Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 1KBIT 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.888 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 1MHz | 5ms | 4.5µs | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 16KBIT 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione7.520 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 1MHz | 5ms | 450ns | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 1MHZ SOT23-5
|
pacchetto: SOT-23-5 Thin, TSOT-23-5 |
Azione7.744 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 1MHz | 5ms | 450ns | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | SOT-23-5 |
||
Microchip Technology |
IC EEPROM 16KBIT 1MHZ 8MINIMAP
|
pacchetto: 8-UFDFN Exposed Pad |
Azione5.888 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 1MHz | 5ms | 450ns | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 2KBIT 1MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione2.336 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 1MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC FLASH 64MBIT 80MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione4.128 |
|
FLASH | FLASH | 64Mb (8M x 8) | SPI - Dual I/O | 80MHz | 2.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC FLASH 32MBIT 66MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione3.232 |
|
FLASH | FLASH | 32Mb (4M x 8) | SPI | 66MHz | 10µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 64MBIT 80MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione5.136 |
|
FLASH | FLASH | 64Mb (8M x 8) | SPI - Dual I/O | 80MHz | 2.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 16MBIT 75MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione50.604 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI | 80MHz | 10µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 32MBIT 80MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione7.312 |
|
FLASH | FLASH | 32Mb (4M x 8) | SPI | 80MHz | 10µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 16MBIT 104MHZ 8CSP
|
pacchetto: 8-UFBGA, CSPBGA |
Azione7.456 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFBGA, CSPBGA | 8-CSP |
||
Microchip Technology |
IC FLASH 16MBIT 104MHZ 8CSP
|
pacchetto: 8-UFBGA, CSPBGA |
Azione4.352 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFBGA, CSPBGA | 8-CSP |
||
Microchip Technology |
IC FLASH 64MBIT 104MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione3.760 |
|
FLASH | FLASH | 64Mb (8M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC FLASH 64MBIT 104MHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione2.720 |
|
FLASH | FLASH | 64Mb (8M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC FLASH 64MBIT 104MHZ 8WDFN
|
pacchetto: 8-WDFN Exposed Pad |
Azione5.456 |
|
FLASH | FLASH | 64Mb (8M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (5x6) |
||
Microchip Technology |
IC FLASH 16MBIT 104MHZ 8USON
|
pacchetto: - |
Azione3.472 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | - | 8-USON (4x3) |
||
Microchip Technology |
IC FLASH 16MBIT 104MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.960 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 16MBIT 104MHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione3.904 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC FLASH 16MBIT 104MHZ 8WDFN
|
pacchetto: 8-WDFN Exposed Pad |
Azione5.936 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (5x6) |
||
Microchip Technology |
IC FLASH 16MBIT 104MHZ 8USON
|
pacchetto: - |
Azione7.008 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | 8-USON (4x3) |
||
Microchip Technology |
IC FLASH 64MBIT 104MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione4.544 |
|
FLASH | FLASH | 64Mb (8M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC FLASH 64MBIT 104MHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione4.544 |
|
FLASH | FLASH | 64Mb (8M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC FLASH 64MBIT 104MHZ 8WDFN
|
pacchetto: 8-WDFN Exposed Pad |
Azione4.912 |
|
FLASH | FLASH | 64Mb (8M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (5x6) |
||
Microchip Technology |
IC FLASH 16MBIT 104MHZ 8USON
|
pacchetto: - |
Azione7.008 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | - | 8-USON (4x3) |
||
Microchip Technology |
IC FLASH 16MBIT 104MHZ 8USON
|
pacchetto: - |
Azione3.856 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | - | 8-USON (4x3) |
||
Microchip Technology |
IC FLASH 16MBIT 104MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.896 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 16MBIT 104MHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione4.336 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC FLASH 16MBIT 104MHZ 8WDFN
|
pacchetto: 8-WDFN Exposed Pad |
Azione6.272 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (5x6) |