Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Diodes Incorporated |
IC CLK BUFFER 1:4 160MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione103.044 |
|
1 | 1:4 | No/No | CMOS, TTL | CMOS, TTL | 160MHz | 3.135 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
IC CLK BUFFER 1:10 140MHZ 28SSOP
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione18.612 |
|
1 | 1:10 | No/No | TTL | TTL | 140MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 3:16 350MHZ 48TQFP
|
pacchetto: 48-LQFP |
Azione5.776 |
|
1 | 3:16 | Yes/No | LVCMOS, LVPECL | LVCMOS | 350MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 3:16 350MHZ 48TQFP
|
pacchetto: 48-LQFP |
Azione19.740 |
|
1 | 3:16 | Yes/No | LVCMOS, LVPECL | LVCMOS | 350MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione4.688 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 133MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.776 |
|
1 | 1:4 | No/No | Clock | Clock | 133MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 2:1 3GHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione5.952 |
|
1 | 2:1 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 3GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:9 700MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione2.080 |
|
1 | 1:9 | Yes/Yes | ECL, PECL | ECL, PECL | 700MHz | 4.5 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
ON Semiconductor |
IC CLK BUFFER 2:24 1GHZ 64LQFP
|
pacchetto: 64-LQFP Exposed Pad |
Azione6.000 |
|
1 | 2:24 | Yes/Yes | ECL, LVDS, LVPECL, NECL, PECL | ECL, PECL | 1GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 64-LQFP Exposed Pad | 64-LQFP (10x10) |
||
Microchip Technology |
IC CLK BUFFER 1:2 8GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione5.664 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | CML | 8GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Texas Instruments |
IC CLK BUFFER 3:5 3.1GHZ 32WQFN
|
pacchetto: 32-WFQFN Exposed Pad |
Azione5.504 |
|
1 | 3:5 | Yes/Yes | CML, HCSL, HSTL, LVDS, LVPECL, SSTL, Crystal | HCSL, LVCMOS, LVDS, LVPECL | 3.1GHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 32-WFQFN Exposed Pad | 32-WQFN (5x5) |
||
Diodes Incorporated |
CLOCK BUFFER QSOP-20
|
pacchetto: - |
Azione36.000 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Maxim Integrated |
IC CLK DATA DRVR 1:1 3GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.568 |
|
1 | 1:1 | Yes/Yes | ECL, PECL, LVECL, LVPECL | ECL, PECL, LVECL, LVPECL | 3GHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Analog Devices Inc. |
IC CLK BUFFER 1:6 1.2GHZ 24LFCSP
|
pacchetto: 24-VFQFN Exposed Pad, CSP |
Azione3.184 |
|
1 | 1:6 | Yes/Yes | CML, CMOS, HSTL, LVDS, LVPECL | CMOS, LVDS | 1.2GHz | 1.71 V ~ 1.89 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad, CSP | 24-LFCSP-VQ (4x4) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.056 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 1:2 3GHZ 8TSSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione14.640 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 3GHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione13.944 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Analog Devices Inc. |
IC CLK BUFFER 1:1 7.5GHZ 16LFCSP
|
pacchetto: 16-VFQFN Exposed Pad, CSP |
Azione9.336 |
|
1 | 1:1 | Yes/Yes | Clock | ECL, NECL, PECL | 7.5GHz | 2.375 V ~ 3.63 V | -40°C ~ 125°C | Surface Mount | 16-VFQFN Exposed Pad, CSP | 16-LFCSP-VQ (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 156MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.008 |
|
1 | 1:2 | No/No | CMOS | 3-State, CMOS | 156MHz | 3 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 166MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione19.848 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | 166MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Microchip Technology |
LOW SKEW, LOW ADDITIVE JITTER 3
|
pacchetto: 48-VFQFN Exposed Pad |
Azione5.088 |
|
1 | 3:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | HCSL, LVCMOS, LVDS, LVPECL | 1.6GHz | 1.35V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:4 750MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione4.832 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 750MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.936 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Texas Instruments |
IC CLK BUFFER 1:2 250MHZ 8WSON
|
pacchetto: - |
Azione1.239 |
|
1 | 1:2 | No/No | Clock, LVCMOS | Clock, LVCMOS | 250 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN | 8-WSON (2x2) |
||
Renesas Electronics Corporation |
IC CLK BUF 1:10 200MHZ 20TSSOP
|
pacchetto: - |
Request a Quote |
|
1 | 1:10 | No/No | LVCMOS | LVCMOS | 200 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Texas Instruments |
IC CLK BUFFER 2:8 2GHZ 28VQFN
|
pacchetto: - |
Request a Quote |
|
1 | 2:8 | Yes/Yes | HCSL, LVCMOS, LVDS, LVPECL | LVDS | 2 GHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 28-VFQFN Exposed Pad | 28-VQFN (5x5) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:4 800MHZ 20TSSOP
|
pacchetto: - |
Request a Quote |
|
1 | 1:4 | Yes/Yes | LVDS, LVHSTL, SSTL, HCSL, LVPECL | LVDS | 800 MHz | 3.135V ~ 3.465V | 0°C ~ 70°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:20 400MHZ 80AQFN
|
pacchetto: - |
Request a Quote |
|
1 | 1:20 | Yes/Yes | CMOS, HCSL | HCSL | 400 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 80-VFQFN Dual Rows, Exposed Pad | 80-aQFN (6x6) |