Infineon Technologies AG introduces the next generation of XENSIV MEMS microphones, which define a new industry standard. The microphones IM69D127, IM73A135 and IM72D128, are the latest additions to its growing microphone portfolio. Coupled with selectable power modes, MEMS microphones are an excellent choice for consumer electronics, including ANC headsets, TWS headsets, conferencing devices with beamforming capabilities, tablets, laptops, or smart speakers with voice user interfaces. Use cases also include selected industrial applications such as predictive maintenance and safety.
Microphones are used to capture audio signals with the highest precision and quality. They are based on the company's latest Sealed Double Membrane (SDM) MEMS technology and offer microphone-grade high ingress protection (IP57). Microphones built with SDM technology can be used to create IP68 devices with the highest degree of protection, requiring only minimal mesh protection. Additionally, the hermetic MEMS design prevents water or dust from entering between the membrane and backplate, bypassing the problems common with mechanically blocked or leaky MEMS microphones.
The IM69D127 offers similar performance in a small 3.6mm x 2.5mm2 package. In addition, even at high sound pressure levels, all devices provide extremely low distortion (THD), very tight part-to-part phase and sensitivity matching, and flat frequency response with low FRO, ultra-low group delay, and selectable power modes.
The analog microphone IM73A135 delivers the industry's best 73dB(a) SIGNal-to-noise ratio and excellent 135dB SPL AOP. Its digital version, IM72D128, offers 72dB(A) signal-to-noise ratio and 128dB SPL AOP.
