Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx Inc. |
IC PROM PROG 50K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.600 |
|
50kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM PROG I-TEMP 3.3V 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.376 |
|
50kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM PROG C-TEMP 3.3V 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.232 |
|
50kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.016 |
|
65kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC SER CFG PROM 65K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.592 |
|
65kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione13.800 |
|
65kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione4.320 |
|
65kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER C-TEMP 3.3V 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione23.280 |
|
65kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.248 |
|
65kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.560 |
|
65kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC PROM SER C-TEMP 3.3V 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione169.584 |
|
65kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.720 |
|
65kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER C-TEMP 3.3V 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione12.468 |
|
65kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione6.480 |
|
65kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER C-TEMP 3.3V 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione203.700 |
|
65kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 512K 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.616 |
|
512kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER C-TEMP 512K 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.328 |
|
512kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER I-TEMP 512K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.976 |
|
512kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER C-TEMP 512K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione11.304 |
|
512kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 512K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione5.904 |
|
512kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER C-TEMP 512K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione13.524 |
|
512kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC SER CFG PROM 36K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.944 |
|
36kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 36K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.096 |
|
36kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC PROM SER I-TEMP 36K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione12.300 |
|
36kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 36K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione14.472 |
|
36kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER C-TEMP 36K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione116.232 |
|
36kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC SERIAL CFG PROM 256K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.008 |
|
256Kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 256K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione14.400 |
|
256Kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |