Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20CERDIP
|
pacchetto: 20-CDIP (0.300", 7.62mm) |
Azione7.456 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.5 V ~ 5.5 V | -55°C ~ 125°C | Through Hole | 20-CDIP (0.300", 7.62mm) | 20-CDIP |
||
Diodes Incorporated |
IC CLK BUFFER 1:10 125MHZ 28SSOP
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione7.856 |
|
1 | 1:10 | No/No | TTL | TTL | 125MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 160MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.376 |
|
1 | 1:4 | No/No | LVTTL | LVTTL | 160MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione7.664 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 2GHZ 16VFQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.696 |
|
1 | 1:2 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
ON Semiconductor |
IC CLK BUFFER 1:9 800MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione6.848 |
|
1 | 1:9 | Yes/Yes | ECL, PECL | ECL, PECL | 800MHz | 4.2 V ~ 5.7 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
NXP |
IC CLK BUFFER 2:10 250MHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione5.984 |
|
1 | 2:10 | No/No | LVCMOS | LVCMOS | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 66MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione2.640 |
|
2 | 1:5 | No/No | CMOS, TTL | CMOS | 66MHz | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Microchip Technology |
IC CLK BUFFER 2:12 3GHZ 44MLF
|
pacchetto: 44-VFQFN Exposed Pad, 44-MLF? |
Azione5.104 |
|
1 | 2:12 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 3GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF? | 44-MLF? (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:4 160MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione3.952 |
|
1 | 1:4 | Yes/Yes | PECL | TTL | 160MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione7.488 |
|
1 | 1:2 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:16 500MHZ 48TQFP
|
pacchetto: 48-LQFP |
Azione7.120 |
|
1 | 1:16 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 500MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-LQFP | 48-LQFP |
||
IDT, Integrated Device Technology Inc |
IC CLK DIVIDR 2:4 200MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione2.304 |
|
1 | 2:4 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:3 1GHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione156.600 |
|
2 | 1:3 | Yes/Yes | ECL, PECL | ECL, PECL | 1GHz | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:2 650MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione4.464 |
|
1 | 2:2 | Yes/Yes | CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 650MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:6 3GHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione3.744 |
|
1 | 2:6 | Yes/Yes | LVCMOS, LVPECL | LVPECL | 3GHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
Texas Instruments |
IC CLK BUFFER 1:4 60MHZ 20SO
|
pacchetto: 20-SOIC (0.209", 5.30mm Width) |
Azione2.224 |
|
2 | 1:4 | No/No | TTL | CMOS | 60MHz | 4.5 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.209", 5.30mm Width) | 20-SO |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 200MHZ 8VFQFPN
|
pacchetto: 8-VFDFN Exposed Pad |
Azione5.456 |
|
1 | 1:4 | No/No | Clock | LVCMOS | 200MHz | 1.14 V ~ 1.89 V | 0°C ~ 70°C | Surface Mount | 8-VFDFN Exposed Pad | 8-VFQFPN (2x2) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione2.704 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 2GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione23.556 |
|
1 | 1:2 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVDS | 2GHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
IDT, Integrated Device Technology Inc |
IC NETWORK TIMING VFQFPN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione7.184 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 1GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
Diodes Incorporated |
IC CLOCK
|
pacchetto: - |
Azione3.456 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 8-UFDFN |
Azione4.000 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 105°C (TA) | Surface Mount | 8-UFDFN | 8-VFQFN (2x2) |
||
Microchip Technology |
IC CLK BUFF MUX 4:3 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione8.100 |
|
1 | 4:3 | Yes/Yes | CMOS, Crystal | CML, CMOS, HCSL, HSTL, LVDS, LVPECL, SSTL | 1.035GHz | 1.71V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
IDT, Integrated Device Technology Inc |
3.3V LOW SKEW PLL CLOCK DRIVER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Skyworks Solutions Inc. |
IC CLK BUFFER 1:8 100MHZ 40QFN
|
pacchetto: - |
Request a Quote |
|
1 | 1:8 | Yes/Yes | HCSL | HCSL | 100 MHz | 1.71V ~ 3.46V | -40°C ~ 105°C (TA) | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (6x6) |
||
SiTime |
-40C TO 85C, 8PIN, 2020, 1.8V-3.
|
pacchetto: - |
Azione6.000 |
|
1 | 1:2 | No/No | Clock | LVCMOS | 200 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN | 8-DFN (2x2) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:6 200MHZ 20QFN
|
pacchetto: - |
Request a Quote |
|
1 | 1:6 | No/No | LVCMOS | LVCMOS | 200 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 20-VFQFN Exposed Pad | 20-QFN (3x3) |