Pagina 19 - Prodotti NXP - PMIC - Gestione potenza - Specializzata | Heisener Electronics
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Prodotti NXP - PMIC - Gestione potenza - Specializzata

Record 1.370
Pagina  19/49
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
Current - Supply
Voltage - Supply
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
MC33FS4507KAER2
NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
pacchetto: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC33FS8430G1KS
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: System Basis Chip
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
pacchetto: -
Request a Quote
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33FS8430G1ES
NXP

SYSTEM BASIS CHIP FS8430

  • Applications: System Basis Chip
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
pacchetto: -
Azione399
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33FS8430G0KS
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: System Basis Chip
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
pacchetto: -
Request a Quote
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33FS6527NAER2
NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
pacchetto: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC33FS6525CAE
NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
pacchetto: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC33FS8510D3KSR2
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: System Basis Chip
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
pacchetto: -
Request a Quote
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MVR5510AMBAHESR2
NXP

IC PMIC VR5510 ASIL-B

  • Applications: -
  • Current - Supply: 15mA
  • Voltage - Supply: 2.7V ~ 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
pacchetto: -
Request a Quote
15mA
2.7V ~ 60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33FS8430G1KSR2
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: System Basis Chip
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
pacchetto: -
Request a Quote
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33FS6525KAE
NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
pacchetto: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC33FS6525LAE
NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
pacchetto: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC33FS6525NAE
NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
pacchetto: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MFS2613AMDA2ADR2
NXP

SAFETY SYSTEM BASIS CHIP WITH LO

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
pacchetto: -
Request a Quote
-
3.2V ~ 40V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MFS2620AMBA0ADR2
NXP

AUTO SBC

  • Applications: -
  • Current - Supply: 30µA
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
pacchetto: -
Request a Quote
30µA
3.2V ~ 40V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MPF7100BVMA1ESR2
NXP

POWER MANAGEMENT IC, I.MX 8XL WI

  • Applications: i.MX Processors
  • Current - Supply: 10µA
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-HVQFN (7x7)
pacchetto: -
Request a Quote
10µA
2.5V ~ 5.5V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
48-VFQFN Exposed Pad
48-HVQFN (7x7)
MFS2601AMBA0ADR2
NXP

AUTO SBC

  • Applications: -
  • Current - Supply: 30µA
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
pacchetto: -
Request a Quote
30µA
3.2V ~ 40V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MC33FS6528NAE
NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
pacchetto: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC33FS4505NAER2
NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
pacchetto: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC33FS6600M0KSR2
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: 2.7V ~ 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
pacchetto: -
Request a Quote
-
2.7V ~ 60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
PCA9450CHNY
NXP

PMIC I.MX 8M MINI/NANO/PLUS HVQF

  • Applications: General Purpose
  • Current - Supply: 20µA
  • Voltage - Supply: 2.85V ~ 5.5V
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (7x7)
pacchetto: -
Azione56.619
20µA
2.85V ~ 5.5V
-40°C ~ 105°C
Surface Mount
56-VFQFN Exposed Pad
56-HVQFN (7x7)
MVR5510AMDANESR2
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: -
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
pacchetto: -
Request a Quote
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MFS2633AMBA0ADR2
NXP

SAFETY SYSTEM BASIS CHIP WITH LO

  • Applications: -
  • Current - Supply: 29µA
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
pacchetto: -
Request a Quote
29µA
3.2V ~ 40V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
PCA9450BHNY
NXP

PMIC I.MX 8M MINI/NANO/PLUS HVQF

  • Applications: General Purpose
  • Current - Supply: 20µA
  • Voltage - Supply: 2.85V ~ 5.5V
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (7x7)
pacchetto: -
Azione33.873
20µA
2.85V ~ 5.5V
-40°C ~ 105°C
Surface Mount
56-VFQFN Exposed Pad
56-HVQFN (7x7)
MC33FS6528CAE
NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
pacchetto: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC33FS6527KAE
NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
pacchetto: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC33FS8400G0ES
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: System Basis Chip
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
pacchetto: -
Request a Quote
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33FS6527LAE
NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
pacchetto: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC33FS8400G0KS
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: System Basis Chip
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
pacchetto: -
Request a Quote
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)