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STMicroelectronics has added eight new members to its STSPIN32 family of integrated motor drivers to meet the low-cost, high-performance requirements of applications such as power tools, home appliances, and industrial automation.

CES 2025 - Morse Microelectronics, the world's leading supplier of Wi-Fi HaLow chips based on the IEEE 802.11ah standard, announced the launch of the much-anticipated second-generation MM8108 system-on-chip (SoC). Following the great success of the first-generation MM6108 SoC, the MM8108 has achieved comprehensive breakthroughs in core indicators such as coverage, data throughput and power efficiency, while significantly reducing the cost, workload, and cycle of bringing next-generation Wi-Fi HaLow products to market.

Texas Instruments (TI) has introduced new integrated automotive chips that can help drivers and passengers in vehicles of all price points achieve a safer and more immersive driving experience.

MediaTek recently announced that it has collaborated with NVIDIA to design the NVIDIA GB10 Grace Blackwell superchip, which will be used in NVIDIA's personal AI supercomputer NVIDIA® Project DIGITS.

On January 7, Garmin and Qualcomm Technologies announced today at the 2025 International Consumer Electronics Show (CES 2025) that the two parties will expand their cooperation in the field of automotive technology and launch a new generation of digital cockpit solution Garmin Unified Cabin 2025, which can provide scalable domain controller functions based on a single Garmin control module.

Russian server manufacturer Graviton has announced the launch of its S2124B server, designed for AI and high-performance computing (HPC) workloads. This server is notable for being powered by domestically developed processors, featuring up to eight GPU accelerators to handle demanding computational tasks.

The MTCH2120 touch controller is designed for seamless integration with a comprehensive tool ecosystem, simplifying development processes and accelerating time-to-market. This turnkey solution offers a straightforward way to upgrade mechanical buttons to modern touch buttons or displays.

Rapidus has achieved a significant milestone, becoming the first Japanese semiconductor company to receive Extreme Ultraviolet (EUV) lithography equipment, marking a crucial step toward producing Japan's most advanced semiconductor chips.

Nexperia has launched 16 new 80V and 100V power MOSFETs with an innovative copper clip CCPA12 packaging design, offering industry-leading power density, high current handling, low parasitic inductance, and excellent thermal performance. These devices are ideal for motor control, power supplies, renewable energy systems, and other high-power applications. The series also includes application-specific

On December 10, Google made a groundbreaking announcement, unveiling its latest quantum chip, Willow, which features 105 physical qubits and delivers state-of-the-art performance across multiple metrics. Willow also marks two significant achievements in the field of quantum computing: