Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TE Connectivity Potter & Brumfield Relays |
CONN IC DIP SOCKET 32POS TINLEAD
|
pacchetto: - |
Azione3.600 |
|
32 (2 x 16) | 0.100" (2.54mm) | Tin-Lead | 80µin (2.03µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
||
TE Connectivity Potter & Brumfield Relays |
TRANSISTOR SKT
|
pacchetto: - |
Azione4.554 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity Potter & Brumfield Relays |
TRANSISTOR SKT
|
pacchetto: - |
Azione6.264 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |