Prodotti NXP

MRF5S9070MR1

NXP

FET RF 68V 880MHZ TO-270-2

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 17.8dB
• Voltage - Test: 26V
• Current Rating: -
• Noise Figure: -
• Current - Test: 600mA
• Power - Output: 14W
• Voltage - Rated: 68V
• Package / Case: TO-270-2
• Supplier Device Package: TO-270-2

pacchetto: TO-270-2

PMDPB56XN,115

NXP

MOSFET 2N-CH 30V 3.1A HUSON6

• FET Type: 2 N-Channel (Dual)
• FET Feature: Logic Level Gate
• Drain to Source Voltage (Vdss): 30V
• Current - Continuous Drain (Id) @ 25°C: 3.1A
• Rds On (Max) @ Id, Vgs: 73 mOhm @ 3.1A, 4.5V
• Vgs(th) (Max) @ Id: 1.5V @ 250µA
• Gate Charge (Qg) (Max) @ Vgs: 2.9nC @ 4.5V
• Input Capacitance (Ciss) (Max) @ Vds: 170pF @ 15V
• Power - Max: 510mW
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 6-UDFN Exposed Pad
• Supplier Device Package: DFN2020-6

pacchetto: 6-UDFN Exposed Pad

TEA1742T/N1,118

NXP

IC CTRLR GREENCHIP PFC 8-SOIC

• Mode: Continuous Conduction (CCM)
• Frequency - Switching: 125kHz
• Current - Startup: 60µA
• Voltage - Supply: 10.6 V ~ 38 V
• Operating Temperature: -20°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

pacchetto: 8-SOIC (0.154", 3.90mm Width)

MC34937APEK

NXP

IC MOTOR CTRLR SPI 54SOIC

• Motor Type - Stepper: -
• Motor Type - AC, DC: Brushless DC (BLDC)
• Function: Controller - Commutation, Direction Management
• Output Configuration: Pre-Driver - Half Bridge (3)
• Interface: SPI
• Technology: Power MOSFET
• Step Resolution: -
• Applications: General Purpose
• Current - Output: -
• Voltage - Supply: 6 V ~ 58 V
• Voltage - Load: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 54-SOICW-EP

pacchetto: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

74ABT2240PW,112

NXP

IC BUFF INVERT 5.5V 20TSSOP

• Logic Type: Buffer, Inverting
• Number of Elements: 2
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 12mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

pacchetto: 20-TSSOP (0.173", 4.40mm Width)

SC16C554BIB80,528

NXP

IC UART QUAD W/FIFO 80-LQFP

• Features: -
• Number of Channels: 4, QUART
• FIFO's: 16 Byte
• Protocol: -
• Data Rate (Max): 5Mbps
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (12x12)

pacchetto: 80-LQFP

M86295G12

NXP

IC C2K 900MHZ 16CH VOIP 625BGA

• Function: -
• Interface: -
• Number of Circuits: -
• Voltage - Supply: -
• Current - Supply: -
• Power (Watts): -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

PTN36241BBS,115

NXP

IC REDRIVER USB 3.0 1CH 24HVQFN

• Type: Buffer, ReDriver
• Applications: USB 3.0
• Input: -
• Output: -
• Data Rate (Max): 5Gbps
• Number of Channels: 2
• Delay Time: 1.0ns
• Signal Conditioning: Input Equalization, Output De-Emphasis
• Capacitance - Input: -
• Voltage - Supply: 3 V ~ 3.6 V
• Current - Supply: 100mA
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: -
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (4x4)

pacchetto: 24-VFQFN Exposed Pad

PCA9500PW,112

NXP

IC I/O EXPANDER I2C 8B 16TSSOP

• Number of I/O: 8
• Interface: I2C, SMBus
• Interrupt Output: No
• Features: EEPROM, POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 100µA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

pacchetto: 16-TSSOP (0.173", 4.40mm Width)

SC16IS750IBS,151

NXP

IC UART I2C/SPI 24-HVQFN

• Protocol: RS232, RS485
• Function: Controller
• Interface: I2C, SPI, UART
• Standards: -
• Voltage - Supply: 2.5V, 3.3V
• Current - Supply: 6mA
• Operating Temperature: -40°C ~ 95°C
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (4x4)

pacchetto: 24-VFQFN Exposed Pad

MC68306EH16B

NXP

IC MPU M683XX 16MHZ 132QFP

• Core Processor: EC000
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 16MHz
• Co-Processors/DSP: -
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 132-BQFP Bumpered
• Supplier Device Package: 132-PQFP (24.13x24.13)

pacchetto: 132-BQFP Bumpered

MPC862TVR100B

NXP

IC MPU MPC8XX 100MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 100MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (4), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

pacchetto: 357-BBGA

MCIMX6U5EVM10AC

NXP

IC MPU I.MX6DL 1.0GHZ 624MAPBGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (4)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -20°C ~ 105°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 624-LFBGA
• Supplier Device Package: 624-MAPBGA (21x21)

pacchetto: 624-LFBGA

MCF5271CVM150

NXP

IC MCU 32BIT ROMLESS 196MAPBGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
• Peripherals: DMA, WDT
• Number of I/O: 97
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.4 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 196-LBGA
• Supplier Device Package: 196-MAPBGA (15x15)

pacchetto: 196-LBGA

MK22FN1M0VLL12

NXP

IC MCU 32BIT 1MB FLASH 100LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 66
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 33x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

pacchetto: 100-LQFP

SPC5604PEF1MLL6

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CAN, FlexRay, LIN, SPI, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 68
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 40K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 30x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

pacchetto: 100-LQFP

MC9RS08KB8CSG

NXP

IC MCU 8BIT 8KB FLASH 16SOIC

• Core Processor: RS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 14
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 254 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SOIC

pacchetto: 16-SOIC (0.154", 3.90mm Width)

MK50DX128CLH7

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 22x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

pacchetto: 64-LQFP

LPC2292FET144/01,5

NXP

IC MCU 32BIT 256KB FLASH 144BGA

• Core Processor: ARM7?
• Core Size: 16/32-Bit
• Speed: 60MHz
• Connectivity: CAN, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 112
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-TFBGA
• Supplier Device Package: 144-TFBGA (12x12)

pacchetto: 144-TFBGA

MM912G634CV2AP

NXP

IC MCU 16BIT 48KB FLASH 48LQFP

• Applications: Automotive
• Core Processor: S12
• Program Memory Type: FLASH (48 kB)
• Controller Series: HCS12
• RAM Size: 2K x 8
• Interface: LIN, SCI
• Number of I/O: 9
• Voltage - Supply: 2.25 V ~ 5.25 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

pacchetto: 48-LQFP

MMA6821BKCWR2

NXP

ACCELEROMETER 10BIT SPI 16QFN

• Type: -
• Axis: -
• Acceleration Range: -
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: -
• Voltage - Supply: -
• Features: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

MMA5124NDIKGCWR2

NXP

ACCELEROMETER PSI5 16QFN

• Type: -
• Axis: -
• Acceleration Range: -
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: -
• Voltage - Supply: -
• Features: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

MFRC50001T/0FE,112

NXP

IC MIFARE READER 32SO

• Type: RFID Reader
• Frequency: 13.56MHz
• Standards: ISO 14443, MIFARE
• Interface: SPI
• Voltage - Supply: 5V
• Operating Temperature: -40°C ~ 150°C
• Package / Case: 32-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 32-SO

pacchetto: 32-SOIC (0.295", 7.50mm Width)

J3A081GX0/T1AG2384

NXP

IC RF MODULE PLLCC8

• Function: -
• Frequency: -
• RF Type: -
• Secondary Attributes: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

TWR-METRO-KIT-NA

NXP

KIT METRO AREA NETWORK DEV TOWER

• Type: Transceiver, 6LoWPAN
• Frequency: -
• For Use With/Related Products: Freescale Tower System
• Supplied Contents: 4 Boards

pacchetto: -

SPC5606BK0CLU4

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 149
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 80K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 29x10b, 5x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP
• Supplier Device Package: 176-LQFP (24x24)

pacchetto: 176-LQFP

MC9S08PB16VTG

NXP

IC MCU 8BIT 16KB FLASH 16TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, LINbus, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 14
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

pacchetto: -

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TDA20142-2

NXP

HIGH QUALITY INTEGRATED CIRCUIT

• Type: Tuner
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 28-VFQFN Exposed Pad
• Supplier Device Package: 28-HVQFN (5x5)

pacchetto: -

Request a Quote