Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 100MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione2.288 |
|
2 | 1:5 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC FANOUT BUFF LVPECL 16VFQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.472 |
|
- | - | - | Clock | LVPECL | - | - | - | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLEXER 2:1 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.488 |
|
1 | 2:1 | No/Yes | LVCMOS, LVTTL | LVPECL | - | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Fairchild/ON Semiconductor |
IC CLK BUFFER 1:2/1:6 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione7.072 |
|
2 | 1:2, 1:6 | No/No | GTLP, TTL | GTLP, TTL | - | 3.15 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:5 3GHZ 32TQFP
|
pacchetto: 32-TQFP |
Azione2.656 |
|
2 | 1:5 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:15 2GHZ 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione16.896 |
|
1 | 2:15 | Yes/Yes | CML, LVDS, PECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
ON Semiconductor |
IC CLK BUFFER 1:9 800MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione3.728 |
|
1 | 1:9 | Yes/Yes | ECL, PECL | ECL, PECL | 800MHz | 4.2 V ~ 5.7 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
ON Semiconductor |
IC CLK BUF 1:4/1:5 700MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione30.000 |
|
2 | 1:4, 1:5 | Yes/Yes | ECL, PECL | ECL, PECL | 700MHz | 4.2 V ~ 5.7 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 8:8 80MHZ 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione12.252 |
|
1 | 8:8 | Yes/Yes | 3-State | LVTTL | 80MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
NXP |
IC CLK BUFFER 2:12 350MHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione3.088 |
|
1 | 2:12 | Yes/Yes | LVCMOS, LVPECL | LVCMOS | 350MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC CLK BUFFER 1:10 1GHZ 52LQFP
|
pacchetto: 52-LQFP Exposed Pad |
Azione5.520 |
|
2 | 1:10 | Yes/Yes | ECL, PECL | ECL, PECL | 1GHz | 2.375 V ~ 3.465 V | -40°C ~ 110°C | Surface Mount | 52-LQFP Exposed Pad | 52-LQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:8 500MHZ 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione2.400 |
|
1 | 1:8 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | HCSL | 500MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
Microsemi Corporation |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione3.872 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 2:4 1GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione4.368 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 1GHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 2:6 250MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione4.176 |
|
1 | 2:6 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 2GHZ 40QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione6.512 |
|
2 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
Diodes Incorporated |
IC CLOCK BUFF 3:8 200MHZ 32TQFN
|
pacchetto: 32-WFQFN Exposed Pad |
Azione4.544 |
|
1 | 3:8 | Yes/No | LVCMOS, LVTTL, Crystal | CMOS | 200MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-WFQFN Exposed Pad | 32-TQFN (5x5) |
||
Silicon Labs |
IC CLK BUFF 1:10 LVPECL 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.208 |
|
1 | 2:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 1.25GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.616 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 100MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPLX 2:1 250MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione16.248 |
|
1 | 2:1 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 200MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione21.564 |
|
1 | 1:2 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 200MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Texas Instruments |
IC CLK BUFFER 1:6 250MHZ 14TSSOP
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione18.684 |
|
1 | 1:6 | No/No | LVCMOS | LVCMOS | 250MHz | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
Diodes Incorporated |
IC CLOCK
|
pacchetto: - |
Azione4.384 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Diodes Incorporated |
IC CLOCK
|
pacchetto: - |
Azione7.344 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
DB2000Q BUFFER WITH ULTRA LOW JI
|
pacchetto: 72-VFQFN Exposed Pad |
Azione19.740 |
|
1 | 1:20 | Yes/Yes | Clock | HCSL | 250MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 72-VFQFN Exposed Pad | 72-QFN (10x10) |
||
Renesas Electronics Corporation |
IC CLK MULTIPLX 12:1 32VFQFPN
|
pacchetto: - |
Azione7.500 |
|
1 | 12:1 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVPECL | 3.2 GHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
SiTime |
-40C TO 85C, 8PIN, 2020, 1.8V-3.
|
pacchetto: - |
Request a Quote |
|
1 | 1:4 | No/No | Clock | LVCMOS | 200 MHz | 1.8V ~ 3.3V | -40°C ~ 105°C (TA) | Surface Mount | 8-WFDFN | 8-DFN (2x2) |
||
Microchip Technology |
IC CLK BUFFER 1:2 250MHZ 8VDFN
|
pacchetto: - |
Azione11.304 |
|
1 | 1:2 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 8-VFDFN | 8-VDFN (1.6x1.4) |