Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Diodes Incorporated |
IC CLK BUFF 1:10 250MHZ
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione3.808 |
|
1 | 1:10 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 1.1 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 625MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.848 |
|
1 | 1:2 | Yes/Yes | PECL | HSTL | 625MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 133MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione4.784 |
|
1 | 1:10 | No/No | Clock | TTL | 133MHz | 1.425 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 350MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.864 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVDS | 350MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 650MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione2.480 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, HSTL, LVDS, LVHSTL, LVPECL, SSTL | HSTL | 650MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 8:8 80MHZ 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione2.576 |
|
1 | 8:8 | Yes/Yes | 3-State, TTL | TTL | 80MHz | 4.5 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
NXP |
IC CLK BUFFER 1:10 400MHZ 20SSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione7.136 |
|
1 | 1:10 | No/No | LVCMOS, LVTTL | LVTTL | 400MHz | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-SSOP |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 2:9 200MHZ 32TQFP
|
pacchetto: 32-TQFP |
Azione6.048 |
|
1 | 2:9 | Yes/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 200MHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:6 2GHZ 40QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione6.064 |
|
2 | 1:6 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
Texas Instruments |
IC CLK BUFFER 1:4 800MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.952 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 800MHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
pacchetto: 12-TSSOP (0.118", 3.00mm Width) |
Azione4.736 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
pacchetto: 12-WFDFN Exposed Pad |
Azione3.232 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Texas Instruments |
IC CLK BUF 1:10 200MHZ 28TSSOP
|
pacchetto: 28-TSSOP (0.173", 4.40mm Width) |
Azione4.784 |
|
1 | 1:10 | Yes/Yes | LVDS, LVPECL, PECL | LVDS | 200MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | 28-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:2 4GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.280 |
|
1 | 1:2 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL, LVTTL | LVPECL | 4GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 2GHZ 16VFQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione4.608 |
|
1 | 2:4 | Yes/Yes | LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPLX 1:2 2.5GHZ 16VFQF
|
pacchetto: 16-VFQFN Exposed Pad |
Azione2.208 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Diodes Incorporated |
CLOCK BUFFER SSOP-20
|
pacchetto: - |
Azione3.968 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Diodes Incorporated |
CLOCK BUFFER SSOP-20
|
pacchetto: - |
Azione3.200 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione13.680 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:2 1.5GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.264 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 1.5GHz | 4.2 V ~ 5.7 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:8 700MHZ 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione6.112 |
|
1 | 1:8 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVDS | 700MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione6.992 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 4GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione16.836 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, PECL | LVPECL | 4GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 24-VFQFN Exposed Pad |
Azione3.296 |
|
1 | 1:5 | Yes/No | HCSL, LVCMOS, LVDS, LVPECL, LVTTL, Crystal | LVCMOS, LVTTL | 200MHz | 1.4 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 24-VFQFN Exposed Pad | 24-VFQFPN (4x4) |
||
Nexperia USA Inc. |
74AVC1T1004DP/SOT552/TSSOP10
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione4.880 |
|
1 | 1:4 | No/No | Clock | Clock | - | 0.8 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-TSSOP |
||
Texas Instruments |
IC CLK BUFFER 2:8 2GHZ 48VQFN
|
pacchetto: - |
Request a Quote |
|
2 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | Clock, LVDS | 2 GHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-VQFN (7x7) |
||
Analog Devices Inc./Maxim Integrated |
IC CLK BUFFER 1:4 1.5GHZ 20TSSOP
|
pacchetto: - |
Request a Quote |
|
1 | 1:4 | No/Yes | LVCMOS | LVPECL | 1.5 GHz | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Diodes Incorporated |
CLOCK BUFFER W-QFN5050-32 T&R 2.
|
pacchetto: - |
Azione6.735 |
|
1 | 3:4 | Yes/Yes | LVCMOS, LVDS, Crystal | LVCMOS, LVDS | 1.5 GHz | 2.375V ~ 3.465V | -40°C ~ 125°C (TA) | Surface Mount | 32-WFQFN Exposed Pad | 32-WQFN (5x5) |