20/2:10 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione7.424 |
|
1 or 2 | 4:20, 2:10 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.3 V ~ 3.47 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
NXP |
IC CLK BUFFER 1:4 533MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.464 |
|
1 | 1:4 | No/No | LVTTL | LVTTL | 533MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
NXP |
IC CLK BUFFER 1:10 150MHZ 28SSOP
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione4.288 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 150MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Diodes Incorporated |
IC CLK BUFFER 2:6 250MHZ 28QSOP
|
pacchetto: 28-SSOP (0.154", 3.90mm Width) |
Azione7.632 |
|
1 | 2:6 | Yes/Yes | LVDS, TTL | Clock | 250MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 28-SSOP (0.154", 3.90mm Width) | 28-QSOP |
||
Microchip Technology |
IC CLK BUFFER 2:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione3.888 |
|
1 | 2:9 | Yes/Yes | PECL, TTL | PECL | - | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 2:8 160MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione18.828 |
|
1 | 2:8 | Yes/Yes | PECL, TTL | TTL | 160MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
ON Semiconductor |
IC CLK BUFFER 4:2 7GHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione6.480 |
|
1 | 4:2 | Yes/Yes | CML, LVDS, LVPECL | CML | 7GHz | 1.71 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 2:4 2.5GHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione9.648 |
|
1 | 2:4 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 2.5GHz | 2.97 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:10 166MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione7.840 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 166MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:2 200MHZ LVCMOS
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.768 |
|
1 | 1:2 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 200MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
IC CLOCK BUFFER MUX 2:4 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione2.100 |
|
1 | 2:4 | Yes/Yes | LVCMOS, LVTTL | LVDS | 650MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Diodes Incorporated |
CLOCK BUFFER TSSOP-28
|
pacchetto: - |
Azione2.720 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 8:8 80MHZ 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione7.328 |
|
1 | 8:8 | Yes/Yes | 3-State | LVTTL | 80MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Texas Instruments |
IC CLK BUFFER 1:10 650MHZ 48VQFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione4.272 |
|
1 | 1:10 | Yes/Yes | LVDS | CML | 650MHz | 1.7 V ~ 1.9 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-VQFN (7x7) |
||
Microsemi Corporation |
6 OUTPUT PROGRAMMABLE FANOUT BUF
|
pacchetto: - |
Azione8.052 |
|
1 | 4:6 | Yes/Yes | CMOS, Crystal | CML, CMOS, HCSL, HSTL, LVDS, LVPECL, SSTL | 1.035GHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 2:6 3GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione3.424 |
|
1 | 2:6 | Yes/Yes | CML, LVDS, PECL | LVPECL | 3GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Silicon Labs |
IC CLK BUFFER 1:4 LVDS 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione14.112 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVDS, LVPECL | LVDS | 710MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 160MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione23.508 |
|
1 | 1:4 | No/No | CMOS | CMOS | 160MHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 1:2 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.800 |
|
1 | 1:2 | Yes/Yes | ECL | ECL | - | 4.2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Texas Instruments |
LOW SKEW CLOCK DRIVER, 330 SERIE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
QS5920 - CLOCK DRIVER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
9SBV0802A DUAL 1:4 1V SINGLE END
|
pacchetto: - |
Azione7.470 |
|
2 | 1:4 | No/No | LVCMOS | LVCMOS | 48 MHz | 1.7V ~ 1.9V | -40°C ~ 85°C (TA) | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) |