Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 16KBIT 400KHZ 5CSP
|
pacchetto: 5-UFBGA, CSPBGA |
Azione7.632 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 5-UFBGA, CSPBGA | 5-CSP |
||
Microchip Technology |
IC EEPROM 16KBIT 100KHZ 4CSP
|
pacchetto: 4-UFBGA, CSPBGA |
Azione5.568 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Single Wire | 100kHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 4-UFBGA, CSPBGA | 4-CSP |
||
Microchip Technology |
IC EEPROM 2KBIT 100KHZ 4CSP
|
pacchetto: 4-UFBGA, CSPBGA |
Azione3.264 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | Single Wire | 100kHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 4-UFBGA, CSPBGA | 4-CSP |
||
Microchip Technology |
IC FLASH 64MBIT 80MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione6.912 |
|
FLASH | FLASH | 64Mb (8M x 8) | SPI - Dual I/O | 80MHz | 2.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
||
Microchip Technology |
IC EEPROM 1MBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.296 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 1MBIT 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione2.560 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | I2C | 1MHz | 5ms | 400ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 1MBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.768 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 1MBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.584 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 1MBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione3.104 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 1MBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.560 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 1MBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.976 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 1MBIT 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione3.664 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | I2C | 1MHz | 5ms | 400ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 32KBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.008 |
|
EEPROM | EEPROM | 32Kb (2K x 16) | I2C | 1MHz | 9ms | 550ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 32KBIT 1MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione5.232 |
|
EEPROM | EEPROM | 32Kb (2K x 16) | I2C | 1MHz | 9ms | 550ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 32KBIT 10MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione7.856 |
|
EEPROM | EEPROM | 32Kb (2K x 16) | SPI | 10MHz | 9ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 64KBIT 2MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.720 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 2MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 8MBIT 80MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.328 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI | 80MHz | 10µs | - | 2.3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 8MBIT 80MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.128 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI | 80MHz | 10µs | - | 2.3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 8MBIT 80MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione5.248 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI | 80MHz | 10µs | - | 2.3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 8MBIT 80MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione5.760 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI | 80MHz | 10µs | - | 2.3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 8MBIT 80MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione5.792 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI | 80MHz | 10µs | - | 2.3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Microchip Technology |
IC FLASH 8MBIT 80MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione2.000 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI | 80MHz | 10µs | - | 2.3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Microchip Technology |
IC FLASH 4MBIT 80MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.952 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 80MHz | 10µs | - | 2.3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 4MBIT 80MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.816 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 80MHz | 10µs | - | 2.3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 4MBIT 80MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione3.136 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 80MHz | 10µs | - | 2.3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 4MBIT 80MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione5.920 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 80MHz | 10µs | - | 2.3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 4MBIT 80MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione3.360 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 80MHz | 10µs | - | 2.3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Microchip Technology |
IC FLASH 4MBIT 80MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione5.824 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 80MHz | 10µs | - | 2.3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |