Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 512KBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.792 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 1MHz | 5ms | 550ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 32KBIT 1MHZ 8MINIMAP
|
pacchetto: 8-UFDFN Exposed Pad |
Azione6.288 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-Mini Map (2x3) |
||
Microchip Technology |
IC EEPROM 128KBIT 1MHZ 8MINIMAP
|
pacchetto: 8-UFDFN Exposed Pad |
Azione37.740 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-Mini Map (2x3) |
||
Microchip Technology |
IC FLASH 1MBIT 50MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.384 |
|
FLASH | FLASH | 1Mb (128K x 8) | SPI | 50MHz | 50µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 1MBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione234.540 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | I2C | 1MHz | 5ms | 550ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 8MBIT 50MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione18.060 |
|
FLASH | FLASH | 8Mb (264 Bytes x 4096 pages) | SPI | 50MHz | 4ms | - | 2.5 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 8MBIT 66MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione1.137.312 |
|
FLASH | FLASH | 8Mb (264 Bytes x 4096 pages) | SPI | 66MHz | 4ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 8MBIT 50MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.304 |
|
FLASH | FLASH | 8Mb (264 Bytes x 4096 pages) | SPI | 50MHz | 4ms | - | 2.5 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 8MBIT 66MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione142.764 |
|
FLASH | FLASH | 8Mb (264 Bytes x 4096 pages) | SPI | 66MHz | 4ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 8MBIT 50MHZ 8VDFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione4.672 |
|
FLASH | FLASH | 8Mb (264 Bytes x 4096 pages) | SPI | 50MHz | 4ms | - | 2.5 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-VDFN Exposed Pad | 8-VDFN (6x5) |
||
Microchip Technology |
IC FLASH 8MBIT 66MHZ 8VDFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione3.616 |
|
FLASH | FLASH | 8Mb (264 Bytes x 4096 pages) | SPI | 66MHz | 4ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-VDFN Exposed Pad | 8-VDFN (6x5) |
||
Microchip Technology |
IC EEPROM 512KBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione291.276 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 1MHz | 5ms | 900ns | 1.8 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 512KBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione257.340 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 1MHz | 5ms | 550ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 512KBIT 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione137.100 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 1MHz | 5ms | 900ns | 1.8 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 512KBIT 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.032 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 1MHz | 5ms | 550ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 512KBIT 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione98.316 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 1MHz | 5ms | 550ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 512KBIT 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.400 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 1MHz | 5ms | 900ns | 1.8 V ~ 3.6 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 32KBIT 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione240.936 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 32KBIT 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione3.920 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 32KBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.360 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 128KBIT 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione3.792 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 128KBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.984 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 128KBIT 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione10.344 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH 8MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione182.472 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 120µs | 70ns | 2.65 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC FLASH 8MBIT 70NS 48CBGA
|
pacchetto: 48-VFBGA, CSBGA |
Azione2.976 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 120µs | 70ns | 2.65 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 48-VFBGA, CSBGA | 48-CBGA (6x8) |
||
Microchip Technology |
IC FLASH 8MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione135.096 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 120µs | 70ns | 2.65 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC FLASH 8MBIT 70NS 48CBGA
|
pacchetto: 48-VFBGA, CSBGA |
Azione3.024 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 120µs | 70ns | 2.65 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 48-VFBGA, CSBGA | 48-CBGA (6x8) |
||
Microchip Technology |
IC EEPROM 512KBIT 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione43.632 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 1MHz | 5ms | 900ns | 1.8 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |