Tendenze del settore

On December 3rd, reports have surfaced indicating that AMD has quietly disabled the loop buffer functionality in its Zen 4 architecture processors following a recent BIOS update. The specific reasons behind this decision remain undisclosed.

Melexis, a global microelectronics leader, has introduced the MLX91235, a coreless current sensor chip designed to accurately measure high currents flowing through PCB traces and busbars. Targeted at automotive and alternative mobility applications, the sensor supports use cases such as inverters, battery management systems (BMS), and low-voltage DC-DC converters.

Nexperia has introduced a series of high-performance gate driver ICs for driving high-side and low-side N-channel MOSFETs in synchronous buck or half-bridge configurations. These ICs, available in automotive-grade and industrial-grade versions, deliver high current output and dynamic performance to enhance efficiency and robustness.

STMicroelectronics has launched ST AIoT Craft, a web-based tool designed to simplify the development of AIoT (Artificial Intelligence of Things) projects and related network configurations. The tool focuses on leveraging the Machine Learning Core (MLC) of ST’s intelligent MEMS sensors, enabling efficient node-to-cloud solutions.

A team from the Massachusetts Institute of Technology (MIT) has successfully developed a novel nanometer-scale 3D transistor using ultra-thin semiconductor materials. This transistor is the smallest 3D transistor known to date, with performance and functionality that can match or even exceed current silicon-based transistors. It is expected to open new pathways for the development of high-performance, energy-efficient electronic products. The related paper was published in the Nature Electronics journal on the 5th.

Scientists at the Korea Institute of Materials Science have developed an ultra-thin composite film capable of absorbing over 99% of electromagnetic waves across various frequencies, including 5G, 6G, WiFi, and radar for autonomous vehicles, which could significantly enhance the reliability of wireless communication. The findings were published in Advanced Functional Materials.

On October 22, the Semiconductor Industry Association (SEMI) released its 2024 silicon shipment forecast report in California. The report predicts that after a significant decline of 14.3% in 2023, global silicon wafer shipments will experience a smaller year-on-year drop of 2.4% in 2024.

Developers now have access to enhanced storage and advanced functionalities with the STM32C0 microcontroller (MCU), enabling more sophisticated capabilities in resource-constrained and cost-sensitive embedded applications.

STMicroelectronics has introduced its new Page EEPROM, which combines the energy efficiency and durability of EEPROM technology with the storage capacity and read/write speed of flash memory. This hybrid memory solution is ideal for applications that face extreme space and power constraints, providing embedded systems with storage options that meet rising demands for both capacity and performance.

X-FAB Silicon Foundries (“X-FAB”), a globally recognized leader in analog/mixed-signal semiconductor foundries, today announced the release of four new high-performance photodiodes on its 180nm CMOS process platform, XS018, which is specially optimized for optical sensor applications. This addition expands the options available for photodetectors and strengthens X-FAB's already extensive product portfolio.