Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Core Processor | Program Memory Type | Controller Series | RAM Size | Interface | Number of I/O | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MCU 48KB LS/HS SWITCH 48LQFP
|
pacchetto: 48-LQFP Exposed Pad |
Azione6.432 |
|
S12 | FLASH (48 kB) | HCS12 | 2K x 8 | LIN, SCI | 9 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
IC STEPPER MOTOR DRVR 54SOIC
|
pacchetto: 54-SSOP (0.295", 7.50mm Width) Exposed Pad |
Azione168.696 |
|
HC08 | FLASH (16 kB) | 908E | 512 x 8 | SCI, SPI | 13 | 8 V ~ 18 V | -40°C ~ 115°C | Surface Mount | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | 54-SOIC |
||
NXP |
IC QUAD HALF-BRIDGE 54SOIC
|
pacchetto: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad |
Azione7.424 |
|
HC08 | FLASH (16 kB) | 908E | 512 x 8 | SCI, SPI | 13 | 8 V ~ 18 V | -40°C ~ 85°C | Surface Mount | 54-BSSOP (0.295", 7.50mm Width) Exposed Pad | 54-SOICW-EP |
||
NXP |
IC QUAD HALF BRDG TRPL SW 54SOIC
|
pacchetto: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad |
Azione7.616 |
|
HC08 | FLASH (16 kB) | 908E | 512 x 8 | SCI, SPI | 12 | 9 V ~ 16 V | -40°C ~ 85°C | Surface Mount | 54-BSSOP (0.295", 7.50mm Width) Exposed Pad | 54-SOICW-EP |
||
NXP |
IC DRVR INJECTOR/IGN 100LQFP
|
pacchetto: 100-LQFP Exposed Pad |
Azione4.688 |
|
S12XS | FLASH (128 kB) | HCS12 | 8K x 8 | CAN, SCI, SPI | 6 | 4.7 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 100-LQFP Exposed Pad | 100-LQFP-EP (14x14) |
||
NXP |
IC MCU 48KB LS/HS SWITCH 48LQFP
|
pacchetto: 48-LQFP Exposed Pad |
Azione6.704 |
|
S12 | FLASH (48 kB) | HCS12 | 2K x 8 | LIN, SCI | 9 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
IC MCU LIN BATT MONITOR 48QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione5.984 |
|
S12 | FLASH (96 KB) | HCS12 | 6K x 8 | LIN, SCI, SPI | 8 | 2.25 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN-EP (7x7) |
||
NXP |
IC MCU LIN BATT MONITOR 48QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione2.976 |
|
S12 | FLASH (96 KB) | HCS12 | 6K x 8 | LIN, SCI, SPI | 8 | 2.25 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN-EP (7x7) |
||
NXP |
IC MCU 48KB LS/HS SWITCH 48LQFP
|
pacchetto: 48-LQFP |
Azione7.632 |
|
S12 | FLASH (48 kB) | HCS12 | 2K x 8 | LIN, SCI | 9 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
NXP |
IC MCU 16BIT HCS12 100LQFP
|
pacchetto: 100-LQFP Exposed Pad |
Azione4.272 |
|
S12XS | FLASH (256 kB) | HCS12 | 12K x 8 | CAN, SCI, SPI | 6 | 4.7 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 100-LQFP Exposed Pad | 100-LQFP-EP (14x14) |
||
NXP |
IC MCU 48KB LS/HS SWITCH 48LQFP
|
pacchetto: 48-LQFP |
Azione143.916 |
|
S12 | FLASH (48 kB) | HCS12 | 2K x 8 | LIN, SCI | 9 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
NXP |
IC SW TRPL HISIDE MCU/LIN 54SOIC
|
pacchetto: 54-BSSOP (0.295", 7.50mm Width) |
Azione5.088 |
|
HC08 | FLASH (16 kB) | 908E | 512 x 8 | SCI, SPI | 16 | 5.5 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 54-BSSOP (0.295", 7.50mm Width) | 54-SOIC |
||
NXP |
IC MCU LIN BATT MONITOR 48QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione6.160 |
|
S12 | FLASH (96 KB) | HCS12 | 6K x 8 | LIN, SCI, SPI | 8 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN-EP (7x7) |
||
NXP |
IC MCU LIN BATT MONITOR 48QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione7.344 |
|
S12 | FLASH (96 KB) | HCS12 | 6K x 8 | LIN, SCI, SPI | 8 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN-EP (7x7) |
||
NXP |
IC DRVR INJECTOR/IGN 100LQFP
|
pacchetto: 100-LQFP Exposed Pad |
Azione6.016 |
|
S12P | FLASH (128 kB) | HCS12 | 6K x 8 | CAN, SCI, SPI | 8 | 4.7 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 100-LQFP Exposed Pad | 100-LQFP-EP (14x14) |
||
NXP |
IC QUAD HALF BRDG TRPL SW 54SOIC
|
pacchetto: 54-SSOP (0.295", 7.50mm Width) Exposed Pad |
Azione3.504 |
|
HC08 | FLASH (16 kB) | 908E | 512 x 8 | SCI, SPI | 12 | 9 V ~ 16 V | -40°C ~ 85°C | Surface Mount | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | 54-SOIC W EP |
||
NXP |
IC STEPPER MOTOR DRVR 54SOIC
|
pacchetto: 54-SOIC (0.295", 7.50mm Width) Exposed Pad |
Azione4.528 |
|
HC08 | FLASH (16 kB) | 908E | 512 x 8 | SCI, SPI | 13 | 8 V ~ 18 V | -40°C ~ 115°C | Surface Mount | 54-SOIC (0.295", 7.50mm Width) Exposed Pad | 54-SOIC W EP |
||
NXP |
IC QUAD HALF-BRIDGE 54SOIC
|
pacchetto: 54-SOIC (0.295", 7.50mm Width) Exposed Pad |
Azione4.448 |
|
HC08 | FLASH (16 kB) | 908E | 512 x 8 | SCI, SPI | 13 | 8 V ~ 18 V | -40°C ~ 85°C | Surface Mount | 54-SOIC (0.295", 7.50mm Width) Exposed Pad | 54-SOIC |
||
NXP |
IC MCU LIN BATT MONITOR 48QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione15.612 |
|
S12 | FLASH (128 kB) | HCS12 | 6K x 8 | LIN, SCI, SPI | 8 | 2.25 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN-EP (7x7) |
||
NXP |
IC MCU LIN BATT MONITOR 48QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione6.832 |
|
S12 | FLASH (128 kB) | HCS12 | 6K x 8 | LIN, SCI, SPI | 8 | 2.25 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN-EP (7x7) |
||
NXP |
IC SW TRPL HISIDE MCU/LIN 54SOIC
|
pacchetto: 54-BSSOP (0.295", 7.50mm Width) |
Azione39.996 |
|
HC08 | FLASH (16 kB) | 908E | 512 x 8 | SCI, SPI | 16 | 5.5 V ~ 18 V | -40°C ~ 85°C | Surface Mount | 54-BSSOP (0.295", 7.50mm Width) | 54-SOIC |
||
NXP |
IC MCU 48KB LS/HS SWITCH 48LQFP
|
pacchetto: 48-LQFP Exposed Pad |
Azione5.024 |
|
S12 | FLASH (48 kB) | HCS12 | 2K x 8 | LIN, SCI | 9 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
IC MCU LIN BATT MONITOR 48QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione3.936 |
|
S12 | FLASH (128 kB) | HCS12 | 6K x 8 | LIN, SCI, SPI | 8 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN-EP (7x7) |
||
NXP |
IC MCU LIN BATT MONITOR 48QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione2.096 |
|
S12 | FLASH (128 kB) | HCS12 | 6K x 8 | LIN, SCI, SPI | 8 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN-EP (7x7) |
||
NXP |
IC DRVR INJECTOR/IGN 100LQFP
|
pacchetto: 100-LQFP Exposed Pad |
Azione7.856 |
|
S12XS | FLASH (128 kB) | HCS12 | 8K x 8 | CAN, SCI, SPI | 6 | 4.7 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 100-LQFP Exposed Pad | 100-LQFP-EP (14x14) |
||
NXP |
IC MCU 48KB LS/HS SWITCH 48LQFP
|
pacchetto: 48-LQFP |
Azione5.264 |
|
S12 | FLASH (48 kB) | HCS12 | 2K x 8 | LIN, SCI | 9 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
NXP |
IC SW TRPL HISIDE MCU/LIN 54SOIC
|
pacchetto: 54-BSSOP (0.295", 7.50mm Width) |
Azione6.672 |
|
HC08 | FLASH (16 kB) | 908E | 512 x 8 | SCI, SPI | 16 | 5.5 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 54-BSSOP (0.295", 7.50mm Width) | 54-SOIC |
||
NXP |
IC DRVR INJECTOR/IGN 100LQFP
|
pacchetto: 100-LQFP Exposed Pad |
Azione3.584 |
|
S12P | FLASH (128 kB) | HCS12 | 6K x 8 | CAN, SCI, SPI | 8 | 4.7 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 100-LQFP Exposed Pad | 100-LQFP-EP (14x14) |