Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
FET Type | Ratio - Input:Output | Internal Switch(s) | Delay Time - ON | Delay Time - OFF | Current - Output (Max) | Current - Supply | Voltage - Supply | Applications | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC SMART SW ORING 3A 2CH 12TQFN
|
pacchetto: 12-UFQFN Exposed Pad |
Azione6.656 |
|
- | 2:1 | Yes | - | - | 3A | 11µA | 2.8 V ~ 5.5 V | - | -40°C ~ 125°C | Surface Mount | 12-UFQFN Exposed Pad | 12-FTQFN (2x2) |
||
Microchip Technology |
IC SMART SW ORING 3A 2CH 12TQFN
|
pacchetto: - |
Azione7.744 |
|
- | 2:1 | Yes | - | - | 3A | 11µA | 2.8 V ~ 5.5 V | - | -40°C ~ 125°C | - | - | - |
||
Microchip Technology |
POE PD MODULE
|
pacchetto: - |
Request a Quote |
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