Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Core Processor | Program Memory Type | Controller Series | RAM Size | Interface | Number of I/O | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC DRVR INJECTOR/IGN 100LQFP
|
pacchetto: 100-LQFP Exposed Pad |
Azione2.688 |
|
S12P | FLASH (96 KB) | HCS12 | 6K x 8 | CAN, SCI, SPI | 8 | 4.7 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 100-LQFP Exposed Pad | 100-LQFP-EP (14x14) |
||
NXP |
IC DRVR INJECTOR/IGN 100LQFP
|
pacchetto: 100-LQFP Exposed Pad |
Azione7.600 |
|
S12P | FLASH (96 KB) | HCS12 | 6K x 8 | CAN, SCI, SPI | 8 | 4.7 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 100-LQFP Exposed Pad | 100-LQFP-EP (14x14) |
||
NXP |
IC SW TRPL HISIDE MCU/LIN 54SOIC
|
pacchetto: 54-BSSOP (0.295", 7.50mm Width) |
Azione3.264 |
|
HC08 | FLASH (16 kB) | 908E | 512 x 8 | SCI, SPI | 16 | 5.5 V ~ 18 V | -40°C ~ 85°C | Surface Mount | 54-BSSOP (0.295", 7.50mm Width) | 54-SOIC |
||
NXP |
IC MCU 64KB LS/HS SWITCH 48LQFP
|
pacchetto: 48-LQFP Exposed Pad |
Azione4.240 |
|
S12 | FLASH (64 kB) | HCS12 | 6K x 8 | LIN, SCI | 9 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
IC MCU DUAL LS/HS SWITCH 48LQFP
|
pacchetto: 48-LQFP Exposed Pad |
Azione4.320 |
|
S12 | FLASH (32 KB) | HCS12 | 2K x 8 | LIN, SCI | 9 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
IC MCU DUAL LS/HS SWITCH 48LQFP
|
pacchetto: 48-LQFP Exposed Pad |
Azione6.864 |
|
S12 | FLASH (32 KB) | HCS12 | 2K x 8 | LIN, SCI | 9 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
IC MCU DUAL LS/HS SWITCH 48LQFP
|
pacchetto: 48-LQFP |
Azione3.568 |
|
S12 | FLASH (32 KB) | HCS12 | 2K x 8 | LIN, SCI | 9 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
NXP |
IC MCU DUAL LS/HS SWITCH 48LQFP
|
pacchetto: 48-LQFP |
Azione301.044 |
|
S12 | FLASH (32 KB) | HCS12 | 2K x 8 | LIN, SCI | 9 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
NXP |
IC MCU 64KB LS/HS SWITCH 48LQFP
|
pacchetto: 48-LQFP Exposed Pad |
Azione2.784 |
|
S12 | FLASH (64 kB) | HCS12 | 6K x 8 | LIN, SCI | 9 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
IC MCU 64KB LS/HS SWITCH 48LQFP
|
pacchetto: 48-LQFP Exposed Pad |
Azione38.880 |
|
S12 | FLASH (64 kB) | HCS12 | 6K x 8 | LIN, SCI | 9 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
IC MCU 48KB LS/HS SWITCH 48LQFP
|
pacchetto: 48-LQFP Exposed Pad |
Azione5.600 |
|
S12 | FLASH (48 kB) | HCS12 | 2K x 8 | LIN, SCI | 9 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
IC MCU 64KB LS/HS SWITCH 48LQFP
|
pacchetto: 48-LQFP Exposed Pad |
Azione7.872 |
|
S12 | FLASH (64 kB) | HCS12 | 6K x 8 | LIN, SCI | 9 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
MCU SECURE ID
|
pacchetto: - |
Azione5.216 |
|
MX51 | EEPROM (76.4 kB) | A700x | 3.2kB | I2C, 2-Wire Serial | - | 1.62 V ~ 5.5 V | -40°C ~ 90°C | - | - | - |
||
NXP |
IC MCU 48KB LS/HS SWITCH 48LQFP
|
pacchetto: 48-LQFP Exposed Pad |
Azione6.608 |
|
S12 | FLASH (48 kB) | HCS12 | 2K x 8 | LIN, SCI | 9 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
MCU SECURE ID
|
pacchetto: - |
Azione2.224 |
|
MX51 | EEPROM (76.4 kB) | A700x | 3.2kB | I2C, 2-Wire Serial | - | 1.62 V ~ 5.5 V | -25°C ~ 85°C | - | - | - |
||
NXP |
IC MCU DUAL LS/HS SWITCH 48LQFP
|
pacchetto: 48-LQFP Exposed Pad |
Azione6.304 |
|
S12 | FLASH (32 KB) | HCS12 | 2K x 8 | LIN, SCI | 9 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
IC MCU DUAL LS/HS SWITCH 48LQFP
|
pacchetto: 48-LQFP Exposed Pad |
Azione10.200 |
|
S12 | FLASH (32 KB) | HCS12 | 2K x 8 | LIN, SCI | 9 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
IC MCU 16BIT HCS12 100LQFP
|
pacchetto: 100-LQFP Exposed Pad |
Azione5.392 |
|
S12XS | FLASH (256 kB) | HCS12 | 12K x 8 | CAN, SCI, SPI | 6 | 4.7 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 100-LQFP Exposed Pad | 100-LQFP-EP (14x14) |
||
NXP |
IC VIDEO PROCESSOR ADV 484TFBGA
|
pacchetto: 484-TFBGA |
Azione5.472 |
|
ARM9? | - | - | - | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | - | - | - | Surface Mount | 484-TFBGA | 484-TFBGA (15x15) |
||
NXP |
1MB SRAM, 1.3MB FLASH, C
|
pacchetto: 257-LFBGA |
Azione5.760 |
|
e200z7 | FLASH (1.3 MB) | - | 1M x 8 | CAN, I²C, LINFlexD, SPI | - | 1.19 V ~ 1.31 V | -40°C ~ 125°C (TA) | Surface Mount | 257-LFBGA | 257-MAPBGA (14x14) |
||
NXP |
AU10TICS
|
pacchetto: - |
Azione5.520 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
NXP |
AU10TICS
|
pacchetto: - |
Azione2.320 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
NXP |
SECURE AUTHENTICATION MICROCONTR
|
pacchetto: - |
Azione3.536 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
NXP |
IC MCU 48KB LS/HS SWITCH 48LQFP
|
pacchetto: 48-LQFP Exposed Pad |
Azione3.888 |
|
S12 | FLASH (48 kB) | HCS12 | 2K x 8 | LIN, SCI | 9 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
IC MCU 48KB LS/HS SWITCH 48LQFP
|
pacchetto: 48-LQFP |
Azione2.768 |
|
S12 | FLASH (48 kB) | HCS12 | 2K x 8 | LIN, SCI | 9 | 2.25 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
NXP |
SECURE AUTHENTICATION MICROCONTR
|
pacchetto: - |
Azione4.464 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
NXP |
SECURE AUTHENTICATION MICROCONTR
|
pacchetto: - |
Azione3.888 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
NXP |
SECURE AUTHENTICATION MICROCONTR
|
pacchetto: - |
Azione5.072 |
|
- | - | - | - | - | - | - | - | - | - | - |