Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC FLASH 16MBIT 70NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione2.656 |
|
FLASH | FLASH | 16Mb (1M x 16) | Parallel | - | 40µs | 70ns | 1.65 V ~ 1.95 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA |
||
Microchip Technology |
IC FLASH 16MBIT 70NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione7.008 |
|
FLASH | FLASH | 16Mb (1M x 16) | Parallel | - | 40µs | 70ns | 1.65 V ~ 1.95 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA |
||
Microchip Technology |
IC FLASH 16MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione5.952 |
|
FLASH | FLASH | 16Mb (1M x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC EEPROM 512KBIT 20MHZ 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione3.648 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 20MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 512KBIT 20MHZ 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione7.056 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC FLASH 32MBIT 104MHZ 8WDFN
|
pacchetto: 8-WDFN Exposed Pad |
Azione7.712 |
|
FLASH | FLASH | 32Mb (4M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (5x6) |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 32TSOP
|
pacchetto: 32-TFSOP (0.488", 12.40mm Width) |
Azione2.656 |
|
FLASH | FLASH | 4Mb (512K x 8) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC FLASH 32MBIT 104MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione3.584 |
|
FLASH | FLASH | 32Mb (4M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 128KBIT 20MHZ 8VFBGA
|
pacchetto: - |
Azione3.280 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | - | - | - |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 48WFBGA
|
pacchetto: 48-WFBGA |
Azione3.024 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 40µs | 70ns | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 48-WFBGA | 48-WFBGA (6x4) |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 32TSOP
|
pacchetto: 32-TFSOP (0.488", 12.40mm Width) |
Azione4.896 |
|
FLASH | FLASH | 4Mb (512K x 8) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC FLASH 32MBIT 104MHZ 8WDFN
|
pacchetto: 8-WDFN Exposed Pad |
Azione6.304 |
|
FLASH | FLASH | 32Mb (4M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (5x6) |
||
Microchip Technology |
IC FLASH 8MBIT 70NS 48WFBGA
|
pacchetto: 48-WFBGA |
Azione7.040 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 40µs | 70ns | 1.65 V ~ 1.95 V | 0°C ~ 70°C (TA) | Surface Mount | 48-WFBGA | 48-WFBGA (6x4) |
||
Microchip Technology |
IC EEPROM 512KBIT 20MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.512 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 20MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 48WFBGA
|
pacchetto: 48-WFBGA |
Azione2.320 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 40µs | 70ns | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 48-WFBGA | 48-WFBGA (6x4) |
||
Microchip Technology |
IC SRAM 512KBIT 20MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione3.776 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 512Kb (64K x 8) | SPI - Dual I/O | 20MHz | - | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 512KBIT 20MHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione10.992 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 20MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 512KBIT 20MHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione7.888 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 20MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC FLASH 8MBIT 55NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione7.392 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 20µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 48WFBGA
|
pacchetto: 48-WFBGA |
Azione6.144 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 40µs | 70ns | 1.65 V ~ 1.95 V | 0°C ~ 70°C (TA) | Surface Mount | 48-WFBGA | 48-WFBGA (6x4) |
||
Microchip Technology |
IC FLASH 8MBIT 70NS 48WFBGA
|
pacchetto: 48-WFBGA |
Azione7.664 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-WFBGA | 48-WFBGA (6x4) |
||
Microchip Technology |
IC FLASH 8MBIT 70NS 48WFBGA
|
pacchetto: 48-WFBGA |
Azione2.048 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-WFBGA | 48-WFBGA (6x4) |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione10.740 |
|
FLASH | FLASH | 4Mb (512K x 8) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.504 |
|
FLASH | FLASH | 4Mb (512K x 8) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 512KBIT 20MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.528 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 20MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione5.072 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 40µs | 70ns | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA |
||
Microchip Technology |
IC SRAM 512KBIT 20MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.448 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 512Kb (64K x 8) | SPI - Dual I/O | 20MHz | - | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 16MBIT 104MHZ 8TDFN
|
pacchetto: 8-WDFN Exposed Pad |
Azione5.616 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (5x6) |