Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 1KBIT 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.832 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 1KBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione8.076 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 1KBIT 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.760 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 1KBIT 1MHZ SOT23-5
|
pacchetto: SOT-23-5 Thin, TSOT-23-5 |
Azione1.056.000 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | SOT-23-5 |
||
Microchip Technology |
IC EEPROM 1KBIT 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione13.680 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione7.872 |
|
EEPROM | EEPROM | 1Kb (128 x 8, 64 x 16) | SPI | 2MHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC FLASH 32MBIT 66MHZ 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione369.924 |
|
FLASH | FLASH | 32Mb (528 Bytes x 8192 pages) | SPI | 66MHz | 6ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC FLASH 32MBIT 66MHZ 8VDFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione173.172 |
|
FLASH | FLASH | 32Mb (528 Bytes x 8192 pages) | SPI | 66MHz | 6ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-VDFN Exposed Pad | 8-VDFN (6x5) |
||
Microchip Technology |
IC OTP 256KBIT 90NS 28SOIC
|
pacchetto: 28-SOIC (0.342", 8.69mm Width) |
Azione5.456 |
|
EPROM | EPROM - OTP | 256Kb (32K x 8) | Parallel | - | - | 90ns | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.342", 8.69mm Width) | 28-SOIC |
||
Microchip Technology |
IC OTP 256KBIT 55NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione5.088 |
|
EPROM | EPROM - OTP | 256Kb (32K x 8) | Parallel | - | - | 55ns | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC OTP 256KBIT 55NS 28SOIC
|
pacchetto: 28-SOIC (0.342", 8.69mm Width) |
Azione6.448 |
|
EPROM | EPROM - OTP | 256Kb (32K x 8) | Parallel | - | - | 55ns | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.342", 8.69mm Width) | 28-SOIC |
||
Microchip Technology |
IC OTP 256KBIT 55NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.672 |
|
EPROM | EPROM - OTP | 256Kb (32K x 8) | Parallel | - | - | 55ns | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 2MBIT 90NS 40DIP
|
pacchetto: 40-DIP (0.600", 15.24mm) |
Azione6.304 |
|
EPROM | EPROM - OTP | 2Mb (128K x 16) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
Microchip Technology |
IC OTP 4MBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.288 |
|
EPROM | EPROM - OTP | 4Mb (512K x 8) | Parallel | - | - | 120ns | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC FLASH 16MBIT 66MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione71.988 |
|
FLASH | FLASH | 16Mb (256 Bytes x 8192 pages) | SPI | 66MHz | 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 16MBIT 66MHZ 8VDFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione6.560 |
|
FLASH | FLASH | 16Mb (256 Bytes x 8192 pages) | SPI | 66MHz | 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-VDFN Exposed Pad | 8-VDFN (6x5) |
||
Microchip Technology |
IC FLASH 8MBIT 70MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione504.432 |
|
FLASH | FLASH | 8Mb (256 Bytes x 4096 pages) | SPI | 70MHz | 7µs, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 20MHZ 8MAP
|
pacchetto: 8-UDFN Exposed Pad |
Azione7.696 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UDFN Exposed Pad | 8-MAP (3x4.9) |
||
Microchip Technology |
IC EEPROM 128KBIT 20MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione8.952 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 20MHz | 5ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 128KBIT 20MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione4.912 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 8KBIT 20MHZ 8MAP
|
pacchetto: 8-UDFN Exposed Pad |
Azione3.616 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UDFN Exposed Pad | 8-MAP (3x4.9) |
||
Microchip Technology |
IC EEPROM 4KBIT 20MHZ 8MAP
|
pacchetto: 8-UDFN Exposed Pad |
Azione5.872 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UDFN Exposed Pad | 8-MAP (3x4.9) |
||
Microchip Technology |
IC EEPROM 1KBIT 20MHZ 8MAP
|
pacchetto: 8-UDFN Exposed Pad |
Azione4.752 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UDFN Exposed Pad | 8-MAP (3x4.9) |
||
Microchip Technology |
IC EEPROM 64KBIT 400KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione26.088 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.208 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 400kHz | 5ms | 900ns | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 32KBIT 400KHZ 8MINIMAP
|
pacchetto: 8-UFDFN Exposed Pad |
Azione103.068 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-Mini Map (2x3) |
||
Microchip Technology |
IC EEPROM 32KBIT 400KHZ 8MAP
|
pacchetto: 8-UDFN Exposed Pad |
Azione72.456 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UDFN Exposed Pad | 8-MAP (3x4.9) |
||
Microchip Technology |
IC EEPROM 32KBIT 400KHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione2.032 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |