Pagina 24 - Prodotti NXP - PMIC - Gestione potenza - Specializzata

Numero di parte	Produttore	Descrizione	pacchetto	Azione	Current - Supply	Voltage - Supply	Operating Temperature	Mounting Type	Package / Case	Supplier Device Package
MC33FS4508NAE	NXP	SYSTEM BASIS CHIP, LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	pacchetto: -	Request a Quote	-	1V ~ 5V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC33FS4508CAE	NXP	SYSTEM BASIS CHIP, LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	pacchetto: -	Azione2.658	-	1V ~ 5V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MFS2613AMDA6ADR2	NXP	SAFETY SYSTEM BASIS CHIP WITH LO Applications: - Current - Supply: - Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	pacchetto: -	Request a Quote	-	3.2V ~ 40V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MC33FS6528CAER2	NXP	SYSTEM BASIS CHIP, DCDC 2.2A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	pacchetto: -	Request a Quote	-	1V ~ 5V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MFS8601BMBA0ESR2	NXP	SAFETY SYSTEM BASIS CHIP FOR DOM Applications: Camera Current - Supply: - Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	pacchetto: -	Request a Quote	-	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	48-VFQFN Exposed Pad	48-HVQFN (7x7)
MVR5510AMMANESR2	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: - Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	pacchetto: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33PF8200A0ESR2	NXP	POWER MANAGEMENT IC I.MX8 NON-PR Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	pacchetto: -	Request a Quote	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33FS6517NAER2	NXP	SYSTEM BASIS CHIP, DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	pacchetto: -	Request a Quote	-	1V ~ 5V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-HLQFP (7x7)
MC33FS8530A0KSR2	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	pacchetto: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33PF8200DMES	NXP	POWER MANAGEMENT IC I.MX8 PRE-PR Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	pacchetto: -	Request a Quote	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33PF8200DNES	NXP	POWER MANAGEMENT IC I.MX8 PRE-PR Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	pacchetto: -	Request a Quote	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33FS8510C4KSR2	NXP	FS8500 C0 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	pacchetto: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
TDA3681TH-N2S-S435	NXP	IC REG MULTIPLE VOLTAGE 20HSOP Applications: - Current - Supply: 110µA Voltage - Supply: 6.5V ~ 18V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Supplier Device Package: 20-HSOP	pacchetto: -	Request a Quote	110µA	6.5V ~ 18V	-40°C ~ 85°C (TA)	Surface Mount	20-SOIC (0.433", 11.00mm Width) Exposed Pad	20-HSOP
MPF5032BMDA0ESR2	NXP	PMIC 2 BUCKS 2 LDO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 3.3V ~ 5.25V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-PowerVFQFN Supplier Device Package: 40-HVQFN (6x6)	pacchetto: -	Request a Quote	-	3.3V ~ 5.25V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	40-PowerVFQFN	40-HVQFN (6x6)
MPF5020CMBA0ESR2	NXP	POWER MANAGEMENT IC, PRE-PROG, 3 Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	pacchetto: -	Request a Quote	-	-	-	Surface Mount, Wettable Flank	40-VFQFN Exposed Pad	40-HVQFN (6x6)
MFS8620BMBA0ESR2	NXP	SAFETY SYSTEM BASIS CHIP FOR DOM Applications: Camera Current - Supply: - Voltage - Supply: 36V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	pacchetto: -	Request a Quote	-	36V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	48-VFQFN Exposed Pad	48-HVQFN (7x7)
MC32PF8121A0EPR2	NXP	POWER MANAGEMENT IC I.MX8 NON-PR Applications: Industrial, IoT Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	pacchetto: -	Request a Quote	-	2.5V ~ 5.5V	-40°C ~ 85°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MFS2320BMBB1EP	NXP	IC Applications: System Basis Chip Current - Supply: 30µA Voltage - Supply: 5.5V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	pacchetto: -	Request a Quote	30µA	5.5V ~ 40V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	48-VFQFN Exposed Pad	48-HVQFN (7x7)
MC33FS8410G3KSR2	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	pacchetto: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33FS5502Y0KSR2	NXP	HIGH VOLTAGE POWER MANAGEMENT IC Applications: SMPS Start-Up Current - Supply: - Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	pacchetto: -	Request a Quote	-	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MFS2631AMDA0ADR2	NXP	AUTO SBC Applications: - Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	pacchetto: -	Request a Quote	30µA	3.2V ~ 40V	-40°C ~ 125°C (TA)	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MFS8633BMBA0ESR2	NXP	SAFETY SYSTEM BASIS CHIP FOR DOM Applications: Camera Current - Supply: - Voltage - Supply: 36V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	pacchetto: -	Request a Quote	-	36V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	48-VFQFN Exposed Pad	48-HVQFN (7x7)
MC33PF8200ESESR2	NXP	POWER MANAGEMENT IC I.MX8 PRE-PR Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	pacchetto: -	Request a Quote	-	2.5V ~ 5.5V	-40°C ~ 105°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33FS8510A0ES	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	pacchetto: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MFS8412AMBP7ESR2	NXP	SAFETY POWER MANAGEMENT IC, QFN4 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	pacchetto: -	Request a Quote	15mA	60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	48-VFQFN Exposed Pad	48-HVQFN (7x7)
MWCT2013AVLH	NXP	NEVIS3A_WCT,64LQFP Applications: Wireless Power Transmitter Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	pacchetto: -	Request a Quote	-	-	-	Surface Mount	64-LQFP	64-LQFP (10x10)
MVR5510AMDA0ESR2	NXP	IC PMIC VR5510 ASIL-D Applications: - Current - Supply: 15mA Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	pacchetto: -	Request a Quote	15mA	2.7V ~ 60V	-40°C ~ 125°C (TA)	Surface Mount, Wettable Flank	56-VFQFN Exposed Pad	56-HVQFN (8x8)
MC33FS8510A3ES	NXP	SYSTEM BASIS CHIP FS8510 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	pacchetto: -	Request a Quote	-	-	-	-	-	-

MC33FS4508NAE

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

pacchetto: -

Request a Quote

-

1V ~ 5V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MC33FS4508CAE

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

pacchetto: -

Azione2.658

-

1V ~ 5V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MFS2613AMDA6ADR2

NXP

SAFETY SYSTEM BASIS CHIP WITH LO

Applications: -
Current - Supply: -
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

pacchetto: -

Request a Quote

-

3.2V ~ 40V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-LQFP-EP (7x7)

MC33FS6528CAER2

NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

pacchetto: -

Request a Quote

-

1V ~ 5V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MFS8601BMBA0ESR2

NXP

SAFETY SYSTEM BASIS CHIP FOR DOM

Applications: Camera
Current - Supply: -
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

pacchetto: -

Request a Quote

-

60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

48-VFQFN Exposed Pad

48-HVQFN (7x7)

MVR5510AMMANESR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: -
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

pacchetto: -

Request a Quote

15mA

60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33PF8200A0ESR2

NXP

POWER MANAGEMENT IC I.MX8 NON-PR

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

pacchetto: -

Request a Quote

-

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33FS6517NAER2

NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

pacchetto: -

Request a Quote

-

1V ~ 5V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-HLQFP (7x7)

MC33FS8530A0KSR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

pacchetto: -

Request a Quote

15mA

60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33PF8200DMES

NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

pacchetto: -

Request a Quote

-

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33PF8200DNES

NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

pacchetto: -

Request a Quote

-

2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33FS8510C4KSR2

NXP

FS8500 C0

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

pacchetto: -

Request a Quote

15mA

60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

TDA3681TH-N2S-S435

NXP

IC REG MULTIPLE VOLTAGE 20HSOP

Applications: -
Current - Supply: 110µA
Voltage - Supply: 6.5V ~ 18V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Supplier Device Package: 20-HSOP

pacchetto: -

Request a Quote

110µA

6.5V ~ 18V

-40°C ~ 85°C (TA)

Surface Mount

20-SOIC (0.433", 11.00mm Width) Exposed Pad

20-HSOP

MPF5032BMDA0ESR2

NXP

PMIC 2 BUCKS 2 LDO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 3.3V ~ 5.25V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-PowerVFQFN
Supplier Device Package: 40-HVQFN (6x6)

pacchetto: -

Request a Quote

-

3.3V ~ 5.25V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

40-PowerVFQFN

40-HVQFN (6x6)

MPF5020CMBA0ESR2

NXP

POWER MANAGEMENT IC, PRE-PROG, 3

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)

pacchetto: -

Request a Quote

-

Surface Mount, Wettable Flank

40-VFQFN Exposed Pad

40-HVQFN (6x6)

MFS8620BMBA0ESR2

NXP

SAFETY SYSTEM BASIS CHIP FOR DOM

Applications: Camera
Current - Supply: -
Voltage - Supply: 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

pacchetto: -

Request a Quote

-

36V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

48-VFQFN Exposed Pad

48-HVQFN (7x7)

MC32PF8121A0EPR2

NXP

POWER MANAGEMENT IC I.MX8 NON-PR

Applications: Industrial, IoT
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

pacchetto: -

Request a Quote

-

2.5V ~ 5.5V

-40°C ~ 85°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MFS2320BMBB1EP

NXP

IC

Applications: System Basis Chip
Current - Supply: 30µA
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

pacchetto: -

Request a Quote

30µA

5.5V ~ 40V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

48-VFQFN Exposed Pad

48-HVQFN (7x7)

MC33FS8410G3KSR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

pacchetto: -

Request a Quote

15mA

60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33FS5502Y0KSR2

NXP

HIGH VOLTAGE POWER MANAGEMENT IC

Applications: SMPS Start-Up
Current - Supply: -
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

pacchetto: -

Request a Quote

-

60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MFS2631AMDA0ADR2

NXP

AUTO SBC

Applications: -
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

pacchetto: -

Request a Quote

30µA

3.2V ~ 40V

-40°C ~ 125°C (TA)

Surface Mount

48-LQFP Exposed Pad

48-LQFP-EP (7x7)

MFS8633BMBA0ESR2

NXP

SAFETY SYSTEM BASIS CHIP FOR DOM

Applications: Camera
Current - Supply: -
Voltage - Supply: 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

pacchetto: -

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36V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

48-VFQFN Exposed Pad

48-HVQFN (7x7)

MC33PF8200ESESR2

NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

pacchetto: -

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2.5V ~ 5.5V

-40°C ~ 105°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33FS8510A0ES

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

pacchetto: -

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15mA

60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MFS8412AMBP7ESR2

NXP

SAFETY POWER MANAGEMENT IC, QFN4

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

pacchetto: -

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15mA

60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

48-VFQFN Exposed Pad

48-HVQFN (7x7)

MWCT2013AVLH

NXP

NEVIS3A_WCT,64LQFP

Applications: Wireless Power Transmitter
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

pacchetto: -

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Surface Mount

64-LQFP

64-LQFP (10x10)

MVR5510AMDA0ESR2

NXP

IC PMIC VR5510 ASIL-D

Applications: -
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

pacchetto: -

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15mA

2.7V ~ 60V

-40°C ~ 125°C (TA)

Surface Mount, Wettable Flank

56-VFQFN Exposed Pad

56-HVQFN (8x8)

MC33FS8510A3ES

NXP

SYSTEM BASIS CHIP FS8510

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

pacchetto: -

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