Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Silego Technology |
A 1:4 CLOCK BUFFER. DC UP TO 100
|
pacchetto: - |
Azione6.416 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 166MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.608 |
|
1 | 1:2 | No/No | LVTTL | LVCMOS, LVTTL | 166MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 450MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.912 |
|
1 | 1:2 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVEPECL, LVPECL, LVTTL | LVDS | 450MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 200MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.904 |
|
1 | 1:4 | No/No | Clock | Clock | 200MHz | 1.425 V ~ 2.625 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Silicon Labs |
IC CLK BUFFER 1:4 250MHZ 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione3.200 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVDS, LVPECL | HCSL | 250MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:10 150MHZ 32TQFP
|
pacchetto: 32-TQFP |
Azione4.832 |
|
1 | 1:10 | No/No | HSTL | HSTL | 150MHz | 1.35 V ~ 1.65 V | 0°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:9 135MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione2.576 |
|
1 | 1:9 | Yes/Yes | PECL | TTL | 135MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 50MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.720 |
|
2 | 1:5 | No/No | CMOS, TTL | CMOS | 50MHz | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 66MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione2.240 |
|
2 | 1:5 | No/No | CMOS, TTL | CMOS | 66MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:8 4GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione7.296 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 4GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
ON Semiconductor |
IC CLK BUFFER 2:20 1GHZ 52QFN
|
pacchetto: 52-VFQFN Exposed Pad |
Azione7.248 |
|
1 | 2:20 | Yes/Yes | ECL, HSTL, LVPECL | ECL, PECL | 1GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 52-VFQFN Exposed Pad | 52-QFN (8x8) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:18 250MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione4.608 |
|
1 | 2:18 | Yes/No | CML, LVCMOS, LVPECL, LVTTL, SSTL | LVCMOS, LVTTL | 175MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
Diodes Incorporated |
1 TO 4 LVCMOS/ LVTTL FANOUT BUFF
|
pacchetto: - |
Azione2.672 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
TEN LVCMOS OUTPUT LOW ADDITIVE J
|
pacchetto: - |
Azione7.152 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Diodes Incorporated |
IC CLK BUFFER 1:10 150MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione11.172 |
|
1 | 1:10 | No/No | CMOS, TTL | CMOS, TTL | 150MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Diodes Incorporated |
CLOCK BUFFER TSSOP-28
|
pacchetto: - |
Azione2.576 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 166MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione7.248 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | 166MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:7 133MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione4.384 |
|
1 | 1:7 | No/No | CMOS, TTL | CMOS, TTL | 133MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Diodes Incorporated |
CLOCK BUFFER SSOP-20
|
pacchetto: - |
Azione7.264 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 8:8 80MHZ 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.304 |
|
1 | 8:8 | Yes/Yes | 3-State, TTL | TTL | 80MHz | 4.5 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Diodes Incorporated |
IC CLOCK BUFFER MUX 2:5 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.384 |
|
1 | 2:5 | Yes/Yes | LVCMOS | LVPECL | 1.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Silicon Labs |
IC TRANSLATOR BUFF/LEVEL 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione16.824 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | CML, HCSL, LVCMOS, LVDS, LVPECL | 1.25GHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:5 650MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione28.056 |
|
1 | 2:5 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 650MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 650MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.584 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 650MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Texas Instruments |
IC CLK BUFFER 1:3 250MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.416 |
|
1 | 1:3 | No/No | LVCMOS | LVCMOS | 250MHz | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione3.104 |
|
1 | 1:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Skyworks Solutions Inc. |
IC CLK BUFFER 2:8 100MHZ 40QFN
|
pacchetto: - |
Request a Quote |
|
1 | 1:8 | Yes/Yes | Clock, HCSL | Clock, HCSL | 100 MHz | 1.71V ~ 3.46V | -40°C ~ 105°C (TA) | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (6x6) |
||
Microchip Technology |
IC CLK BUFFER 2:8 250MHZ 48VQFN
|
pacchetto: - |
Request a Quote |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVDS, PECL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 48-VFQFN Exposed Pad | 48-VQFN (6x6) |