Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC FLASH 4MBIT 70NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione5.856 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 40µs | 70ns | 1.65 V ~ 1.95 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA |
||
Microchip Technology |
IC FLASH 16MBIT 104MHZ 8CSP
|
pacchetto: 8-UFBGA, CSPBGA |
Azione7.824 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFBGA, CSPBGA | 8-CSP |
||
Microchip Technology |
IC EEPROM 64KBIT 400KHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione588.360 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 6.0 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 64KBIT 400KHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione98.400 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 6.0 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 64KBIT 400KHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione3.104 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 400kHz | 5ms | 900ns | 4.5 V ~ 6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 64KBIT 400KHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione4.848 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 400kHz | 5ms | 900ns | 4.5 V ~ 6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 64KBIT 400KHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione5.152 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 400kHz | 5ms | 900ns | 1.8 V ~ 6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 64KBIT 400KHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione4.144 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 400kHz | 5ms | 900ns | 1.8 V ~ 6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 512KBIT 10MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.080 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 10MHz | 5ms | - | 1.7 V ~ 3 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 512KBIT 10MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.144 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 10MHz | 5ms | - | 1.7 V ~ 3 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC FLASH 4MBIT 55NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione3.920 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 20µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA |
||
Microchip Technology |
IC FLASH 8MBIT 70NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione5.776 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 40µs | 70ns | 1.65 V ~ 1.95 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA |
||
Microchip Technology |
IC FLASH 8MBIT 70NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione12.552 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 40µs | 70ns | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA |
||
Microchip Technology |
IC FLASH 16MBIT 104MHZ 8WDFN
|
pacchetto: 8-WDFN Exposed Pad |
Azione5.520 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (5x6) |
||
Microchip Technology |
IC FLASH 4MBIT 55NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione3.600 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 20µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.328 |
|
FLASH | FLASH | 4Mb (512K x 8) | Parallel | - | 20µs | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC SRAM 512KBIT 20MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.568 |
|
SRAM | SRAM | 512Kb (64K x 8) | SPI - Quad I/O | 20MHz | - | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC SRAM 512KBIT 20MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.648 |
|
SRAM | SRAM | 512Kb (64K x 8) | SPI - Quad I/O | 20MHz | - | - | 1.7 V ~ 2.2 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC FLASH 16MBIT 80MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione36.000 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 80MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 512KBIT 400KHZ 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione35.436 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 512KBIT 400KHZ 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione10.032 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 512KBIT 1MHZ 8VFBGA
|
pacchetto: 8-VFBGA |
Azione13.536 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VFBGA | 8-VFBGA (1.5x2) |
||
Microchip Technology |
IC FLASH 16MBIT 80MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione7.248 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 80MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON |
||
Microchip Technology |
IC EEPROM 512KBIT 10MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.056 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 10MHz | 5ms | - | 1.7 V ~ 3 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SRAM 512KBIT 20MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.504 |
|
SRAM | SRAM | 512Kb (64K x 8) | SPI - Quad I/O | 20MHz | - | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SRAM 512KBIT 20MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.240 |
|
SRAM | SRAM | 512Kb (64K x 8) | SPI - Quad I/O | 20MHz | - | - | 1.7 V ~ 2.2 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 2MBIT 55NS 32TSOP
|
pacchetto: 32-TFSOP (0.488", 12.40mm Width) |
Azione4.176 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 20µs | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC FLASH 16MBIT 104MHZ 8WDFN
|
pacchetto: 8-WDFN Exposed Pad |
Azione6.080 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (5x6) |