Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
PROGRAMMABLE SOLENOID CONTROLLER
|
pacchetto: - |
Azione3.776 |
|
- | - | - | - | - | - |
||
NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
pacchetto: 48-LQFP Exposed Pad |
Azione7.664 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
FS6500
|
pacchetto: 48-LQFP Exposed Pad |
Azione3.104 |
|
- | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
FS4500
|
pacchetto: 48-LQFP Exposed Pad |
Azione7.376 |
|
- | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP DCDC 1.5A VCO
|
pacchetto: 48-LQFP Exposed Pad |
Azione5.904 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP DCDC 1.5A VCO
|
pacchetto: 48-LQFP Exposed Pad |
Azione6.752 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP LINEAR 0.5A V
|
pacchetto: 48-LQFP Exposed Pad |
Azione4.464 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP LINEAR 0.5A V
|
pacchetto: 48-LQFP Exposed Pad |
Azione2.208 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
pacchetto: 48-LQFP Exposed Pad |
Azione7.648 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
FS6500
|
pacchetto: 48-LQFP Exposed Pad |
Azione4.496 |
|
- | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
pacchetto: 48-LQFP Exposed Pad |
Azione6.848 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP DCDC 1.5A VCO
|
pacchetto: 48-LQFP Exposed Pad |
Azione7.568 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
FS6500
|
pacchetto: 48-LQFP Exposed Pad |
Azione5.888 |
|
- | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
FS6500
|
pacchetto: 48-LQFP Exposed Pad |
Azione7.536 |
|
- | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
FS6500
|
pacchetto: 48-LQFP Exposed Pad |
Azione2.100 |
|
- | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
pacchetto: 48-LQFP Exposed Pad |
Azione4.432 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
pacchetto: 48-LQFP Exposed Pad |
Azione5.712 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP DCDC 1.5A VCO
|
pacchetto: 48-LQFP Exposed Pad |
Azione5.552 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
FS4500
|
pacchetto: 48-LQFP Exposed Pad |
Azione6.288 |
|
- | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
FS6500
|
pacchetto: 48-LQFP Exposed Pad |
Azione4.224 |
|
- | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP LINEAR 0.5A V
|
pacchetto: 48-LQFP Exposed Pad |
Azione4.064 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP LINEAR 0.5A V
|
pacchetto: 48-LQFP Exposed Pad |
Azione5.280 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
pacchetto: 48-LQFP Exposed Pad |
Azione6.928 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
FS4500
|
pacchetto: 48-LQFP Exposed Pad |
Azione4.128 |
|
- | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
pacchetto: 48-LQFP Exposed Pad |
Azione2.640 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP LINEAR 0.5A V
|
pacchetto: 48-LQFP Exposed Pad |
Azione3.120 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
32BIT256K FLASHSTR CTM
|
pacchetto: - |
Azione5.168 |
|
- | - | - | - | - | - |
||
NXP |
FS6500
|
pacchetto: 48-LQFP Exposed Pad |
Azione4.320 |
|
- | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |