Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx Inc. |
IC SER CFG PROM 65K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.336 |
|
65kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC SER CFG PROM 36K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.344 |
|
36kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 128K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione15.108 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 65K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.100 |
|
65kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 36K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.944 |
|
36kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 65K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.596 |
|
65kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC MEM PROM 16MB 3.3V 44PIN
|
pacchetto: 44-CCC (J-Lead) |
Azione7.120 |
|
16Mb | 3 V ~ 3.6 V | -55°C ~ 125°C (TC) | 44-CCC (J-Lead) | 44-CCCP (16.51x16.51) |
||
Xilinx Inc. |
IC MEM PROM 16MB 3.3V 44PIN
|
pacchetto: 44-CCC (J-Lead) |
Azione3.776 |
|
16Mb | 3 V ~ 3.6 V | -55°C ~ 125°C (TC) | 44-CCC (J-Lead) | 44-CCCP (16.51x16.51) |
||
Xilinx Inc. |
IC MEM PROM 16MB 3.3V 44CCC
|
pacchetto: 44-CCC (J-Lead) |
Azione7.072 |
|
16Mb | 3 V ~ 3.6 V | -55°C ~ 125°C (TC) | 44-CCC (J-Lead) | 44-CCCP (16.51x16.51) |
||
Xilinx Inc. |
QPRO FLASH PROM 32MBIT VOG48
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione2.432 |
|
32Mb | 1.65 V ~ 2 V | -55°C ~ 125°C | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Xilinx Inc. |
IC CONFIG PROM 4MBIT 44TQFP
|
pacchetto: 44-TQFP |
Azione11.880 |
|
4Mb | 3 V ~ 3.6 V | -55°C ~ 125°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM SERIAL 16MB 44-VQFN
|
pacchetto: 44-TQFP |
Azione2.880 |
|
16Mb | 3 V ~ 3.6 V | -55°C ~ 125°C (TJ) | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM SERIAL 16MB DIE
|
pacchetto: Die |
Azione5.984 |
|
16Mb | 3 V ~ 3.6 V | - | Die | Die |
||
Xilinx Inc. |
IC PROM REPROGR 4MB 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione5.120 |
|
4Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC PROM SER C-TEMP 3.3V 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione41.712 |
|
4Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
RE-PROGRAMMABLE 4MB PROM
|
pacchetto: 44-TQFP |
Azione2.288 |
|
4Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM REPROGR 4MB 44-VQFP
|
pacchetto: 44-TQFP |
Azione3.616 |
|
4Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM SRL/PAR 1.8V 32M 48CSBGA
|
pacchetto: 48-TFBGA, CSPBGA |
Azione40.644 |
|
32Mb | 1.65 V ~ 2 V | -40°C ~ 85°C | 48-TFBGA, CSPBGA | 48-CSP (8x9) |
||
Xilinx Inc. |
IC PROM REPROGR 2MB 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione8.676 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 2M 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione112.068 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
XC18V02PCG44C0100
|
pacchetto: 44-LCC (J-Lead) |
Azione7.280 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC PROM REPROGR 2MB 44-VQFP
|
pacchetto: 44-TQFP |
Azione29.184 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM SRL FOR 2M GATE 44-VQFP
|
pacchetto: 44-TQFP |
Azione56.628 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 1M 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione4.256 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 1M 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione118.452 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 1M 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione99.660 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SRL 1.8V 16M 48CSBGA
|
pacchetto: 48-TFBGA, CSPBGA |
Azione7.944 |
|
16Mb | 1.65 V ~ 2 V | -40°C ~ 85°C | 48-TFBGA, CSPBGA | 48-CSP (8x9) |
||
Xilinx Inc. |
XC18V01VQG44C0100
|
pacchetto: 44-TQFP |
Azione2.304 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |