Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 2:10 700MHZ 32LQFP
|
pacchetto: 32-LQFP Exposed Pad |
Azione5.872 |
|
1 | 2:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 700MHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 32-LQFP Exposed Pad | 32-LQFP (7x7) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:2 1.5GHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione3.264 |
|
1 | 1:2 | Yes/Yes | CML, LVPECL | CML | 1.5GHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 350MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione2.592 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVDS | 350MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Texas Instruments |
IC CLK BUFFER 1:4 27MHZ 16DSBGA
|
pacchetto: 16-WFBGA, DSBGA |
Azione6.272 |
|
1 | 1:4 | No/No | Clock | Clock | 27MHz | 2.5 V ~ 5.5 V | -20°C ~ 85°C | Surface Mount | 16-WFBGA, DSBGA | 16-DSBGA |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione5.744 |
|
1 | 1:10 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Microchip Technology |
IC CLK BUFFER 2:8 160MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione7.360 |
|
1 | 2:8 | Yes/Yes | PECL, TTL | TTL | 160MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:4 160MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione6.688 |
|
1 | 1:4 | Yes/Yes | PECL | TTL | 160MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
NXP |
IC CLK BUFFER 1:18 250MHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione2.256 |
|
1 | 1:18 | No/No | LVCMOS, LVTTL | LVCMOS | 250MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione6.336 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 250MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione7.552 |
|
1 | 1:10 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL | HCSL | 250MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:2 266MHZ 14TSSOP
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione3.344 |
|
1 | 2:2 | No/Yes | LVCMOS, LVTTL | LVPECL | 266MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:12 250MHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione5.696 |
|
1 | 1:12 | No/No | LVCMOS, LVTTL | LVCMOS | 250MHz | 1.6 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP |
||
Microsemi Corporation |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione6.304 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
ON Semiconductor |
IC CLK BUFF 2:1:4 LVPECL 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.384 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, HSTL, LVDS, LVPECL, SSTL | LVDS | 650MHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:4 40MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione6.832 |
|
1 | 1:4 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Silicon Labs |
IC CLK BUFFER 1:4 HCSL 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione2.096 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVDS, LVPECL | HCSL | 250MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 160MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.152 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 160MHz | 1.4 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione2.624 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.848 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 100MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC MUX 2:1 DIFF-HCSL 16VFQFPN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.296 |
|
1 | 2:2 | Yes/Yes | HCSL | HCSL | 250MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 2:4 1.5GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.928 |
|
1 | 2:4 | Yes/Yes | LVPECL | LVPECL | 1.5GHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:2 3GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione65.388 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 3GHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Linear Technology |
IC CLK BUFFER 1:3 1.4GHZ
|
pacchetto: 36-WFQFN Exposed Pad |
Azione6.800 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Maxim Integrated |
IC CLK BUFFER 1:2 3GHZ 8UMAX
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione24.702 |
|
1 | 1:2 | Yes/Yes | ECL, PECL, LVECL, LVPECL | ECL, PECL, LVECL, LVPECL | 3GHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-uMAX |
||
IDT, Integrated Device Technology Inc |
CLOCK SYNTHESIZE/GENERATOR/PLL
|
pacchetto: - |
Azione5.376 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:4 750MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione8.856 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Texas Instruments |
IC CLK BUFFER 1:4 2GHZ 28VQFN
|
pacchetto: - |
Azione3.732 |
|
2 | 1:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 2 GHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 28-VFQFN Exposed Pad | 28-VQFN (5x5) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:4 200MHZ 8VFQFN
|
pacchetto: - |
Request a Quote |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 200 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 8-UFDFN | 8-VFQFN (2x2) |