Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Diodes Incorporated |
IC CLK BUFFER 1:5 156MHZ 16QSOP
|
pacchetto: 16-SSOP (0.154", 3.90mm Width) |
Azione4.272 |
|
1 | 1:5 | No/No | CMOS, TTL | CMOS, TTL | 156MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 16-SSOP (0.154", 3.90mm Width) | 16-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:16 1GHZ 52VFQFPN
|
pacchetto: 52-VFQFN Exposed Pad |
Azione3.552 |
|
1 | 2:16 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVPECL, LVTTL | LVDS | 1GHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 52-VFQFN Exposed Pad | 52-VFQFPN (8x8) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 250MHZ 48TSSOP
|
pacchetto: 48-TFSOP (0.240", 6.10mm Width) |
Azione6.592 |
|
1 | 1:5 | Yes/Yes | eHSTL, HSTL, LVPECL, LVTTL | eHSTL, HSTL, LVTTL | 250MHz | 2.4 V ~ 2.6 V | -40°C ~ 85°C | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 166MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione21.324 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | 166MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Maxim Integrated |
IC CLK BUFFER 2:5 1.5GHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione3.024 |
|
1 | 2:5 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 1.5GHz | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Diodes Incorporated |
IC CLK BUFFER 2:6 250MHZ 28TSSOP
|
pacchetto: 28-TSSOP (0.173", 4.40mm Width) |
Azione5.216 |
|
1 | 2:6 | Yes/Yes | LVDS, TTL | LVDS | 250MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | 28-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:4 160MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione6.016 |
|
1 | 1:4 | Yes/Yes | PECL | TTL | 160MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 2:8 1GHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione14.988 |
|
1 | 2:8 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 1GHz | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
NXP |
IC CLK BUFFER 3:15 200MHZ 52LQFP
|
pacchetto: 52-LQFP |
Azione4.992 |
|
1 | 3:15 | Yes/No | LVCMOS, LVPECL | LVCMOS | 200MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 52-LQFP | 52-LQFP (10x10) |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 66MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.912 |
|
2 | 1:5 | No/No | CMOS, TTL | CMOS | 66MHz | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Texas Instruments |
IC CLK BUFFER 1:9 650MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione3.360 |
|
1 | 1:9 | Yes/Yes | LVPECL | LVPECL | 650MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:6 1.7GHZ 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione4.848 |
|
1 | 1:6 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVDS | 1.7GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:6 5GHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione7.536 |
|
1 | 1:6 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Texas Instruments |
IC CLK BUFFER 1:10 100MHZ 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione55.200 |
|
1 | 1:10 | No/No | LVTTL | LVTTL, TRI-State | 100MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Texas Instruments |
IC CLK BUFFER 2:16 800MHZ 48VQFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione5.664 |
|
1 | 2:16 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVDS | 800MHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-VQFN (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 3GHZ 16 VQFP
|
pacchetto: 16-VFQFN Exposed Pad |
Azione2.864 |
|
1 | 1:2 | Yes/Yes | CML, ECL, LVDS, LVPECL | ECL, LVPECL | 3GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
ON Semiconductor |
IC CLK BUFFER 2:5 700MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione3.744 |
|
1 | 2:5 | Yes/Yes | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL | LVPECL | 700MHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Silicon Labs |
IC CLK BUFFER 1:4 LVPECL 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione7.296 |
|
1 | 1:4 | No/Yes | CMOS, HSTL, LVTTL, SSTL | LVPECL | 350MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.944 |
|
1 | 1:10 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 166MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione4.912 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 166MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Texas Instruments |
IC CLK BUFFER 2:8 400MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione6.112 |
|
1 | 2:8 | Yes/Yes | HCSL, LVCMOS, LVDS | HCSL, LVCMOS, LVDS | 400MHz | 1.7 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VQFN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 266MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione8.004 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL, Crystal | LVPECL | 266MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:3 2.5GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione6.064 |
|
1 | 1:3 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVPECL | 2.5GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 250MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione17.760 |
|
1 | 1:4 | No/Yes | LVCMOS, LVTTL | LVDS | 250MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 2:5 2GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione51.948 |
|
1 | 2:5 | Yes/Yes | CML, LVDS, PECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.888 |
|
2 | 3:3 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
Renesas Electronics Corporation |
9Q31103C DB2000QL, REV C
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 2:12 250MHZ 56VQFN
|
pacchetto: - |
Request a Quote |
|
1 | 2:12 | Yes/Yes | CML, HCSL, LVDS, PECL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-VQFN (8x8) |